1

SECURITIES AND EXCHANGE COMMISSION

WASHINGTON, D.C. 20549

Amendment No. 1 to

FORM 8-K

Dated April 21, 1999, as filed on April 26, 1999

CURRENT REPORT

PURSUANT TO SECTION 13 OR 15(d) OF
THE SECURITIES EXCHANGE ACT OF 1934

April 21, 1999
------------------------------------------------
Date of Report (Date of earliest event reported)

AMKOR TECHNOLOGY, INC.
------------------------------------------------------
(Exact name of Registrant as specified in its charter)

Delaware
----------------------------------------------
(State or other jurisdiction of incorporation)

0-29472                                       23-1722724
---------------------                  ------------------------------------
(Commission File No.)                  (IRS Employer Identification Number)

1345 Enterprise Drive
West Chester, PA 19380
(610) 431-9600
----------------------------------------
(Address of Principal Executive Offices)

-------------------------------------------------------------
(Former name or former address, if changed since last report)

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Item 2. ACQUISITION OR DISPOSITION OF ASSETS

We have acquired the assets, excluding cash and cash equivalents, notes
and accounts receivables, intercompany accounts and existing claims against
third parties, of the Kwangju packaging and test facility, known as K4, of Anam
Semiconductor, Inc. (the "Acquisition"). The purchase price for K4 was $575.0
million, plus the assumption of up to $7.0 million of employee benefit
liabilities. We used debt financing to pay the purchase price for K4. We
consummated the Acquisition on May 17, 1999. The asset purchase agreement for
the Acquisition is exhibit 2.1 to this report, and an amendment to this
agreement is exhibit 2.2 to this report. A press release issued by the Company
in connection with the consummation of the Acquisition is exhibit 99.1 to this
report.

Located in Kwangju, Korea, K4 is situated on approximately 100 acres and
currently consists of a 1,000,000 square foot facility, including 782,000 square
feet of manufacturing and administrative space. Opened in 1996, K4 has been
ramping up production throughout 1997 and 1998 and provides packaging and test
services for many of our most advanced packages. In addition, the K4 site has
the infrastructure in place to accommodate four pre-configured modules for a
total of 1.6 million square feet of incremental capacity.

In connection with the Acquisition, we entered into a Transition
Services Agreement with ASI. Pursuant to this agreement, ASI will continue to
provide many of the same services at K4 that it had provided prior to the
Acquisition, including human resources, accounting and general administrative
services and customer services. A copy of this agreement is attached hereto as
Exhibit 10.2.

We also entered into an Intellectual Property License Agreement with ASI
that became effective upon the closing of the Acquisition. Pursuant to this
agreement, ASI transferred certain patents to us and licensed certain
intellectual property rights to us under an exclusive, fully paid, perpetual
license. We licensed these patents and other rights back to ASI on a
non-exclusive basis. A copy of this agreement is attached hereto as Exhibit
10.1.

In connection with the Acquisition, we formed a special committee of our
Board of Directors consisting of the five non-employee members of our Board of
Directors. This special committee had the authority to review and approve the
Acquisition. In connection with the Acquisition, the special committee hired
financial and legal advisors. This special committee received a fairness opinion
from its financial advisor and approved the Acquisition.

To finance the purchase price of K4, on May 6, 1999, we completed a
private placement of $425 million of senior notes and $200 million of senior
subordinated notes. The senior notes mature in May 2006 and have a coupon rate
of 9.25%. The senior subordinated notes mature in May 2009 and have a coupon
rate of 10.50%. We must pay interest semi-annually in May and November for all
of the notes.

3

RELATIONSHIP WITH ASI

WHO IS ANAM SEMICONDUCTOR, INC.?

ASI is a Korean company engaged primarily in providing semiconductor
packaging and test services. ASI currently operates four semiconductor packaging
and test factories in Korea, including K4. ASI also operates a semiconductor
wafer foundry in Korea. ASI derives substantially all of its revenues from the
sale of its packaging and test services to us. ASI also derives all of its wafer
fabrication revenues from the sale of services to us.

We have a long-standing relationship with ASI. ASI was founded in 1956
by Mr. H. S. Kim, the father of Mr. James Kim, our Chairman and Chief Executive
Officer. Since January 1992, in addition to his other responsibilities, Mr.
James Kim has served as Chairman and a Director of ASI. For the years ended
December 31, 1996, 1997 and 1998, we derived 72%, 68% and 69% of our net
revenues and 51%, 42% and 49% of our gross profit from sales of services
performed for us by ASI.

In January 1998, we entered into new supply agreements with ASI. Under
these agreements, we retain a first right to substantially all of its packaging
and test services and the exclusive right to all of the output of its
semiconductor wafer foundry. We expect to continue to purchase substantially all
of ASI's packaging and test services and to purchase all of ASI's semiconductor
wafer output.

THE KOREAN FINANCIAL CRISIS

ASI has been severely affected by the economic crisis in Korea. In late
1997, Korea began to undergo a foreign currency liquidity crisis resulting in
significant adverse economic circumstances and significant depreciation in the
value of the won against the U.S. dollar. In order to address this situation,
the government of Korea sought assistance from the International Monetary Fund
and implemented a comprehensive policy intended to address the structural
weaknesses in the Korean economy and financial sector. While the reform policies
were intended to alleviate the economic difficulties and improve the economy
over time, in the short term, they have resulted in: (1) slower economic growth,
(2) a reduction in the availability of credit, (3) an increase in interest
rates, (4) an increase in taxes, (5) an increase in the rate of inflation, (6)
volatility in the value of the won, (7) an increase in the number of
bankruptcies of Korean corporate entities and (8) unrest resulting from a
significant increase in unemployment. Although the Korean economy recovered
somewhat in the latter half of 1998, these conditions and similar conditions in
other countries in the Asia Pacific region continue to pose a threat to the
economies of such countries and to the region as a whole.

ASI historically operated with a significant amount of debt relative to
its equity. The economic crisis in Korea led to sharply higher interest rates
and significantly reduced opportunities for refinancing maturing debts. Because
ASI maintained a substantial amount of short-term debt, its inability to
refinance this debt created a liquidity crisis for ASI. In addition to its own
leveraged financial position, ASI guarantees certain debt obligations of its
affiliates, many of which have encountered financial difficulties as a result of
the crisis.

ASI WORKOUT

In October 1998, ASI announced that it had applied for and was accepted
into the Korean financial restructuring program known as the "Workout." The
Workout program is the result of an accord among Korean financial institutions
to assist in the restructuring of Korean businesses and does not involve the
judicial system.

We expect the Workout to significantly improve the financial condition
of ASI. The Workout became effective in April 1999. The information setting
forth the details of the Workout is based on the exchange rate

4

of W1,207.8 to $1.00 that was in effect as of December 31, 1998. The Workout
contains the following provisions:

o The creditor financial institutions will allow ASI to defer repayment on
principal of ordinary loans until December 31, 2003. After December 31, 2003,
ordinary loans with repayment terms will be payable through readjustment of
repayment schedules in effect on October 24, 1998. For ordinary loans without
repayment terms, the schedule to repay principal amounts will be determined by
ASI and the creditor financial institutions at the end of such period.

o The creditor financial institutions will allow ASI to defer repayment of
principal under capital leases until December 31, 1999, with payments of
principal to resume under a seven-year installment plan thereafter.

o The creditor financial institutions will allow ASI to defer the maturity of
its won-denominated debentures for an additional three-year term after
currently scheduled maturity dates.

o The creditor financial institutions will allow ASI to make no interest
payments on ordinary loans until December 31, 1999. The creditor financial
institutions will add accrued interest to the principal amounts of these loans
every three months.

o The creditor financial institutions will reduce interest rates on ASI's
remaining outstanding won-denominated ordinary loans to 10% or the prime rate
of each creditor financial institution, whichever is greater. This would
reduce ASI's weighted average interest rate from 12.9% before the Workout to
10.5% after the Workout.

o The creditor financial institutions will give ASI a grace period until
December 31, 2003 against enforcement of guarantees made by ASI for
liabilities of ASI's affiliates. In addition, interest will not accrue on
guaranteed obligations during this period.

o The creditor financial institutions will provide to ASI a short-term loan of
W50 billion ($41 million) at the prime rate plus 1%, to be repaid with
proceeds from the sale of K4.

o The creditor financial institutions may receive additional payments if ASI's
financial performance exceeds expectations.

o For the duration of the Workout, the creditor financial institutions will be
entitled to vote the ASI shares owned by Mr. James Kim and his family.

o The creditor financial institutions will convert W250 billion ($208 million)
of ASI debt held by the creditor financial institutions into: (1) equity
shares of ASI in the amount of W122.3 billion ($102 million), (2) five-year
non-interest bearing convertible debt in the amount of W108.1 billion ($90
million) and (3) non-interest bearing loans in the amount of W19.6 billion
($16 million), provided that we make a $150 million equity investment in ASI.
The conversion would take place in installments over four years, with the
first installment to be made in October 1999, at a conversion rate equal to
W5,000 per share, the par value of ASI's common stock. In order for the
initial conversion of debt to take place in accordance with the terms of the
Workout, ASI will have to undergo a series of corporate actions, including a
reverse stock split, to bring the fair market value of its equity shares to a
price at least equal to the par value of such shares. The conversion of ASI
debt by the creditor financial institutions would coincide with each
installment of our equity investment in ASI.

We have executed a letter with ASI committing to make the equity
investment in installments of $41 million in each of 1999, 2000 and 2001 and $27
million in 2002. Our commitment to invest in ASI is subject to: (1) execution of
a definitive stock purchase agreement, (2) concurrent conversion of debt by the
creditor financial institutions, (3) the Workout remaining in effect and (4) the
supply agreements between our company and ASI remaining in effect. We would
purchase the ASI shares at W5,000 per share. Because our commitment is in U.S.
dollars, the number of shares we would purchase will vary based on the exchange
rate of Korean won to U.S. dollars.

5
Upon completion of the first installment of our equity investment in ASI
and conversion of debt by the creditor financial institutions, we expect the
relative equity ownership of ASI among the creditor financial institutions, the
Kim family and our company to be approximately 27%, 21% and 21%, respectively,
subject to the creditor financial institutions' right to vote the Kim family's
stock for the duration of the Workout. Upon completion of all conversions of
debt by the creditor financial institutions and all installments of our equity
investment pursuant to the Workout, we expect the relative equity ownership of
ASI among the creditor financial institutions, the Kim family and our company to
be approximately 29%, 11% and 43%, respectively, subject to the creditor
financial institutions' voting rights. Upon conversion of all of the convertible
debt issued to the creditor financial institutions, which would be permitted
beginning one year after the date of issuance of such debt, the ownership of ASI
among the credit or financial institutions, the Kim family and our company would
be approximately 43%, 9% and 34%, respectively, subject to the creditor
financial institutions' voting rights.

The creditor financial institutions have the right to terminate or
modify the Workout if ASI does not fulfill the terms of the Workout, including
meeting certain financial targets. In addition, the creditor financial
institutions can modify the terms of the Workout upon agreement of creditor
financial institutions holding at least 75% of the debt restructured under the
Workout. If the creditor financial institutions subsequently terminate the
Workout, the creditor financial institutions could reinstate and enforce the
original terms of ASI's debt, including accelerating ASI's obligations and
pursuing ASI's guarantees of its affiliates' debt. If this were to occur, ASI's
and our businesses would be harmed.

RELATIONSHIP WITH ASI FOLLOWING THE WORKOUT AND THE ACQUISITION OF K4

We expect ASI to continue to be important to our business in the future.
Under our supply agreements with ASI, we have a first right to substantially all
of the packaging and test services of ASI and the exclusive right to all of the
wafer output of ASI's wafer foundry. The supply agreements have a five-year
term, expiring December 31, 2002, and may be terminated by either party upon
five years' written notice after completion of the initial five year term. The
supply agreements may also be terminated upon breach or insolvency of either
party. We expect to continue to have certain contractual and other business
relationships with ASI, including those under the supply agreements. The supply
agreements generally provide for continued cooperation between our company and
ASI in research and development, as well as cross-licensing of intellectual
property rights. The supply agreements also provide for continued capital
investment by ASI based on our forecasts. It is not certain whether the Workout
will be sufficient to enable ASI to continue to provide services to our company
at current levels or to obtain funds for capital expansion.

As described above, concurrent with the completion of the Acquisition,
we entered into a transition services agreement and an intellectual property
licensing agreement with ASI.

Our company and ASI will also continue to have close ties due to our
overlapping ownership and management. We expect that Mr. James Kim will continue
to serve as Chairman of ASI and as our Chairman and Chief Executive Officer. The
Kim family currently beneficially owns approximately 65.8% of our outstanding
common stock and approximately 40.7% of ASI's common stock. Both our investment
in ASI and the conversion of debt to equity will substantially decrease the Kim
Family's ownership in ASI. Furthermore, for the duration of the Workout, the
creditor financial institutions will be entitled to vote the ASI shares owned by
Mr. James Kim and his family. Even though the Kim family's ownership of ASI will
be reduced and the voting rights in their ASI shares assigned to the creditor
financial institutions, we believe that the Kim family will continue to exercise
significant influence over our company, ASI and its affiliates.

We have also entered into agreements with ASI and Texas Instruments,
Inc. relating to our wafer fabrication business. In addition, we may engage in
other transactions with ASI from time to time that are material to us. To
provide you with additional information about our relationship with ASI, we
hereby incorporate by reference to our Annual Report on Form 10-K filed on March
31, 1999 Part III, Item 13, "Certain Relationships and Related Transactions,"
into this Report.

The indentures entered into in connection with our financing of the
acquisition of K4 (Exhibits 4.1 and 4.2 to this Report) restrict our
ability to enter into transactions with ASI and other affiliates.

6

ASI CONSOLIDATED CONDENSED FINANCIAL INFORMATION

The following is a summary of the audited consolidated financial
information pertaining to ASI. The financial information is prepared in
accordance with Korean GAAP, which differs significantly from U.S. GAAP. U.S.
GAAP financial statements are not available.

YEAR ENDED DECEMBER 31,
------------------------
1997          1998
----------    ----------
(IN MILLIONS)

INCOME STATEMENT DATA:
Sales.......................................................  W1,786,457    W2,547,326
Gross profit............................................     279,186       201,926
Operating income........................................     176,028        77,734
Interest expense, net.......................................     113,066       313,971
Foreign exchange (gains) losses, net, loss from forward
contract and amortization of deferred charges.............     345,232      (182,958)
(Gains) from sale of investments............................      (3,473)      (89,397)
Loss on valuation of inventories............................         724        24,150
Other, net..................................................      12,192        11,041
----------    ----------
Total non-operating (income) expense, net...........     467,741        76,807
----------    ----------
Ordinary income (loss) before income taxes and
extraordinary items....................................    (291,713)          927
Income tax..................................................       7,922         2,063
Extraordinary losses, net...................................       1,039       193,571
Minority interests..........................................      (1,206)      (72,049)
Equity in losses of affiliates..............................      49,261        18,830
----------    ----------
Net loss................................................  W (348,729)   W (141,488)
==========    ==========
OTHER FINANCIAL DATA:
Depreciation expense........................................   W 137,989     W 311,461

DECEMBER 31
------------------------
1997          1998
----------    ----------
(IN MILLIONS)

BALANCE SHEET DATA (AT END OF PERIOD):
ASSETS
Cash and bank deposits....................................   W 215,024     W  37,969
Trade accounts and notes receivable, net..................     189,522       144,501
Inventories...............................................     260,302       183,786
Short-term loans to affiliates............................      62,846       188,188
Other current assets......................................     179,119        95,921
----------    ----------
Total current assets....................................     906,813       650,365
----------    ----------
Property, plant and equipment, net........................   2,159,466     2,284,263
Investments...............................................     121,880        72,136
Long-term trade accounts receivable.......................     203,739        18,876
Other long-term assets....................................     544,132       276,656
----------    ----------
Total long-term assets..................................   3,029,217     2,651,931
----------    ----------
Total assets........................................  W3,936,030    W3,302,296
==========    ==========
LIABILITIES AND SHAREHOLDERS' EQUITY
Short-term borrowings.....................................  W1,720,916    W1,351,919
Current maturities of long-term debt......................     120,913       249,526
Provision for loss contingencies related to affiliate
companies...............................................          --       190,000
Other current liabilities.................................     282,653       270,895
----------    ----------
Total current liabilities...............................   2,124,482     2,062,340
----------    ----------
Long-term debt, net of current maturities.................     736,784       494,867
Long-term obligations under capital leases................     861,813       661,286
Other long-term liabilities...............................     111,017       112,938
----------    ----------
Total long-term liabilities.............................   1,709,614     1,269,091
----------    ----------
Total liabilities.......................................   3,834,096     3,331,431
----------    ----------
Minority interests in consolidated subsidiaries...........      25,160        21,538
Shareholders' equity(deficit).............................      76,774       (50,673)
----------    ----------
Total liabilities and shareholders' equity (deficit)....  W3,936,030    W3,302,296
==========    ==========

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Beginning in late 1997 and continuing into 1998, Korea experienced
severe economic instability as well as devaluation of the Korean won relative to
the U.S. dollar. The exchange rate as of December 31, 1996, was W884 to $1.00 as
compared to W1,415 to $1.00 as of December 31, 1997 and W1,207 to $1.00 as of
December 31, 1998. No representation is made that the won or U.S. dollar amounts
referred to herein could have been or could be converted into U.S. dollars or
won, as the case may be, at any particular rate or at all.

A significant amount of the current and long-term liabilities of ASI are
denominated in U.S. dollars and other foreign currencies. At December 31, 1998,
the amount of U.S. dollar and other foreign currency denominated short-term
borrowings, current maturities of long-term debt, long-term debt (net of current
maturities) and capital lease obligations were W436 billion, W35 billion, W103
billion and W686 billion, respectively. A substantial amount of ASI's revenues
are denominated in U.S. dollars which mitigates ASI's exposure to currency
fluctuations.

As of December 31, 1998, ASI was contingently liable under guarantees in
respect of debt of ASI's affiliates in the Anam Group in the aggregate amount of
approximately W455 billion. If any affiliates of ASI were to fail to make
interest or principal payments or otherwise default under their debt obligations
then, pursuant to the Workout, creditors could not seek to enforce the
guarantees provided by ASI until December 31, 2003.

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Item 7. FINANCIAL STATEMENTS AND EXHIBITS.

The following financial statements and exhibits are filed as part of
this Report:

(a) Financial statements of K4 for the year ended December 31, 1998
were previously filed with this report on April 26, 1999.

(b) Pro forma financial information for the year ended December 31,
1998 was previously filed with this report on April 26, 1999.

(c) Exhibits in accordance with Item 601 of Regulation S-K:

EXHIBIT
NUMBER                                DESCRIPTION

2.1         Asset Purchase Agreement by and between Amkor Technology Inc. and
Anam Semiconductor Inc., dated December 30, 1998.*

2.2         Amendment to Asset Purchase Agreement by and between Amkor Technology
Inc. and Anam Semiconductor Inc.

4.1         Indenture dated as of May 13, 1999 and form of Senior Note.**

4.2         Indenture dated as of May 13, 1999 and form of Senior
Subordinated Note.**

10.1         Intellectual Property Transfer and License Agreement by and between
Amkor Technology Inc. and Anam Semiconductor Inc.

10.2         Transition Services Agreement by and between Amkor Technology Inc.
and Anam Semiconductor Inc.

23.1         Consent of Samil Accounting Corporation.

99.1         Press release dated April 21, 1999.***

99.2         Press release dated May 17, 1999.

- --------------------------------------------------------------------------------

* Incorporated by reference to the Company's Annual Report on Form 10-K filed
March 31, 1999.

** Incorporated by reference to the Company's quarterly Report on Form 10-Q
filed May 17, 1999.

*** Previously filed with this report.

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SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized.

AMKOR TECHNOLOGY, INC.

By: /s/ Frank J. Marcucci
---------------------------------
Frank J. Marcucci
Chief Financial Officer

Dated:  June 1, 1999

10

=================================

SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549

EXHIBITS

TO

FORM 8-K

CURRENT REPORT PURSUANT TO SECTION 13 OR 15(d)
OF
THE SECURITIES EXCHANGE ACT OF 1934

----------

AMKOR TECHNOLOGY, INC.

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=================================

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INDEX TO EXHIBITS

EXHIBIT
NUMBER                         DESCRIPTION
------                         -----------

2.1         Asset Purchase Agreement by and between Amkor Technology Inc. and
Anam Semiconductor Inc., dated December 30, 1998.*

2.2         Amendment to Asset Purchase Agreement by and between Amkor Technology
Inc. and Anam Semiconductor Inc.

4.1         Indenture dated as of May 13, 1999 and form of Senior Note.**

4.2         Indenture dated as of May 13, 1999 and form of Senior
Subordinated Note.**

10.1         Intellectual Property Transfer and License Agreement by and between
Amkor Technology Inc. and Anam Semiconductor Inc.

10.2         Transition Services Agreement by and between Amkor Technology Inc.
and Anam Semiconductor Inc.

23.1         Consent of Samil Accounting Corporation.

99.1         Press release dated April 21, 1999.***

99.2         Press release dated May 17, 1999.

- --------------------------------------------------------------------------------

* Incorporated by reference to the Company's Annual Report on Form 10-K filed
March 31, 1999.

** Incorporated by reference to the Company's quarterly Report on Form 10-Q
filed May 17, 1999.

*** Previously filed with this report.

1

EXHIBIT 2.2

[EXECUTION COPY]

AMENDMENT

TO

ASSET PURCHASE AGREEMENT

BY AND BETWEEN

AMKOR TECHNOLOGY, INC.

as Purchaser

AND

ANAM SEMICONDUCTOR, INC.

as Seller

Dated as of May 6, 1999

2

AMENDMENT TO ASSET PURCHASE AGREEMENT

This is AMENDMENT TO ASSET PURCHASE AGREEMENT (the "Amendment"), dated
May 6, 1999 by and between Amkor Technology, Inc., a corporation organized under
the laws of the State of Delaware of the United States, ("Amkor" or "Purchaser")
and Anam Semiconductor, Inc., a corporation organized under the laws of the
Republic of Korea ("Seller"). Purchaser and Seller shall sometimes each be
referred to as a Party and collectively as the Parties.

RECITALS:

WHEREAS, Seller and Purchaser entered into an Asset Purchase Agreement dated
December 30, 1998 (the "Original Agreement") under which Seller agreed to sell
and Purchaser agreed to purchase the semiconductor packaging and test operations
generally known as K4 located at Advanced Science & Industrial Complex, 2 block,
Daechon-dong, Buk-gu, City of Kwangju 500-470 the Republic of Korea
("Business");

WHEREAS, it is Seller's intention that it will use the proceeds from the sale of
K4, upon Closing, primarily for the repayment of its debt to its Korean
creditors, including certain banks and other forms of financial institutions in
Korea (the "Workout Banks"); and

WHEREAS, both Parties desires to make changes to certain sections of the
Original Agreement by entering in an amendment in accordance with Section 5.7 of
the Original Agreement.

NOW THEREFORE, in consideration of the mutual agreements, covenants,
representations and warranties contained herein, and in reliance thereon,
Purchaser and Seller hereby agree as follows:

DEFINITIONS:

Unless specifically defined otherwise herein, the terms defined herein
shall have the same meanings as they were used in the Original Agreement.

AMENDMENTS OF CERTAIN DEFINITIONS

The definition of "IP Licensing Agreements" in the Original Agreement
(on page 4 of the Original Agreement) is hereby deleted and the following shall
be substituted therefor:

3
-3-

"IP Assignment and Licensing Agreements" have the meaning as described
in the paragraph immediately following Section 1.1(h) of this Amendment.

The definition of "Base Rate" in the Original Agreement (on page 2 of
the Original Agreement) is hereby deleted.

1.1.   Amendment of Section 1.1. "Sale and Purchase of Assets" of the
Original Agreement.

The paragraph immediately following Section 1.1(h) of the Original
Agreement (on page 9 of the Original Agreement) is hereby deleted and the
following shall be substituted therefor:

"The Parties agree that certain Intellectual Properties (including
Licensed Intellectual Property) which are identified in Schedule 2.16 as
the Assigned Intellectual Property shall be assigned to Purchaser
hereunder, while the Intellectual Properties which are identified in
Schedule 2.16 as the Licensed Intellectual Properties shall be licensed
to Purchaser rather than being assigned to Purchaser. With respect to
the Assigned Intellectual Properties, to the extent legally and/or
contractually permissible, Seller shall sell, transfer, convey and
assign to Purchaser, free and clear of all Liens of every kind, nature
and description, all right, title and interest of Seller in and to such
Intellectual Properties. Immediately after the assignment of the
Assigned Intellectual Properties, however, Purchaser shall grant to
Seller, an irrevocable, worldwide, non-exclusive, perpetual, paid-up,
royalty-free and transferable (and sub-licensable) license (or
sub-license) to utilize such Assigned Intellectual Properties (including
the Licensed Intellectual Property), after obtaining any and all
consents necessary therefor for Seller to be able to operate the other
businesses of Seller substantially in the manner as such businesses were
operated by Seller. With respect to the Licensed Intellectual
Properties, to the extent legally and/or contractually permissible,
Seller hereby shall grant to Purchaser and its Affiliates, effective at
the Closing Date, an irrevocable, worldwide, non-exclusive, perpetual,
paid-up, royalty-free and transferable (and sub-licensable) license (or
sub-license) to utilize such Intellectual Properties (including the
Licensed Intellectual Property) which Seller has rights to use as of the
Closing Date, after obtaining any and all consents necessary therefor
for Purchaser to be able to operate the Business substantially in the
manner as such Business was operated by Seller. For this purpose,
Purchaser shall enter into one or more assignment and licensing
agreements (the "IP Assignment and

4
-4-

Licensing Agreements") with the holders of relevant Intellectual
Properties, including Seller itself, prior to the Closing. All costs, if
any, shall be payable by Seller to any third parties in connection with
the transfer, licenses or sub-licenses for the benefit of Purchaser
pursuant to this Agreement."

1.3.   Amendment of Section 1.3. "Purchase Price" of the Original
Agreement2Amendment of Section 1.3. "Purchase Price" of the
Original Agreement.

(a) Section 1.3(a) of the Original Agreement (on page 11 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:

"The total aggregate purchase price for the Purchased Assets exclusive
of VAT shall be US$575,000,000 (the "Purchase Price") plus the Assumed
Liabilities."

(b) Section 1.3(b) of the Original Agreement (on page 11 of the
Original Agreement) is hereby deleted.

(c) Immediately following the first paragraph in Section 1.3(c) of the
Original Agreement (on pages 11 of the Original Agreement), the following shall
be added:

"In the event that such ruling by the Korean tax authority shall be
issued to the effect that the transaction contemplated hereunder and
under the Original Agreement shall be VAT-payable, Purchaser shall pay
the amount equal to the Purchase Price to Seller at Closing, out of
which Seller shall pay the VAT amount to be payable in accordance with
the relevant VAT law of Korea ("Payable VAT") to the relevant Korean tax
authority when due, and shall immediately provide a copy of the receipt
to Purchaser. When Purchaser actually receives the refund of the VAT in
the amount of the Payable VAT from the relevant tax office, Purchaser
shall immediately deposit the same amount to an Escrow Account or a bank
account designated by Seller's creditor banks for the repayment of debt
by Seller to its creditor banks. Deposit by Purchaser of the refunded
VAT shall discharge ATK's obligation to pay the Purchase Price
irrespective of whether such refunded VAT amount is less than Payable
VAT.

In the event that the ruling by the Korean tax authority shall be issued
to the effect that the transaction contemplated hereunder and under the
Original Agreement shall be VAT-exempt, Purchaser shall not withhold any
amount from the Purchase Price in connection with the VAT."

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(d) Section 1.3(d) of the Original Agreement (on pages 12 through 13 of
the Original Agreement) is hereby deleted in its entirety and the following
shall be substituted therefor:

"(d) On or prior to the Closing Date, Seller, Purchaser and an
escrow agent to be appointed by mutual consent of Seller and Purchaser
("Escrow Agent") shall enter into one or more escrow agreements ("Escrow
Agreements") in such form and substance to be mutually agreed by the
Parties. Such portion of the Purchase Price as provided in Section
1.4(b) shall be deposited with one or more escrow accounts ("Escrow
Accounts") to assure the repayment of certain liabilities by Seller, and
released to its creditors in accordance with the terms of the Escrow
Agreements."

1.4.   Amendment of Section 1.4. "Payment of Purchase Price" of the
Original Agreement2Amendment of Section 1.4. "Payment of Purchase
Price" of the Original Agreement.

(a) Section 1.4(a) of the Original Agreement (on page 12 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:

"(a) Purchaser's payment at the Closing of the amount which shall
be set forth in Schedule 1.4(a), by wire transfer or delivery of a
certified bank check immediately available and in accordance with the
instructions of Seller;"

(b) Section 1.4(b) of the Original Agreement (on page 12 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:

"(b) Purchaser's deposit at the Closing into an Escrow Account of
the amount which shall be set forth in Schedule 1.4(b);"

(c) Section 1.4(c) of the Original Agreement (on page 12 of the
Original Agreement) is hereby deleted.

1.6    Amendment of Section 1.6 "Adjustments to Purchase Price" of the
Original Agreement.

(b) Section 1.6.(b) of the Original Agreement (on pages 13 through 14)
is hereby deleted and the following shall be replaced therefor:

"(b) Adjustment Formula.

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If the Net Asset Value at the Closing Date is less than the Net
Asset Value as of the Balance Sheet Date (without considering the
depreciation between the Closing Date and the Balance Sheet Date), then,
the Purchase Price shall be reduced by the amount of such deficiency
accordingly. In order to give effect to any such reduction, the
Purchaser, at the Purchaser's option, may demand Seller to compensate
for such deficiency by requiring payments or delivery of additional
assets having values equivalent to such deficiency within 15 days from
the date of discovery of such deficiency by the Purchaser, or,
alternatively, withholding of such deficient amount from any amount
owing to Seller by Purchaser or its Affiliates to the extent permissible
under Korean law."
2
1.8.   Amendment of Section 1.8 "Conditions to Each Party's Obligations"
of the Original Agreement.

(a) The first sentence of Section 1.8(a) of the Original Agreement (on
page 16 of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:

"(a) The Escrow Agreement, the IP Assignment and Licensing
Agreements (or any equivalent thereof), the Transition Service
Agreement, the assignment agreement provided in Section 1.10(b) hereof,
and any other agreements, if any, necessary to vest in Purchaser good,
valid and marketable title to the Purchased Assets (collectively, the
"Ancillary Agreements") have been duly executed and delivered after
having been duly authorized by all necessary corporate actions by the
relevant parties thereto."

1.10   Amendment of Section 1.10 "Conditions to Purchaser's Obligations"
of the Original Agreement.

(h) Section 1.10(h) of the Original Agreement (on page 19 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:

"(h) After (i) Amkor shall have been satisfied with the results
of their due diligence, (ii) Amkor shall have entered into an
arrangement satisfactory to Amkor in its sole discretion, to finance the
Purchase Price in full, (iii) Amkor shall have received a fairness
opinion with respect to the terms of the transactions contemplated by
this Agreement, (iv) Amkor shall have received a tax exemption under the
Foreign Capital Promotion Law in regard to its purchase of the Business
("Tax Exemption"), and (v) the Board of Directors of Amkor shall have

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determined that the transactions contemplated herein are in the best
interest of Amkor and Purchaser in light of all circumstances associated
with Seller and the transactions contemplated hereby."

(i) Section 1.10(i) of the Original Agreement (on page 19 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:

"(i) Purchaser shall have a right of first refusal if Seller
intends to sell any of K1, K2, K3 or the wafer fabrication facilities to
any third party;"

1.11.  Amendment of Section 1.11 "Closing" of the Original Agreement.

Section 1.11 of the Original Agreement (on page 20 of the Original
Agreement) is hereby deleted and the following shall be substituted therefor:

"The closing under this Agreement will take place at such other time,
date or place as the Parties shall mutually agree (the "Closing"). The
date on which Closing occurs is sometimes referred to herein as the
"Closing Date."
1.12. Amendment of Section 1.12 "Deliveries and Proceedings at 2
1.12. Amendment of Section 1.12 "Deliveries and Proceedings at Closing"
of the Original Agreement.

(b) Section 1.12(b)(i) and (ii) of the Original Agreement (on page 21
of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:

"(i) payment of the amount stated in Schedule 1.4(a);

(ii) a certificate evidencing the deposit of the amount stated in
Schedules 1.4(b) with the Escrow Account;"

2.6. Amendment of Section 2.6. "No Changes" of the Original Agreement.

The second sentence of Section 2.6 of the Original Agreement (on page 27
of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:

"Without limiting the generality of the foregoing sentence, there has
not been:"

2.13.  Amendment of Section 2.13. "Consent" of the Original

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Agreement.

The reference of "Schedule 2.10" in Section 2.13 of the Original
Agreement (on page 36 of the Original Agreement) is hereby deleted and "Schedule
2.13" shall be substituted therefor.

2.22.  Amendment of Section 2.22. "Insurance" of the Original Agreement.

The entire paragraph under Section 2.22 of the Original Agreement (on
pages 42 through 43 of the Original Agreement) is hereby deleted and the
following shall be substituted therefor:

"Attached hereto as Schedule 2.22 is a complete and correct list of all
policies of insurance relating to the Business or the Purchased Assets
of which Seller is the owner, insured or beneficiary, or covering any of
the property of the Business, true, correct and complete copies of which
have been delivered to Purchaser, indicating for each policy the
carrier, the insured, type of coverage, the amounts of coverage,
deductible, premium rate, cash value if any, expiration date and any
pending claims thereunder. All such policies are in full force and
effect. The coverage provided by such policies are reasonable, in both
scope and amount, in light of the risks attendant to the Business and
the Purchased Assets. Seller has paid-in-full all premiums due on such
policies as of the Closing Date. There is no default with respect to any
provision contained in any such policy, nor has there been any failure
to give any notice or present any claim under any such policy in a
timely fashion or in the manner or detail required by the policy. Except
as set forth on Schedule 2.22, there are no outstanding unpaid premiums
or claims under such policies. No notice of cancellation or non-renewal
with respect to, or disallowance of any claim under, any such policy has
been received by Seller. Except as set forth on Schedule 2.22, Seller
has not been refused any insurance, nor has its coverage been limited by
any insurance carrier to which it has applied for insurance or with
which it has carried insurance during the last five years."

4.2 Amendment of Section 4.2 "Employees of the Business" of the Original
Agreement.2

4.2    Amendment of Section 4.2 "Employees of the Business" of the
Original Agreement.

The first sentence under Section 4.2(b) of the Original Agreement (on
page 46 of the Original Agreement) is hereby deleted and the following shall be
substituted

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therefor:

"With respect to the Transferred Employees who elect to terminate their
employment with Seller and commence new employment relation with
Purchaser, Seller shall pay, in a timely manner in accordance with the
requirements of the Labor Standards Act and current company practices,
all salary, bonuses, allowances, severance, unused leave (including the
pro rata portion of accrued but unused leave attributable to the portion
of the 1999 calendar year prior to closing) and any other monetary
obligations or claims relating to the Transferred Employees' employment
with Seller or its Affiliates that may have accrued to those personnel
prior to their separation."

4.7    Amendment of Section 4.7 "Transition Services" of the Original
Agreement.

The entire paragraph under Section 4.7(a) of the Original Agreement (on
page 53 of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:

"(a) During a certain period from the Closing Date (the "Transition
Period") to be separately agreed by the Parties, Seller shall ensure
that the Business is continued to be provided with all of the services
and parts and components currently provided to the Business by Seller or
any Person affiliated with Seller including, among other things, the
research and development, accounting, data processing, materials
procurement, electronic data processing, administrative services and all
other such support services as are reasonably required in connection
with the operation of the Business, on the terms and conditions not less
favorable than the terms and conditions pursuant to which such services
and parts and components are now being provided to the Business.
Purchaser shall pay a reasonable fee for the services to be provided by
Seller during the Transition Period, as mutually agreed by the Parties.
Prior to the Closing, Seller and Purchaser shall enter into a service
agreement ("Transition Service Agreement") to ensure such continued
services during the Transition Period, in such form and substance as
attached hereto as Schedule 4.7."

5.11   Amendment of Section 5.11 "Arbitration" of the Original
Agreement.

Section 5.11 (a) of the Original Agreement (on page 59 of the Original
Agreement) is hereby deleted in its entirety and the following shall be
substituted therefor.

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"(a) Any dispute arising under this Agreement which is not
settled after good faith attempts by the Parties to amicably resolve
such dispute shall be resolved by final and binding arbitration. The
arbitration shall be held in Seoul, Korea if the arbitration is brought
by Purchaser and in [San Francisco, C.A.], United States of America if
the arbitration is brought by Seller in accordance with the Rules of
Conciliation and Arbitration of the International Chamber of Commerce
("ICC Rules") as then existing and shall be heard and determined by an
arbitral tribunal composed of three (3) arbitrators. Each of the Parties
shall appoint one arbitrator each, and both of such arbitrators shall
appoint a third arbitrator who shall serve as the Chairman of such
arbitral tribunal, provided that such third arbitrator is not a citizen
of the U.S.A. or Korea. If either Party fails or decides against
appointing an arbitrator within a period of thirty (30) days of the
appointment of the first arbitrator, or if the arbitrators designated by
the Parties fail or otherwise are unable to appoint the third arbitrator
within (30) days of the appointment of the second arbitrator, then the
remaining arbitrator(s) shall be selected by the President of the
International Chamber of Commerce, U.S.A., which shall act as the
appointing authority."

11

IN WITNESS WHEREOF, the Parties have caused this AMENDMENT to be signed in their
respective names by an officer thereof duly authorized as of the date first
above written.

Amkor Technology, Inc.

By:________________________
Name:
Title:

Anam Semiconductor, Inc.

By:________________________
Name:
Title:

1
EXHIBIT 10.1

INTELLECTUAL PROPERTY TRANSFER AND LICENSE AGREEMENT

THIS INTELLECTUAL PROPERTY TRANSFER AND LICENSE AGREEMENT (the
"Agreement") is entered into effective as of May 6, 1999 (the "Effective Date"),
by and between Amkor Technology Korea, Inc. ("Amkor"), a corporation organized
under the laws of the Republic of Korea, and Anam Semiconductor, Inc. ("Anam"),
a corporation organized under the laws of the Republic of Korea and having
offices in Seoul, Korea (each of Amkor and Anam, a "Party"; together, the
"Parties").

W I T N E S S E T H:

WHEREAS, the Parties have entered into that certain "Asset Purchase
Agreement" dated as of December 30, 1998, pursuant to which Amkor shall acquire
from Anam certain assets related to Anam's K4 packaging facility;

WHEREAS, In connection with such acquisition, Amkor will acquire certain
intellectual property rights and license certain other intellectual property
rights from Anam;

WHEREAS, Anam will license from Amkor certain intellectual property
rights.

NOW, THEREFORE, in consideration of the mutual covenants and promises
contained herein, the Parties hereby agree as follows:

ARTICLE 1.
CONSTRUCTION AND DEFINITIONS

SECTION 1.1. Construction.

(a) All references in this Agreement to "Articles," "Sections"
and "Exhibits" refer to the articles, sections and exhibits of this Agreement.

(b) As used in this Agreement, neutral pronouns and any
variations thereof shall be deemed to include the feminine and masculine and all
terms used in the singular shall be deemed to include the plural, and vice
versa, as the context may require.

(c) The words "hereof," "herein" and "hereunder" and other words
of similar import refer to this Agreement as a whole, as the same may from time
to time be amended or supplemented, and not to any subdivision contained in this
Agreement.

(d) The word "including" when used herein is not intended to be
exclusive and means "including, without limitation."

SECTION 1.2. Definitions. As used herein:

(a) "Anam Facilities" means Anam's "K1," "K2" and "K3"
semiconductor packaging facilities located in and around Seoul, Korea.

2

(b) "Bankruptcy Event" means any of the following events or
circumstances with respect to a Party: such Party (i) ceases conducting its
business; (ii) makes a general assignment for the benefit of its creditors;
(iii) petitions, applies for, or suffers or permits with or without its consent
the appointment of a custodian, receiver, trustee in bankruptcy or similar
officer for all or any substantial part of its business or assets; or (iv)
avails itself or becomes subject to any proceeding under the U.S. Bankruptcy
Code or any similar state, federal or foreign statute relating to bankruptcy,
insolvency, reorganization, receivership, arrangement, adjustment of debts,
dissolution or liquidation, which proceeding is not dismissed within sixty (60)
days of commencement thereof.

(c) "Change of Control" means, with respect to a Party: (A) the
direct or indirect acquisition of either (i) the majority of the voting stock of
such Party or (ii) all or substantially all of the assets of such Party, by
another entity in a single transaction or series of related transactions; or (B)
such Party is merged with, or into, another entity.

(d) "Confidential Information" means (i) any information
disclosed by one Party (the "Disclosing Party") to the other (the "Receiving
Party"), which, if in written, graphic, machine-readable or other tangible form
is marked as "Confidential" or "Proprietary", or which, if disclosed orally or
by demonstration, is identified at the time of initial disclosure as
confidential and reduced to a writing marked "Confidential" and delivered to the
Receiving Party within thirty (30) days of such disclosure; and (ii) the terms
of this Agreement as set forth in Section 8.3.

(e) "Intellectual Property Rights" means all rights of a Person
in, to, or arising out of: (i) any U.S., international or foreign patent,
utility model or registered design or any application therefor and any and all
reissues, divisions, continuations, renewals, extensions and
continuations-in-part thereof; (ii) inventions (whether patentable or not in any
country), invention disclosures, improvements, trade secrets, proprietary
information, know-how, technology and technical data; (iii) copyrights,
copyright registrations, mask works, mask work registrations, and applications
therefor in the U.S. or any foreign country, and all other rights corresponding
thereto throughout the world; (iv) moral rights; and (v) any other proprietary
rights anywhere in the world similar to those described in this definition,
including, without limitation, rights in registered computer programs.

(f) "License Term" means the time period commencing on the
Effective Date and ending on the earlier of the expiration or termination of
that certain "Packaging & Test Services Agreement" by and among Amkor
Technology, Inc., Amkor Electronics, Inc., C.I.L. Limited, Anam USA, Inc. and
Anam Industrial Co., Ltd.

(g) "Person" means any legal person or entity, including any
individual, corporation, partnership, joint venture, association, joint stock
company, trust, unincorporated association, limited liability corporation,
governmental entity, or other person or entity of similar nature.

(h) "Subsidiary" of a first entity means any corporation or other
entity that is directly or indirectly controlling, controlled by or under common
control with such first entity.

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For the purpose of this definition, "control" shall mean the direct or indirect
ownership of fifty percent (50%) or more of the shares of the subject entity
entitle to vote in the election of directors (or, in the case of an entity that
is not a corporation, for the election of managing authority).

(i) "Term" means the term of this Agreement as set forth in
Section 11.1.

(j) "Type A Materials" means those documents and other materials
listed on Exhibit B attached hereto and all derivative works and compilations
thereof.

(k) "Type A Patents" means the patents listed on Exhibit A
attached hereto, the patent applications listed on Exhibit D attached hereto,
all patents issuing therefrom and all reissues, renewals, extensions,
continuations, continuations-in-part, divisions and reexaminations thereof and
foreign and domestic counterparts of all of the foregoing.

(l) "Type B Materials" means all materials, documents,
information and data of Anam ("Materials") relating to the K4 packaging facility
and all other Materials provided to or learned by Amkor.

(m) "Type B Patents" means all patents and patent applications
owned or controlled by Anam, and all reissues, renewals, extensions,
continuations, continuations-in-part, divisions and reexaminations thereof and
foreign and domestic counterparts of all of the foregoing, other than Type A
Patents, including the patents and patent applications listed on Exhibit E
attached hereto.

ARTICLE 2.
TYPE A PATENTS

SECTION 2.1. Assignment to Amkor. Anam hereby irrevocably transfers,
conveys and assigns to Amkor in perpetuity all worldwide right, title and
interest in and to the Type A Patents. In furtherance of the foregoing, upon
Amkor's request, Anam shall execute and deliver to Amkor a patent assignment
substantially in the form attached hereto as Exhibit C.

SECTION 2.2. License to Anam. Amkor hereby grants to Anam a
royalty-free, nonexclusive, worldwide, transferable, sublicensable, royalty-free
license under the Type A Patents during the License Term to make in the Anam
Facilities, use, sell and import any product and practice any process in the
Anam Facilities.

ARTICLE 3.
TYPE B PATENTS

SECTION 3.1. License to Amkor. Anam hereby grants to Amkor and its
Subsidiaries a royalty-free, perpetual, irrevocable, nonterminable,
nonexclusive, worldwide, transferable, sublicensable, royalty-free license under
the Type B Patents to make, have made, use, sell, offer for sale and import any
product and practice any process.

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4

ARTICLE 4.
TYPE A MATERIALS

SECTION 4.1. Assignment to Amkor. Anam hereby irrevocably transfers,
conveys and assigns to Amkor in perpetuity all worldwide right, title and
interest in and to the Type A Materials, including without limitation (i) Anam's
trade secret rights in the information contained in the Type A Materials, (ii)
Anam's copyrights and maskwork rights in the Type A Materials, (iii) the right
to file in Amkor's name patents on inventions disclosed in the Type A Materials
and any other application for or registration of any Intellectual Property Right
in or to any of the Type A Materials in Amkor's sole discretion, and (iv) all
other Intellectual Property Rights in and to any of the Type A Materials
(collectively, the "Type A IP").

SECTION 4.2. Confidential Information. The information contained in the
Type A Materials is and shall become Amkor's Confidential Information.

SECTION 4.3. License to Anam. Amkor hereby grants to Anam a
nonexclusive, worldwide, transferable, sublicensable, royalty-free license under
the Type A IP during the License Term to make in the Anam Facilities, use, sell
and import any product and practice in the Anam Facilities any process.

ARTICLE 5.
TYPE B MATERIALS

SECTION 5.1. License to Amkor. Anam hereby grants to Amkor and its
Subsidiaries a royalty-free, perpetual, irrevocable, nonterminable,
nonexclusive, worldwide, transferable, sublicensable license under Anam's
existing and future Intellectual Property Rights in and to the Type B Materials
to make, have made, use, sell, offer for sale and import any product and
practice any process.

ARTICLE 6.
DELIVERY OF MATERIALS

SECTION 6.1. Delivery. Within five (5) days of the Closing (as such term
is defined in the Asset Purchase Agreement), Anam shall, in connection with the
transfer of the assets of Anam's K4 semiconductor packaging facility to Amkor,
deliver to Amkor copies of the Type A Materials and the Type B Materials (the
date of such delivery, the "Transfer Date").

ARTICLE 7.
NEW TECHNOLOGY SHARING

SECTION 7.1. Meeting; Delivery.

(a) The Parties shall hold regular meetings of an engineering
council substantially similar to the meetings held by representatives of the K1,
K2, K3 and K4 packaging facilities prior to the Effective Date. Anam shall
ensure that representatives of Amkor are invited to, and

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5

given reasonable opportunity to attend, all such meetings and any similar
technology sharing meetings.

(b) No less frequently than once per calendar quarter, the
Parties shall meet to discuss inventions and know-how ("New Technology") created
or acquired by each of the Parties since the last such meeting or, in the case
of the first such meeting, since the Transfer Date. With respect to each item of
New Technology, upon mutual agreement of the Parties, the Party owning or
controlling, as the case may be, such item of New Technology shall (i) disclose
such item of New Technology to the other Party and grant such other Party a
license under the disclosing Party's intellectual property rights to make, have
made, use, sell, offer for sale and import any products and practice any
processes. The foregoing obligation shall not apply to any item of New
Technology or any Intellectual Property Right owned or controlled by a purchaser
of or successor to Amkor, which item or right was not acquired from Amkor.

SECTION 7.2. Jointly Developed Technology. The Parties shall own jointly
developed works of authorship and jointly developed inventions, including all
Intellectual Property Rights associated therewith, jointly, without a duty to
account.

ARTICLE 8.
CONFIDENTIAL INFORMATION

SECTION 8.1. Confidential Information and Exclusions. Notwithstanding
Section 1.2(d), Confidential Information shall exclude information that the
Receiving Party can demonstrate:

(a) was independently developed by the Receiving Party without
any use of the Disclosing Party's Confidential Information or by the Receiving
Party's employees or other agents (or independent contractors hired by the
Receiving Party) who have not been exposed to the Disclosing Party's
Confidential Information;

(b) becomes known to the Receiving Party, without restriction,
from a source other than the Disclosing Party, which source has no duty of
confidentiality with respect thereto;

(c) was in the public domain at the time it was disclosed or
becomes in the public domain through no act or omission of the Receiving Party;
or

(d) was rightfully known to the Receiving Party, without
restriction, at the time of disclosure;

except that neither Section 8.1(a) nor Section 8.1(d) shall be considered in
determining whether the Type A Materials is Amkor's Confidential Information.

SECTION 8.2. Confidentiality Obligation. The Receiving Party shall treat
as confidential all of the Disclosing Party's Confidential Information. Without
limiting the foregoing, the Receiving Party shall use at least the same degree
of care which it uses to prevent the disclosure of its own confidential
information of like importance, but in no event with less than reasonable care,
to prevent the disclosure of the Disclosing Party's Confidential Information.

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Notwithstanding the foregoing, Amkor shall have the right to disclose Anam's
Confidential Information to Amkor's Subsidiaries pursuant to an agreement
containing provisions at least as protective of such Confidential Information as
this Article 8.

SECTION 8.3. Confidentiality of Agreement. Each Party agrees that the
terms and conditions, but not the existence, of this Agreement shall be treated
as the other's Confidential Information and that no reference to the terms and
conditions of this Agreement or to activities pertaining thereto can be made in
any form of public or commercial advertising without the prior written consent
of the other Party; provided, however, that each Party may disclose the terms
and conditions of this Agreement: (i) as required by any court or other
governmental body; (ii) as otherwise required by law; (iii) to legal counsel of
the Parties; (iv) in connection with the requirements of an initial public
offering or securities filing or offering; (v) in confidence, to accountants,
banks, and financing sources and their advisors; (vi) in confidence, in
connection with the enforcement of this Agreement or rights under this
Agreement; or (vii) in confidence, in connection with a merger or acquisition or
proposed merger or acquisition, or the like.

SECTION 8.4. Compelled Disclosure. If a Receiving Party believes that it
will be compelled by a court or other authority to disclose Confidential
Information of the Disclosing Party, it shall give the Disclosing Party prompt
written notice so that the Disclosing Party may take steps to oppose such
disclosure.

SECTION 8.5. Remedies. Unauthorized use by a Party of the other Party's
Confidential Information will diminish the value of such information. Therefore,
if a Party breaches any of its obligations with respect to confidentiality or
use of Confidential Information hereunder, the other Party shall be entitled to
seek equitable relief to protect its interest therein, including injunctive
relief, as well as money damages.

SECTION 8.6. Residuals. Each Party shall be free, and each Party hereby
grants to the other Party the right, to use for any purpose the Residuals
resulting from access to or work with the Confidential Information. "Residuals"
means information retained in the unaided memory of an individual who has had
access to Confidential Information without conscious attempt by such individual
to memorize such information. Neither Party shall have any obligation to limit
or restrict the assignment of any individual who has had access to the other
Party's Confidential Information or to pay royalties for any work resulting from
the use of Residuals. However, the foregoing shall not be deemed to grant to
either Party a license under the other Party's copyrights or patents.

ARTICLE 9.
WARRANTIES, DISCLAIMERS AND INDEMNITIES

SECTION 9.1. General Warranty. Each Party hereby represents and warrants
to the other that: (i) all corporate action on the part of such Party, its
officers, directors and shareholders necessary for the authorization of this
Agreement and the performance of all obligations of such Party hereunder has
been taken; and (ii) this Agreement, when executed and delivered, will be a
valid and binding obligation of such Party enforceable in accordance with its
terms.

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SECTION 9.2. No Conflict. Each Party hereby represents and warrants to
the other that such Party's making of this Agreement and performance hereunder
does not and will not violate any agreement existing between such Party and any
third party.

SECTION 9.3. Intellectual Property. Anam hereby represents and warrants
to Amkor that, to the best of Anam's knowledge: (i) the Type A Materials, the
Type B Materials and Amkor's use thereof as authorized herein will not infringe
any Intellectual Property Right of any third party; (ii) neither the Type A
Materials nor the Type A Patents are subject to any third-party lien or
encumbrance; (iii) no third party is infringing or misappropriating or has
infringed or misappropriated: (A) any claim of any of the Type A Patents or the
Type B Patents or (B) any other Intellectual Property Right in or to the Type A
Materials or the Type B Materials; and (iv) all Intellectual Property Rights
transferred or licensed to Amkor hereunder are valid and subsisting, and no
grounds exist to invalidate or render unenforceable any such Intellectual
Property Right.

SECTION 9.4. Disclaimer. EXCEPT AS EXPRESSLY SET FORTH HEREIN, NEITHER
PARTY MAKES ANY WARRANTIES OR CONDITIONS, EXPRESS, STATUTORY, IMPLIED, OR
OTHERWISE, WITH RESPECT TO ANY PRODUCT OR SERVICE PROVIDED HEREUNDER, AND EACH
PARTY HEREBY DISCLAIMS THE IMPLIED WARRANTIES AND CONDITIONS OF NONINFRINGEMENT
OF THIRD PARTY RIGHTS, SATISFACTORY QUALITY, MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE WITH RESPECT THERETO.

SECTION 9.5. Indemnity. Anam shall indemnify and hold Amkor, its
affiliates and customers harmless from and against all loss, cost, liability,
damage and expense suffered or incurred by any of them in connection with any
breach by Anam of any warranty set forth herein.

ARTICLE 10.
LIABILITY LIMITATIONS

SECTION 10.1. Exclusion of Damages. EXCEPT IN CONNECTION WITH A BREACH
OF A PROVISION OF ARTICLE 8, IN NO EVENT SHALL EITHER PARTY BE LIABLE TO THE
OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER
BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), PRODUCT LIABILITY, OR
OTHERWISE, AND WHETHER OR NOT THE PARTY AGAINST WHOM LIABILITY IS SOUGHT HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

SECTION 10.2. Failure of Essential Purpose. The limitations specified in
this ARTICLE 10 shall survive and apply even if any limited remedy specified in
this Agreement is found to have failed of its essential purpose.

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ARTICLE 11.
TERM AND TERMINATION

SECTION 11.1. Term. Unless earlier terminated in accordance with Section
11.2, the term ("Term") of this Agreement shall commence on the Effective Date
and continue in full force and effect until the Parties agree to mutually
terminate this Agreement.

SECTION 11.2. Default. If either Party defaults in the performance of
any of its material obligations hereunder, such Party shall use its best efforts
to correct such default within thirty (30) days (or such additional time as the
Parties may agree) after written notice thereof from the other Party. If any
such default cannot be, or is not, corrected within such thirty (30)-day period,
then the non-defaulting Party shall have the right, in addition to any other
remedies it may have, to terminate this Agreement by giving written notice to
the Party in default.

SECTION 11.3. Survival. The following provisions of this Agreement shall
survive any expiration or termination hereof: Articles 1, 3, 5, 8, 9, 10, 11, 12
and 13 and Sections 2.1, 4.1 and 4.2.

ARTICLE 12.
ARBITRATION

SECTION 12.1. Arbitration of Disputes.

(a) Any dispute arising out of, in connection with, or in
relation to the interpretation, performance or breach of this Agreement,
including any claim based on contract, tort or statute, which is not settled
after good faith attempts by the Parties to amicably resolve such dispute shall
be resolved by final and binding arbitration. The arbitration shall be held in
Seoul, Korea if the arbitration is brought by Amkor and in San Francisco,
California, United States of America if the arbitration is brought by Seller in
accordance the Rules of Conciliation and Arbitration of the International
Chamber of Commerce ("ICC Rules") as then existing and shall be heard and
determined by an arbitration tribunal composed of three (3) arbitrators. Each of
the Parties shall appoint one arbitrator each, and both of such arbitrators
shall appoint a third arbitrator who shall serve as the Chairman of such
arbitration tribunal, provided that such third arbitrator is not a citizen of
the United States of America of Korea. If either party fails or decides against
appointing an arbitrator within a period of thirty (30) days of the appointment
of the first arbitrator, or if the arbitrators designated by the Parties fail or
otherwise are unable to appoint the third arbitrator within (30) days of the
appointment of the second arbitrator, then the remaining arbitrator (s) shall be
selected by the President of the International Chamber of Commerce, U.S.A.,
which shall act as the appointing authority.

(b) All arbitration proceedings shall be conducted in the English
language and the arbitration award (the "Award") shall be rendered no later than
six (6) months from the commencement of the arbitration or as otherwise provided
by the ICC Rules, unless otherwise extended by the arbitration tribunal for no
more than an additional six (6) months for reasons that are just and equitable.

-8-

9

(c) The Parties expressly understand and agree that the Award
shall be the sole, exclusive, final and binding remedy between them regarding
any and all disputes presented to the arbitration tribunal. Each Party hereby
expressly waives any and all rights that such Party may have with respect to a
judicial review of the Award in the courts having jurisdiction over the Party
(or its assets) against whom the Award is rendered for a judicial acceptance of
the Award and an order of enforcement.

(d) Notwithstanding any other provision of this Agreement, either
Party shall be entitled to seek preliminary injunctive relief from any court of
competent jurisdiction pending the final decision or award of the arbitrators.
Any arbitration shall be held before a single arbitrator, who shall be selected
in accordance

ARTICLE 13.
MISCELLANEOUS

SECTION 13.1. Further Assurances. At any time, and from time to time,
Anam shall forthwith, upon Amkor's (or its successors' or assigns') request,
take any and all steps necessary to execute, acknowledge and deliver to Amkor
(or its successors or assigns), any and all further instruments and assurances
(including, without limitation, assignments of patent and copyright rights and
patent applications) necessary or expedient in order to invest all right, title
and interest in the Type A Patents and Type A Materials in Amkor (or its
successors or assigns) and to facilitate Amkor's (or its successors' and
assigns') enjoyment, enforcement and recordation of such rights. Anam hereby
constitutes and appoints Amkor as Anam's true and lawful attorney-in-fact with
full power of substitution, in Anam's name, place and stead to take any and all
steps, including proceedings at law, in equity or otherwise, to execute,
acknowledge and deliver any and all documents, instruments and assurances
necessary or expedient in order to vest, record or perfect all Amkor's (or its
successors' or assigns') rights in the Type A Patents and Type A Materials, to
protect the same, or to enforce any claim or any right of any kind with respect
thereto. This includes, but is not limited to, any rights with respect to the
Type A Patents and Type A Materials that may have accrued in Anam's favor at any
time prior to the date of this Agreement. Anam hereby declares that the
foregoing power is coupled with an interest and, as such, is irrevocable.
Without limiting the foregoing, Anam shall, upon Amkor's request, provide to
Amkor all reasonable cooperation in connection with the application for or
registration of Intellectual Property Rights in or to the Type A Patents and/or
the Type A Materials, including without limitation cooperation in connection
with the prosecution of the patent applications included in the Type A Patents.

SECTION 13.2. Licensor Bankruptcy. All rights and licenses granted to
Amkor pursuant to this Agreement are, and shall otherwise be deemed to be, for
purposes of Section 365(n) of Title 11 of the United States Code (the
"Bankruptcy Code"), licenses to rights of "intellectual property" as defined
thereunder. Notwithstanding any provision contained herein to the contrary, if
Anam is under any proceeding under the Bankruptcy Code and the trustee in
bankruptcy of Anam, or Anam as a debtor in possession, rightfully elects to
reject this Agreement, Amkor may, pursuant to Sections 365(n)(1) and (2) of the
Bankruptcy Code, retain any and all of Amkor's rights hereunder, to the maximum
extent permitted by law, subject to Amkor's making the payments specified
herein.

-9-

10

SECTION 13.3. Governing Law. THIS AGREEMENT SHALL BE GOVERNED BY AND
INTERPRETED IN ACCORDANCE WITH THE LAWS OF THE REPUBLIC OF KOREA, WITHOUT
REFERENCE TO CONFLICT OF LAWS PRINCIPLES.

SECTION 13.4. Independent Contractors. The Parties are independent
contractors. Nothing contained herein or done pursuant to this Agreement shall
constitute either Party the agent of the other Party for any purpose or in any
sense whatsoever, or constitute the Parties as partners or joint venturers.

SECTION 13.5. Assignment. Anam shall not assign or delegate this
Agreement, or any of its rights or duties hereunder, directly, indirectly, by
operation of law, in connection with a Change of Control or otherwise, and any
such purported assignment or delegation shall be void, except with the express
written permission of Amkor in its sole discretion. Amkor may assign or delegate
this Agreement and any of Amkor's rights or duties hereunder in Amkor's sole
discretion.

SECTION 13.6. Amendment. No alteration, amendment, waiver, cancellation
or any other change in any term or condition of this Agreement shall be valid or
binding on either Party unless mutually assented to in writing by both Parties.

SECTION 13.7. No Waiver. The failure of either Party to enforce at any
time any of the provisions of this Agreement, or the failure to require at any
time performance by the other Party of any of the provisions of this Agreement,
shall in no way be construed to be a present or future waiver of such
provisions, nor in any way affect the validity of either Party to enforce each
and every such provision thereafter. The express waiver by either Party of any
provision, condition or requirement of this Agreement shall not constitute a
waiver of any future obligation to comply with such provision, condition or
requirement.

SECTION 13.8. Severability. If, for any reason, a court of competent
jurisdiction finds any provision of this Agreement, or portion thereof, to be
invalid or unenforceable, such provision of the Agreement will be enforced to
the maximum extent permissible so as to effect the intent of the Parties, and
the remainder of this Agreement will continue in full force and effect. The
Parties agree to negotiate in good faith an enforceable substitute provision for
any invalid or unenforceable provision that most nearly achieves the intent and
economic effect of such provision.

SECTION 13.9. Notices. All notices, requests, demands, waivers, and
other communications required or permitted hereunder shall be in writing and
shall be deemed to have been duly given: (i) when delivered by hand or confirmed
facsimile transmission; (ii) one day after delivery by receipted overnight
delivery; or (iii) four days after being mailed by certified or registered mail,
return receipt requested, with postage prepaid to the following, or to such
other person or address as either Party shall furnish to the other Party in
writing pursuant to the above:

(a) in the case of notices to Amkor, to the attention of the
General Counsel at the relevant address set forth on the first page hereof, with
a copy to Selwyn B. Goldberg, Esq., Wilson Sonsini Goodrich & Rosati, 650 Page
Mill Road, Palo Alto, CA 94304.

-10-

11

(b) in the case of notices to Anam, to [ ].

SECTION 13.10. Titles and Subtitles. The titles and subtitles used in
this Agreement are used for convenience only and are not to be considered in
construing or interpreting this Agreement.

SECTION 13.11. Entire Agreement. The terms and conditions herein
contained and the referenced Exhibits which are hereby incorporated herein by
reference constitute the entire agreement between the Parties with respect to
the subject matter hereof and supersede all previous and contemporaneous
agreements and understandings, whether oral or written, between the Parties with
respect to the subject matter hereof.

SECTION 13.12. Counterparts. This Agreement may be executed in
counterparts or duplicate originals, both of which shall be regarded as one and
the same instrument, and which shall be the official and governing version in
the interpretation of this Agreement.

*** End of Agreement ***

-11-

12

IN WITNESS WHEREOF, the Parties have caused this Agreement to be
executed by duly authorized officers or representatives to be effective as of
the date first above written.

Amkor Technology, Inc.                    Anam Semiconductor, Inc.

By: /s/                                   By: /s/
----------------------------              ----------------------------

Name:                                     Name:
--------------------------                --------------------------

Title:                                    Title:
-------------------------                 -------------------------

-12-

13

Exhibit A

HEAT SINK PATENTS

No.         Title                                     Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ------------------------------------------------------------------------------------------------------------------------------------

AP-094    Semiconductor package having heatsink     D.H. Moon   94-22437   Sep 7, '94    Dec 26, '97   P137066   Anam
and method of manufacturing
it (Heatsink structure)
- ------------------------------------------------------------------------------------------------------------------------------------

AP-108    Semiconductor package (Making heatsink    W.S. Shin   94-25862   Oct 10, '94   Dec 26, '97   P134933   Anam
when it's easy to eject in
molding process)
- ------------------------------------------------------------------------------------------------------------------------------------

AP-109    A method of manufacturing for             J.Y Jung    94-25863   Oct 10, '94   Jan 23, '98   P137325  Anam
semiconductor package (Attaching
heatsink at last time)
- ------------------------------------------------------------------------------------------------------------------------------------

AP-111    Apparatus of attaching tape for           L.H. Kim    94-27136   Oct 24, '94   Mar 31, '98   P144313   Anam
preventing heatsink plating
- ------------------------------------------------------------------------------------------------------------------------------------

AP-114    Method of attaching between heatsink      B.T. Dho    94-28904   Nov 4, '94    May 22, '98   P159965   Anam
and leadframe of semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------

AU-128    Structure of heatspreader for             K.J. Kim    94-33576   Dec 10, '94   Jan 23, '98   U117453   Anam
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------

AP-181    Method of eliminating tape attached       L.H. Kim    94-39353   Dec 30, '94   Feb 26, '98   P142135   Anam
in heatsink
- ------------------------------------------------------------------------------------------------------------------------------------

BGA PATENTS

No.         Title                                     Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ------------------------------------------------------------------------------------------------------------------------------------
AP-027    Semiconductor package (BGA + PQ)          N.H. Kwak   93-27078   Dec 9, '93    Sep 25, '97   P127737   Anam
- ------------------------------------------------------------------------------------------------------------------------------------

AP-091    Cap type BGA package and method           Y.W. Heo    94-21781   Aug 31, '94   Mar 31, '98   P144311   Anam
of manufacturing it
- ------------------------------------------------------------------------------------------------------------------------------------

LEADFRAME PATENTS

No.         Title                                     Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ------------------------------------------------------------------------------------------------------------------------------------
AP-035    Surface mounting integrated circuit       G. Lee      94-01773   Jan 31, '94   Sep 12, '97   P124790   Anam
package (BLP)
- ------------------------------------------------------------------------------------------------------------------------------------

45      Plastic mold package with heatsink        Rorert      94-05545   Mar 19, '94   Jun 30, '97   P126052
- ------------------------------------------------------------------------------------------------------------------------------------

-1-

14

No.         Title                                     Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ------------------------------------------------------------------------------------------------------------------------------------

46      Forming method of plastic mold package    Rorert      94-05546   Mar 19, '94   Jun 30, '97   P126053
with heatsink
- ------------------------------------------------------------------------------------------------------------------------------------

PKG PATENTS

No.         Title                                     Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
1           Safe setting method for solder ball                   93-15983                               P105750
for integrated circuit package (BGA)
- ------------------------------------------------------------------------------------------------------------------------------------
2           Method of decreasing bending for                      93-15984                               P122789
integrated circuit package (BGA)
- ------------------------------------------------------------------------------------------------------------------------------------

3           Mold runner removal from a                            93-15985                               P128174
substrate-based packaged electronic
device (BGA, Gold gate)
- ------------------------------------------------------------------------------------------------------------------------------------

4           Semiconductor package (BGA+PQ)                        93-27078                               P127737
- ------------------------------------------------------------------------------------------------------------------------------------

5           Method of mounting chip for BGA                       94-02982                               P131392
semiconductor package and structure
using the same (Double Adhesive)
- ------------------------------------------------------------------------------------------------------------------------------------

6           Cap type BGA package and method of                    94-21781                               P144311
manufacturing it
- ------------------------------------------------------------------------------------------------------------------------------------

7           Method for checking wire bonding in                   94-24280                               P131389
result of BGA package
- ------------------------------------------------------------------------------------------------------------------------------------

8           Semiconductor package (Consists of                    94-39354                               P167141
metal cap and advanced adhesive)
- ------------------------------------------------------------------------------------------------------------------------------------

9           Method for leveling solder ball array                 95-10418                               P179473
in BGA semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------

11          BGA semiconductor package with improved               95-19582                               P159987
heat dissipation and dehumidification
- ------------------------------------------------------------------------------------------------------------------------------------

19          Printed circuit board having epoxy                    95-37513                               P170024
barrier around its throughout slot
and ball grid array semiconductor
package using such a printed circuit
board, thereby exhibiting a high
moisture discharge characteristic
- ------------------------------------------------------------------------------------------------------------------------------------

119         Method of decreasing bending for                      97-10103                               P122847
integrated circuit package (BGA)
- ------------------------------------------------------------------------------------------------------------------------------------

-2-

15

Exhibit B

Type A Materials

I.      All documents, databases and other materials in Anam's possession or
control, whether in printed, electronic or other form, describing, addressing,
related to or useful in connection with any of the following topics:

A. With respect to TSOP/TSSOP/SSOP:

1.     General leadframe design rules including strip configurations and
die design guidelines.

2.     Wafer Backgrinding process recipe for optimized surface finish
and residual stress.

3.     Leadframe design criteria specific to ePad TSSOP delamination
control.

4.     Low loop and second stitch on ball wire bonding process recipes.

5.     Dispense tool design criteria for thermally enhanced epoxy
processing.

6.     ePad TSSOP deflashing process and recipe.

7.     ePad process flow for delamination enhancement.

B. Generally:

1.     Tape design rules, including with respect to lead length/notch
width, reliability, yield and quality.

2.     Tape to frame lamination material and process.

3.     Elastomer material, including with respect to thickness,
supplier, type, reliability and manufacturability.

4.     Frame design, including with respect to cost reduction.

5.     Elastomer to tape to die size design rules, including issues with
respect to quality and yield optimization.

6.     Multiple unit punching of elastomer onto tape sites, including
with respect to cost reduction.

7.     D/A process and optimization methodology, including with respect
to time/press/temp to meet MRT.

-1-

16

8.     Lead bond parameters (90E and 45E leads) (to allow reliable perf)

9.     Coverlay tape material, including with respect to specific
adhesion level but with release properties.

10.    Coverlay tape attach process (void free).

11.    Encap material prep, including with respect to filtering/mixing.

12.    Encap dispense/vacuum/cure process (high speed/void free).

13.    Solderball attach process, including with respect to small balls
and multiple units on strip.

14.    Mark (laser mark on Si backside without die damage).

15.    Singulation (process parameters to avoid burrs).

-2-

17

II. The following drawings and all information contained therein:

================================================================================
DRAWING #          TITLE
================================================================================

001 0501 2099      BGA Standard Process Description
- --------------------------------------------------------------------------------
001 0307 2025      Saw and Clean Monitor
- --------------------------------------------------------------------------------
001 0510 2495      Precure Process (before die attach)
- --------------------------------------------------------------------------------
001 0310 2033      Die Mounting Monitor
- --------------------------------------------------------------------------------
001 0311 2078      Ball Shear Test
- --------------------------------------------------------------------------------
001 0311 2465      Bond Strength Test
- --------------------------------------------------------------------------------
001 0311 2455      Wire Bond Monitor
- --------------------------------------------------------------------------------
001 0314 2032      Oven Monitor
- --------------------------------------------------------------------------------
001 0410 2637      Incoming Inspection for Die Attach Adhesive
- --------------------------------------------------------------------------------
001 0411 2694      Incoming Inspection for Bonding Wires
- --------------------------------------------------------------------------------
001 0440 2688      Incoming Inspection for PCB
- --------------------------------------------------------------------------------
001 0506 2001      Wafer Mounting Process
- --------------------------------------------------------------------------------
001 0507 2002      Wafer Sawing Process
- --------------------------------------------------------------------------------
001 0510 2042      Die Bonding for Adhesive
- --------------------------------------------------------------------------------
001 0510 2052      Adhesive Curving Process
- --------------------------------------------------------------------------------
001 0511 2044      Wire Bonding for Gold Wire
- --------------------------------------------------------------------------------
001 0511 2497      Precure Process (before wire bond)
- --------------------------------------------------------------------------------
001 0517 2496      Precure Process (before mold)
- --------------------------------------------------------------------------------
001 0417 2690      Incoming Inspection for Mold Compound
- --------------------------------------------------------------------------------
001 0513 2005      Internal Visual Inspection for Commercial Product
- --------------------------------------------------------------------------------

-3-

18

- --------------------------------------------------------------------------------

001 0313 2009      Internal Visual Lot Acceptance
- --------------------------------------------------------------------------------
001 0419 2671      Incoming Inspection for Marking/Dot Ink
- --------------------------------------------------------------------------------
001 0517 2447      Process for Molding
- --------------------------------------------------------------------------------
001 0317 2476      Mold Monitor
- --------------------------------------------------------------------------------
001 0217 2223      X-Ray Monitor Mold
- --------------------------------------------------------------------------------
001 0519 2062      Laser Marking
- --------------------------------------------------------------------------------
001 0319 2105      Laser Marking Monitor
- --------------------------------------------------------------------------------

================================================================================
DRAWING #          TITLE
================================================================================
001 0519 2062      Marking
- --------------------------------------------------------------------------------
001 0319 2105      Marking Monitor
- --------------------------------------------------------------------------------
001 0514 2038      Post Mold Cure
- --------------------------------------------------------------------------------
001 0314 2032      Oven Monitor
- --------------------------------------------------------------------------------
001 0319 2472      Marking Permanency Test
- --------------------------------------------------------------------------------
001 0431 2083      Procurement Spec for Shipping Tray
- --------------------------------------------------------------------------------
001 0340 2482      Solder Ball Attach Monitor
- --------------------------------------------------------------------------------
001 0340 2481      Solder Ball Shear Strength Test
- --------------------------------------------------------------------------------
001 0521 2014      DTFS for Plastic Packages
- --------------------------------------------------------------------------------
001 0422 2666      Anode & Solder Incoming Inspection
- --------------------------------------------------------------------------------
001 0540 2624      Solder Ball Attach Process
- --------------------------------------------------------------------------------
001 0321 2259      DTFS Monitor (Deflash/Trim/Form/Singulation)
- --------------------------------------------------------------------------------
001 0530 2623      Final Visual Inspection
- --------------------------------------------------------------------------------
001 0330 2010      Final V/M Lot Acceptance
- --------------------------------------------------------------------------------

-4-

19

- --------------------------------------------------------------------------------

001 0531 2247      Dry Packing
- --------------------------------------------------------------------------------
001 0331 2248      Dry Packing Monitor
- --------------------------------------------------------------------------------
001 0531 2234      Packing Operation Procedure
- --------------------------------------------------------------------------------
001 0331 2158      Packing Monitor
- --------------------------------------------------------------------------------

BODY SIZE         STRIP DRAWING #
- --------------------------------------------------------------------------------
13 X 13           72132
- --------------------------------------------------------------------------------
14 X 22           72076
- --------------------------------------------------------------------------------
15 X 15           72371
- --------------------------------------------------------------------------------
17 X 17           72176
- --------------------------------------------------------------------------------
23 X 23           70821
- --------------------------------------------------------------------------------
27 x 27           70795
- --------------------------------------------------------------------------------
31 x 31           71218
- --------------------------------------------------------------------------------
35 x 35           70796
- --------------------------------------------------------------------------------
37.5 x 37.5         75312
- --------------------------------------------------------------------------------

-5-

20

Exhibit C

Patent Assignment

ASSIGNMENT OF PATENT RIGHTS

For good and valuable consideration, the receipt of which is hereby
acknowledged, __________, a__________ corporation, having offices at __________
("Assignor"), does hereby sell, assign, transfer and convey unto __________, a
__________ corporation, having offices at __________ ("Assignee") or its
designees, all of Assignor's right, title and interest in and to the patent
applications and patents listed below, any patents issuing on any patent
applications listed below, the inventions disclosed in any of the foregoing, any
and all counterpart United States, international and foreign patents,
applications and certificates of invention based upon or covering any portion of
the foregoing and all reissues, divisionals, renewals, extensions, provisionals,
continuations and continuations-in-part of any of the foregoing (collectively
"Patent Rights"):

PATENT OR APPLICATION
NUMBER             COUNTRY   ISSUE OR FILING DATE   TITLE AND INVENTOR(S)
- ---------------------     -------   --------------------   ---------------------

- ---------------------     -------   --------------------   ---------------------

Assignor represents, warrants and covenants that: (i) it is the sole owner,
assignee and holder of record title to the Patent Rights identified above, (ii)
it has obtained and properly recorded previously executed assignments for all
patent applications and patents identified above as necessary to fully perfect
its rights and title therein in accordance with governing law and regulations in
each respective jurisdiction, and (iii) it has full power and authority to make
the present assignment. Assignor shall indemnify and hold harmless Assignee for
any breach of the foregoing.

Assignor further agrees to and hereby does sell, assign, transfer and convey
unto Assignee all rights: (i) in and to causes of action and enforcement rights
for the Patent Rights including all rights to pursue damages, injunctive relief
and other remedies for past and future infringement of the Patent Rights, and
(ii) to apply in any or all countries of the world for patents, certificates of
invention or other governmental grants for the Patent Rights, including without
limitation under the Paris Convention for the Protection of Industrial Property,
the International Patent Cooperation Treaty, or any other convention, treaty,
agreement or understanding. Assignor also hereby authorizes the respective
patent office or governmental agency in each jurisdiction to issue any and all
patents or certificates of invention which may be granted upon any of the Patent
Rights in the name of Assignee, as the assignee to the entire interest therein.

-1-

21

Assignor will, at the reasonable request of Assignee and without demanding any
further consideration therefor, do all things necessary, proper, or advisable,
including without limitation the execution, acknowledgment and recordation of
specific assignments, oaths, declarations and other documents on a
country-by-country basis, to assist Assignee in obtaining, perfecting,
sustaining, and/or enforcing the Patent Rights. Such assistance shall include
providing, and obtaining from the respective inventors, prompt production of
pertinent facts and documents, giving of testimony, execution of petitions,
oaths, powers of attorney, specifications, declarations or other papers and
other assistance reasonably necessary for filing patent applications, complying
with any duty of disclosure, and conducting prosecution, reexamination, reissue,
interference or other priority proceedings, opposition proceedings, cancellation
proceedings, public use proceedings, infringement or other court actions and the
like with respect to the Patent Rights.

The terms and conditions of this Assignment shall inure to the benefit of
Assignee, its successors, assigns and other legal representatives, and shall be
binding upon Assignor, its successor, assigns and other legal representatives.

IN WITNESS WHEREOF this Assignment of Patent Rights is executed at __________,
on __________.

ASSIGNOR

By:
_____________________________________________
Name:
_____________________________________________

(Notarization Required)            Title:
_____________________________________________

State of               )
)
______________________________         County of              )
Name

On _________, 1997, before me, _________,
personally appeared ____________________'
[ ] personally known to me or [ ] proved
______________________________         to me on the basis of staisfactory
Date                                   evidence, to be the person whose name is
subscribed to the within instrument and
acknowleged to me that he/she executed
the same in his/her authorized capacity,
and that by his/her signature on the
instrument the person or the entity upon
behalf of which the person acted,
executed the instrument.

WITNESS my hand and offical seal.

_________________________________________
(Notary Public)

-2-

22

Exhibit D

Patent Applications

HEAT SINK PATENTS

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

AU-278    Heatsink structure for              W.S. Shin   95-34075   Nov 17, '95   Aug 28, '98             Anam       Notice of
semiconductor package (Forming                                                                              Allowance
a plural of Ni/Pd layer on
heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------

AP-392    Structure of semiconductor0         L.S. Yoon   96-06301   Mar 11, '96   Oct 30, '98             Anam       Notice of
package (Making ground ring at                                                                              Allowance
the heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------

BGA PATENTS

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

AP-242    BGA semiconductor package circuit   W.Y. Pyo    95-25173   Aug 16, '95    Nov 9, '98             Anam       Notice of
board structure of using the                                                                                Allowance
solderballs as I/O part

- ----------------------------------------------------------------------------------------------------------------------------------
AP-296    Humidity per coating prevention     Y.W. Heo    95-54766   Dec 22, '95    Sep 11, '98            Anam       Notice of
structure of BGA semiconductor                                                                              Allowance
package

- ----------------------------------------------------------------------------------------------------------------------------------
AP-390    Structure of BGA semiconductor      Y.W. Heo    96-05344   Feb 29, '96   Oct 30, '98             Anam       Notice of
package and method of manufacturing                                                                         Allowance
the same (CSP BGA)

- ----------------------------------------------------------------------------------------------------------------------------------
AP-400    Structure of PCB substrate of       Y.M. Kim    96-09779   Apr 1, '96    Nov 27, '98             Anam       Notice of
BGA semiconductor package                                                                                   Allowance

- ----------------------------------------------------------------------------------------------------------------------------------
AP-401     BGA semiconductor package          M.E. Lee    96-09780   Apr 1, '96    Nov 27, '98             Anam       Notice of
Allowance

- ----------------------------------------------------------------------------------------------------------------------------------
AP-545    The Structure of semiconductor      D.J. Kim    96-62306   Dec 6, '96                            Anam
package (BGA - Using half-etching
& one-side molding)

- ----------------------------------------------------------------------------------------------------------------------------------
AP-576    BGA semiconductor package           L.K. Shin   96-77898   Dec 30, '96                           Anam
built-in carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------

-1-

23

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

AP-577    BGA semiconductor package with      L.K. Shin   96-77899   Dec 30, '96                           Anam
carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------

AP-610    BGA semiconductor package with      L.K. Shin   97-02503   Jan 28, '97                           Anam
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

AP-612    Free-delamination pad for BGA       L.K. Shin   97-02505   Jan 28, '97                           Anam
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

AP-613    BGA semiconductor package with      Y.M. Kim    97-02506   Jan 28, '97                           Anam
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

AP-615    BGA semiconductor package using     Y.W. Heo    97-04430   Feb 14, 97                            Anam
the flexible circuit board
- ----------------------------------------------------------------------------------------------------------------------------------

AP-616    The method of forming solder-ball   L.K. Shin   97-04431   Feb 14, '97                           Anam
land and BGA semiconductor package
including the same
- ----------------------------------------------------------------------------------------------------------------------------------

AP-916    Molding device of ball grid array   S.G. Lee    98-37203   Sep 9, '98                            Anam
semiconductor using a carrier
frame
- ----------------------------------------------------------------------------------------------------------------------------------

AP-919    Attaching method of flexible        S.H. Ha     98-37630   Sep 11, '98                           Anam
circuit board on carrier frame
for ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

AP-923    Structure of BGA semiconductor      D.H. Park   98-37970   Sep 15, '98                           Anam
packages with cavity down type
- ----------------------------------------------------------------------------------------------------------------------------------

AP-926    Structure of ball grid array        L.G Ham     98-38259   Sep 16, '98                           Anam
semiconductor package using
flexible circuit board strip
- ----------------------------------------------------------------------------------------------------------------------------------

LEADFRAME PATENTS

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------
AP-233    Structure of semiconductor          W.S. Shin   95-19587   Jul 5, '95     Nov 9, '98             Anam       Notice of
package (Paddleless)                                                                                        Allowance
- ----------------------------------------------------------------------------------------------------------------------------------

AP-397    Semiconductor package and method    W.S. Shin   96-09776   Apr 1, '96    Nov 30, '96             Anam       Notice of
of manufacturing the same (BLP)                                                                             Allowance
- ----------------------------------------------------------------------------------------------------------------------------------

AP-649    Area array bumped semiconductor     W.S. Shin   97-18509   May 13, '97                           Anam
package
- ----------------------------------------------------------------------------------------------------------------------------------

AP-650    The method forming area array       W.S. Shin   97-18510   May 13, '97                           Anam
burned semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-2-

24

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

AP-660    Grid array leadframe and lead       L.K. Han    97-24409   Jun 12, '97                           Anam
grid array semiconductor package
using the same
- ----------------------------------------------------------------------------------------------------------------------------------

AP-760    Array type semiconductor package    S.G. Lee    97-54507   Oct 23, '97                           Anam
using lead frame and its method
- ----------------------------------------------------------------------------------------------------------------------------------

AP-762    Array type semiconductor package    S.G. Lee    97-54509   Oct 23, '97                           Anam
using lead frame and its method
- ----------------------------------------------------------------------------------------------------------------------------------

WAFER SCALE PACKAGING

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------
AP-623    Structure and manufacturing         S.J. Kim    97-04652   Feb 17, '97                           Anam
method for flip-ship
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

AP-763    Semiconductor package for a flip    S.J. Kim    97-54510   Oct 23, '97                           Anam
chip and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------

AP-959    A flexible film for semiconductor   D.S. You    98-47798   Nov 06, '98                           Anam
packages
- ----------------------------------------------------------------------------------------------------------------------------------

AP-964    Flexible substrate structure and    S.H. Lee    98-48929   Nov 14, '98                           Anam
semiconductor packages and
manufacturing method with the
structure
- ----------------------------------------------------------------------------------------------------------------------------------

AP-761    Ball grid array semiconductor       W.J. Kang   97-54508   Oct 23, '97                           Anam
package using a silicon substrate
- ----------------------------------------------------------------------------------------------------------------------------------

PKG PATENTS

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------
10          Thin BGA semiconductor package                  95-25172
with exposed heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

11          BGA semiconductor package circuit               95-25173
board structure of using the
solderballs as I/O part
- ----------------------------------------------------------------------------------------------------------------------------------

12          Ball grid array semiconductor                   95-41438
package with ring-type heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

13          Semiconductor chip bonding method               95-41845
and structure for using solder ball
- ----------------------------------------------------------------------------------------------------------------------------------

14          Humidity per coating prevention                 95-54766
structure of BGA semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

-3-

25

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent    Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

15          Semiconductor package for using                 95-69093
solderballs and leads as
I/O terminal
- ----------------------------------------------------------------------------------------------------------------------------------

16          BGA semiconductor package                       95-69098
- ----------------------------------------------------------------------------------------------------------------------------------

17          Structure of BGA semiconductor                  96-05344
package and method of manufacturing
the same (CSP BGA)
- ----------------------------------------------------------------------------------------------------------------------------------

18          Method of producing BGA                         96-05345
semiconductor package metal carrier
frame and BGA package produced by
such method
- ----------------------------------------------------------------------------------------------------------------------------------

19          Method of manufacturing                         96-06302
semiconductor package and
structure produced by such method
(CSP: Making solder bump on
chip pad)
- ----------------------------------------------------------------------------------------------------------------------------------

20          Semiconductor package and method                96-09776
of manufacturing the same (BLP)
- ----------------------------------------------------------------------------------------------------------------------------------

21          BGA semiconductor package                       96-09777
- ----------------------------------------------------------------------------------------------------------------------------------

22          Structure of PCB substrate of BGA               96-09779
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

23          BGA semiconductor package                       96-09780
- ----------------------------------------------------------------------------------------------------------------------------------

24          Method of molding BGA semiconductor
attached heatsink                               96-22903
25          Stacking BGA semiconductor package              96-41464
- ----------------------------------------------------------------------------------------------------------------------------------

26          BGA semiconductor package                       96-43844
- ----------------------------------------------------------------------------------------------------------------------------------

27          BGA semiconductor package                       96-62300
- ----------------------------------------------------------------------------------------------------------------------------------

28          Semiconductor package                           96-62301
- ----------------------------------------------------------------------------------------------------------------------------------

29          BGA semiconductor package                       96-62302
- ----------------------------------------------------------------------------------------------------------------------------------

-4-

26

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent No.   Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

30          The structure of semiconductor                  96-62306
package (BGA: Using half-etching &
one-sided molding
- ----------------------------------------------------------------------------------------------------------------------------------

31          Structure and method of BGA                     96-65236
semiconductor package with heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

32          Structure and manufacturing method              96-74115
of semiconductor package (Attaching
internally double chip on leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------

33          The structure of PCB for BGA                    96-74117
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

34          Printed circuit for ball grid array             96-74120
semiconductor package and method
for molding ball grid array
semiconductor package using the same
- ----------------------------------------------------------------------------------------------------------------------------------

35          BGA semiconductor package built-in              96-77898
carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------

36          BGA semiconductor package with                  96-77899
carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------

37          Flexible circuit board of die flag              96-77900
for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

38          Flexible circuit board of die flag              96-77901
for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

39          Flexible circuit board of die flag              96-77902
for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

40          The structure of semiconductor                  96-77931
with carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------

41          BGA semiconductor package with                  97-02503
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

42          The singulation method of BGA                   97-02504
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

43          Free-delamination pad for BGA                   97-02505
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

44          BGA semiconductor package with                  97-02506
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------

45          BGA semiconductor package using                 97-0443 0
flexible circuit board
- ----------------------------------------------------------------------------------------------------------------------------------

46          Semiconductor package (PGA)                     97-04432
- ----------------------------------------------------------------------------------------------------------------------------------

-5-

27

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent No.   Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

47          Semiconductor package (Using                    97-04433
the pin-type of metal sheet)
- ----------------------------------------------------------------------------------------------------------------------------------

48          BGA semiconductor package                       97-04653
- ----------------------------------------------------------------------------------------------------------------------------------

49          Structure and manufacturing method              97-04656
of BGA
- ----------------------------------------------------------------------------------------------------------------------------------

50          Ball grid array semiconductor                   97-04657
package
- ----------------------------------------------------------------------------------------------------------------------------------

51          The structure of semiconductor                  97-06062
package
- ----------------------------------------------------------------------------------------------------------------------------------

52          Semiconductor package (Attaching                97-18551
heatsink on the top of chip)
- ----------------------------------------------------------------------------------------------------------------------------------

53          Semiconductor package (Attaching                97-18507
the leadframe of array type at
the bottom of package)
- ----------------------------------------------------------------------------------------------------------------------------------

54          Area array bumped semiconductor                 97-18509
package
- ----------------------------------------------------------------------------------------------------------------------------------

55          The method forming area array                   97-18510
bumped semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

56          Semiconductor package (Making                   97-18623
test terminals in circuit test)
- ----------------------------------------------------------------------------------------------------------------------------------

57          Semiconductor package (BGA)                     97-18624
- ----------------------------------------------------------------------------------------------------------------------------------

58          Semiconductor package (Attaching                97-18629
coupling agent for preventing crack
& popcorn from PCB)
- ----------------------------------------------------------------------------------------------------------------------------------

59          Ball grid array semiconductor                   97-54508
package suing a silicon substrate
- ----------------------------------------------------------------------------------------------------------------------------------

60          Array type semiconductor package                97-54509
suing lead frame and its method
- ----------------------------------------------------------------------------------------------------------------------------------

61          Printed circuit board of wafer                  97-64123
taped chip scale package and method
of routing it
- ----------------------------------------------------------------------------------------------------------------------------------

62          Ball grid array semiconductor                   97-64125
package
- ----------------------------------------------------------------------------------------------------------------------------------

63          Structure of micro film for micro               97-43970
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

-6-

28

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent No.   Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

64          Structure of fan-in TAB lead for                97-43971
micro-film for a semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

65          Structure of micro film for micro               97-43972
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

66          Structure of micro film for micro               97-43973
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

67          Structure of micro film for micro               97-43974
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

68          Structure of micro film for micro               97-43975
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

69          Structure of micro film for micro               97-43976
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------

70          Structure of chip array ball grid               97-79222
array semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

71          Ball grid array semiconductor                   97-79225
package using a flexible circuit
board
- ----------------------------------------------------------------------------------------------------------------------------------

72          Ball grid array semiconductor                   97-79228
package using a flexible circuit
board
- ----------------------------------------------------------------------------------------------------------------------------------

73          Singulation method of ball grid                 97-79230
array semiconductor package using
a flexible circuit board strip
- ----------------------------------------------------------------------------------------------------------------------------------

74          Ball grid array semiconductor                   97-79232
package using a flexible circuit
board and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------

75          Semiconductor package                           98-12364
- ----------------------------------------------------------------------------------------------------------------------------------

76          Structure of semiconductor package              98-09915
- ----------------------------------------------------------------------------------------------------------------------------------

77          Structure of BGA-semiconductor                  98-09916
package
- ----------------------------------------------------------------------------------------------------------------------------------

78          Printed circuit board for                       98-36897
semiconductor package for
preventing static electricity
- ----------------------------------------------------------------------------------------------------------------------------------

79          Printed circuit board for                       98-36898
semiconductor package for
preventing static electricity
- ----------------------------------------------------------------------------------------------------------------------------------

80          Attaching method of flexible circuit            98-37630
board on carrier frame for ball
grid array semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-7-

29

No.         Title                               Inventor    Appl No.   Filing Date   Req. Date     Patent No.   Assignee   Remark
- ----------------------------------------------------------------------------------------------------------------------------------

81          Structure of BGA semiconductor                  98-37970
packages with cavity down type

82          Structure of ball grid array                    98-38259
semiconductor package using
flexible circuit board strip

83          Micro ball grid array                           98-40125
semiconductor package

84          Semiconductor package and its                   98-48046
manufacturing method

85          Flexible circuit board and                      98-25418
semiconductor packages using it

Exhibit E

Type B Patents

I. Korean Patents and Applications

- ----------------------------------------------------------------------------------------------------------------------------------
APPLICATION NO.                        TITLE                                            INVENTOR     APPLICATION DATE    ISSUE NO.
- ----------------------------------------------------------------------------------------------------------------------------------

87-15336          Marking apparatus of leadframe for assembling semiconductor           J.H. Choi        87/9/8          U0 49666
- ----------------------------------------------------------------------------------------------------------------------------------
91-16361          Pad cleaner of marking machine for semiconductor device               S.M. Choi        91/9/19         P0 70556
- ----------------------------------------------------------------------------------------------------------------------------------
91-16589          Method and apparatus of lead bending for surface mounting device      Y.H. Kang        91/9/24         P0 81093
- ----------------------------------------------------------------------------------------------------------------------------------
91-22233          Method and apparatus of cam form for IC package                       K.C. Park        91/12/5         P0 81833
- ----------------------------------------------------------------------------------------------------------------------------------
92-03869          Method and apparatus of Forming for surface mounting device           G. Lee           92/3/9          P0 81834
- ----------------------------------------------------------------------------------------------------------------------------------

-8-

30

- ----------------------------------------------------------------------------------------------------------------------------------
92-04715          Structure of package for surface mounting device                      Y.W. Heo         92/3/25         U0 89814
- ----------------------------------------------------------------------------------------------------------------------------------
92-10285          Method and apparatus of LASER marking for IC package                  H.Y. Lee         92/6/13         P1 13208
- ----------------------------------------------------------------------------------------------------------------------------------
92-10526          Heatspreader fixture                                                  J.Y. Kil         92/6/13         U0 88640
- ----------------------------------------------------------------------------------------------------------------------------------
92-26797          Gate cull of quad type intergrated circuit package and gate tiebar    G. Lee           92/12/30        P0 95030
of leadframe (QFP, making the structure of gate tiebar for easily
triming process)
- ----------------------------------------------------------------------------------------------------------------------------------
92-26798          Matrix structure of dual in line leadframe (PDIP)                     Y.W. Heo         92/12/30        P1 05768
- ----------------------------------------------------------------------------------------------------------------------------------
93-03199          Automatic leadframe loader                                            S.Y. Park        93/3/4          P1 05760

- ----------------------------------------------------------------------------------------------------------------------------------
93-13930          Apparatus for inspecting leadframe bonding                            C.G. Son         93/7/26         U0 94008
- ----------------------------------------------------------------------------------------------------------------------------------
93-13931          Apparatus for inspecting intergrated circuit package                  H.M. Aha         93/7/26         U0 94009
- ----------------------------------------------------------------------------------------------------------------------------------
93-14164          Feeding system for marking intergrated circuit package                S.S. Han         93/7/26         P1 18553
- ----------------------------------------------------------------------------------------------------------------------------------
93-15983          Safe setting method for solder ball for integrated circuit            Y.W. Heo         93/8/18         P1 05750
package (BGA)
- ----------------------------------------------------------------------------------------------------------------------------------
93-15984          Method of decreasing bending for integrated circuit package (BGA)     Y.W. Heo         93/8/18         P1 22789
- ----------------------------------------------------------------------------------------------------------------------------------
93-15986          Apparatus of eliminating gate for intergated circuit package          K.D. Shim        93/8/18         P1 05749
- ----------------------------------------------------------------------------------------------------------------------------------

-9-

31

- ----------------------------------------------------------------------------------------------------------------------------------
93-18223          Structure of heatsink for mounting in intergated circuit package      N.H. Kwak        93/9/10         P1 05745
(Power Quad)
- ----------------------------------------------------------------------------------------------------------------------------------
93-22858          Loading and unloading apparatus of plating rack                       S.Y. Park        93/10/30        P1 12771
- ----------------------------------------------------------------------------------------------------------------------------------
93-25775          Semiconductor leadframe (Dambar supporting lead)                      M.J. Lee         93/11/30        P1 22885

- ----------------------------------------------------------------------------------------------------------------------------------
93-30799          Stucture of leadframe pad (QFP, Tiebar Downset)                       C.K. Park        93/12/30        U1 05970
- ----------------------------------------------------------------------------------------------------------------------------------
93-31195          Method of eliminating flash for intergated circuit package and        G. Lee           93/12/30        P1 09990
structure of leadframe hereof (QFP, Tiebar Trim)
- ----------------------------------------------------------------------------------------------------------------------------------
94-00395          Molding method and device of semiconductor package (MGP Mold)         G. Lee           94/1/12         P1 24549
- ----------------------------------------------------------------------------------------------------------------------------------
94-01158          Method of manufacturing mold for semiconductor package and structure  G. Lee           94/1/22         P1 27190
of mold thereof (Mold Tool)
- ----------------------------------------------------------------------------------------------------------------------------------
94-01771          Method of manufacturing ink marking apparatus and structure of ink    S.M. Choi        94/1/31         P1 27189
marking apparatus (Marking ad)
- ----------------------------------------------------------------------------------------------------------------------------------
94-01772          Indexing method and apparatus in wire bonding process for             Y.G. Hwang       94/1/31         P1 13187
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
94-01774          Tiebar structure of leadframe (QFP)                                   G. LEE           94/1/31         P1 19059

- ----------------------------------------------------------------------------------------------------------------------------------
94-02476          Ground terminal                                                       C.B. LEE         94/2/8          U1 09467

- ----------------------------------------------------------------------------------------------------------------------------------
94-03322          Method of recognizing leadframe in wire bonding process for           Y.G. Hwang       94/2/24         P1 21047
semiconductor package (Pattern recognition system)
- ----------------------------------------------------------------------------------------------------------------------------------

-10-

32

- ----------------------------------------------------------------------------------------------------------------------------------
94-03494          Heatsink structure of thin package (PQ2)                              S.D. Lee         94/2/25         P1 19650
- ----------------------------------------------------------------------------------------------------------------------------------
94-03820          Heatsink structure (PQ2)                                              S.D. Lee         94/2/28         P1 24789

- ----------------------------------------------------------------------------------------------------------------------------------
94-04109          Multi-magazine holder                                                 H.Y. Lee         94/3/3          P1 26534

- ----------------------------------------------------------------------------------------------------------------------------------
94-05635          Semiconductor leadframe (Oxide)                                       J.D. Kim         94/3/21

- ----------------------------------------------------------------------------------------------------------------------------------
94-05636          Semiconductor epoxy tool                                              S.K. Hwang       94/3/21         P1 21113

- ----------------------------------------------------------------------------------------------------------------------------------
94-05852          Pick up tool of bonding semiconductor chip (Quad Type)                S.I. Kim         94/3/23         P1 22774
- ----------------------------------------------------------------------------------------------------------------------------------
94-05967          Surface structure of heatsink for semiconductor package (PQ2)         S.D. Lee         94/3/24         P1 25999
- ----------------------------------------------------------------------------------------------------------------------------------
94-06063          Structure of leadframe (Tiebar)                                       S.M. Seo         94/3/24         P1 26000

- ----------------------------------------------------------------------------------------------------------------------------------
94-06064          Structure of heatsink for semiconductor package (PQ2: Making          S.D. Lee         94/3/25         P1 26001
grooves at the center of  heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
94-06289          Pad structure of leadframe (Making holes at the center of paddle      S.M. Seo         94/3/28         P1 19651
for preventing delamination rom paddle surface)
- ----------------------------------------------------------------------------------------------------------------------------------
94-06290          Pad structure of leadframe (Making Down thickness at paddle as        S.M. Seo         94/3/28         P1 19652
an ecthing method for free elamination)
- ----------------------------------------------------------------------------------------------------------------------------------
94-06291          Pad structure of leadframe (consists of double paddle for             S.M. Seo         94/3/28         P1 19653
reducing dimension)
- ----------------------------------------------------------------------------------------------------------------------------------
94-06421          Leadframe structure (Free moisture)                                   S.M. Seo         94/3/29         U1 11266

- ----------------------------------------------------------------------------------------------------------------------------------

-11-

33

- ----------------------------------------------------------------------------------------------------------------------------------
94-06742          Tiebar of leadframe(Making holes in tiebar)                           J.H. Ahn         94/3/31         P1 33014
- -----------------------------------------------------------------------------------------------------------------------------------
94-06756          Mold of wire bonding for semiconductor package(Install subheater)     B.K. Han         94/3/31
- -----------------------------------------------------------------------------------------------------------------------------------
94-06775          Injection method of mold compound(Connect electric signal)            J.H. Ahn         94/3/31         P1 21114
- -----------------------------------------------------------------------------------------------------------------------------------
94-06776          Structure of mold semiconductor package(Air vent)                     G. Lee           94/3/31         P1 21112
- -----------------------------------------------------------------------------------------------------------------------------------
94-08596          Heatsink feeding apparatus                                            G. Lee           94/4/22         P1 26529

- -----------------------------------------------------------------------------------------------------------------------------------
94-08646          Leadframe of inspecting trimming and forming process                  K.C. Park        94/4/22         U1 08304
(Identification mark)
- ----------------------------------------------------------------------------------------------------------------------------------
94-09056          Feeding apparatus for ink marking of intergrated circuit package      S.M. Choi        94/4/27
- ----------------------------------------------------------------------------------------------------------------------------------
94-09667          Font mask for LASER marking of intergrated circuit package            H.Y. Lee         94/5/2          U1 09734
- ----------------------------------------------------------------------------------------------------------------------------------
94-10643          Copper heatspreader (Making embossed pattern on the central paddle)   T.H. Lee         94/5/16         P1 23424
- ----------------------------------------------------------------------------------------------------------------------------------
94-10938          Leadframe (Making wave pattern in inner lead)                         J.D. Kim         94/5/19         P1 23423
- ----------------------------------------------------------------------------------------------------------------------------------
94-11454          Pot coupling structure of transfer apparatus                          J.H. Choi        94/5/23

- ----------------------------------------------------------------------------------------------------------------------------------
94-11455          Transfer apparatus for molding semiconductor package                  J.H. Choi        94/5/23         U1 16194
- ----------------------------------------------------------------------------------------------------------------------------------
94-13647          Copper Oxide Filled polymer die attach adhesive composition for       C.W. Kwak        94/6/16         P1 24788
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-12-

34

- ----------------------------------------------------------------------------------------------------------------------------------
94-14332          Tape for preventing plating and method of plating semiconductor       N.H. Kwak        94/6/22         P1 26273
package
- ----------------------------------------------------------------------------------------------------------------------------------
94-15996          Relocation structure for cutting dambar                               I.S. Kim         94/6/30         U1 14547
- ----------------------------------------------------------------------------------------------------------------------------------
94-15772          Method and apparatus of ejecting semiconductor chip                   J.H. Choi        94/7/1          P1 42152
- ----------------------------------------------------------------------------------------------------------------------------------
94-15873          Method of reducing moisture and contamination penetration into        J.D. Kim         94/7/2          P1 28165
microelectronics (Coating oxidation in leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
94-16492          Transfer dual molding apparatus                                       J.H. Choi        94/7/8

- ----------------------------------------------------------------------------------------------------------------------------------
94-16948          Leadframe for plastic package (Coating silver in only wire            C.K. Park        94/7/8
bonding area)
- ----------------------------------------------------------------------------------------------------------------------------------
94-18497          Heatsink projected out of semiconductor package                       W.S. Shin        94/7/28         P1 56513
- ----------------------------------------------------------------------------------------------------------------------------------
94-18498          Mold for molding semiconductor package                                W.S. Shin        94/7/28         P1 56514
- ----------------------------------------------------------------------------------------------------------------------------------
94-18499          Semiconductor package(Apply new type heatspreader)                    W.S. Shin        94/7/28         P1 56515
- ----------------------------------------------------------------------------------------------------------------------------------
94-19006          Heatsink projected out of semiconductor package                       W.S. Shin        94/7/28         U1 09468
- ----------------------------------------------------------------------------------------------------------------------------------
94-19290          Pad of leadframe(Cutting partly pad for free delamination)            D.H. Moon        94/8/4          P1 56516
- ----------------------------------------------------------------------------------------------------------------------------------
94-21273          Package for test and method of manufacturing it                       W.S. Shin        94/8/27         P1 44314
- ----------------------------------------------------------------------------------------------------------------------------------

-13-

35

- ----------------------------------------------------------------------------------------------------------------------------------
94-21782          Method of molding and structure of mold(Dambarless)                   G. Lee           94/8/31         P1 32702
- ----------------------------------------------------------------------------------------------------------------------------------
94-23007          Leadframe of preventing leakage from solder and epoxy                 D.H. Moon        94/9/7          U1 29005
- ----------------------------------------------------------------------------------------------------------------------------------
94-22438          Method of manufacturing semiconductor package having heatsink         B.T. Dho         94/9/7          P1 37067
(Solder material for preventing it from delamination and crack)
- ----------------------------------------------------------------------------------------------------------------------------------
94-22439          Method and device of molding for intergrated circuit package          G. Lee           94/9/7          P1 62887
(Dambarless)
- ----------------------------------------------------------------------------------------------------------------------------------
94-22625          Method and device for molding of intergrated circuit package          G. Lee           94/9/8          P1 42153
(Making a oxdatantlayer on heatspreader)
- ----------------------------------------------------------------------------------------------------------------------------------
94-22626          Copper Oxide filled polymer die attach adhesive composition for       W.S. Shin        94/9/8          P1 44312
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
94-22712          Semiconductor package (Making embossed patterns as blocking           L.H. Kim         94/9/9          P1 47420
epoxy wall)
- ----------------------------------------------------------------------------------------------------------------------------------
94-23309          Semiconductor package (Making a grooved surface in paddle)            W.S. Shin        94/9/9          U1 33386
- ----------------------------------------------------------------------------------------------------------------------------------
94-23663          A dry system for leadframe (Making a filtering apparatus in system)   N.H. Kwak        94/9/16         P1 49523
- ----------------------------------------------------------------------------------------------------------------------------------
94-23431          A printing circuit board in semiconductor package (Making holes       W.S. Shin        94/9/10         U1 20612
in PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
94-24279          Apparatus and method of elimination dummy dambar and dambar of        K.C. Park        94/9/27         P1 59304
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
94-25860          A method of adhesion of heatsink for semiconductor package            W.S. Shin        94/10/10        P1 47768
- ----------------------------------------------------------------------------------------------------------------------------------

-14-

36

- ----------------------------------------------------------------------------------------------------------------------------------
94-25861          Leadframe (Connecting a plural of line pad & ground line pad)         W.S. Shin        94/10/10        P1 37068
- ----------------------------------------------------------------------------------------------------------------------------------
94-26326          Leadframe (Making pattern for connecting signal, powerline and        L.H. Kim         94/10/10        U1 29004
ground at the same time)
- ----------------------------------------------------------------------------------------------------------------------------------
94-27230          Semiconductor package (Making connections directly from chip          Y.W. Heo         94/10/25        P1 86961
pad to PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
94-28218          Method and apparatus of auto supply wafer                             S.Y. Park        94/10/31        P1 37828
- ----------------------------------------------------------------------------------------------------------------------------------
94-29045          Gate insert tip and tool used thereof                                 J.Y. Chung       94/11/2         U1 17395
- ----------------------------------------------------------------------------------------------------------------------------------
94-30309          Driving apparatus of multi magazine for fabrication semiconductor     W.H. Choi        94/11/16        U1 17628
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-30518          Apparatus of inspecting wire bonding of semiconductor package         K.B. Lee         94/11/19        P1 59967
(Making controller in wire bonding machine)
- ----------------------------------------------------------------------------------------------------------------------------------
94-30757          Leadframe (Making identation mark in out lead)                        W.Y. Pyo         94/11/21        U1 23589

- ----------------------------------------------------------------------------------------------------------------------------------
94-31033          Die of forming machine and die tip thereof                            K.H. Lee         94/11/23        U1 17412
- ----------------------------------------------------------------------------------------------------------------------------------
94-31781          Method of adhesive semiconductor package on PCB (Connecting out       J.K. Chun        94/11/29
lead on PCB as a solder ball)
- ----------------------------------------------------------------------------------------------------------------------------------
94-32145          Method of eject marking for die bonding and apparatus thereof         Y.Y. Moon        94/11/30        P1 65765
(Making a circle of pattern on packaging surface)
- ----------------------------------------------------------------------------------------------------------------------------------
94-32146          Ram apparatus of mold (Making respectively supporting ram parts)      Y.Y. Moon        94/11/30        P1 65764
- ----------------------------------------------------------------------------------------------------------------------------------

-15-

37

- ----------------------------------------------------------------------------------------------------------------------------------
94-32642          Ejecting method for die bonding and apparatus thereof                 C.W. Kwak        94/12/3
- ----------------------------------------------------------------------------------------------------------------------------------
94-32909          Automatic strip counter                                               K.D. Lee         94/12/6

- ----------------------------------------------------------------------------------------------------------------------------------
94-33257          Lifter(Making masspoint for carring the objectives)                   K.N. Bae         94/12/8         U1 09535
- ----------------------------------------------------------------------------------------------------------------------------------
94-33288          Method of forming character and figure of tray(Easy to                I. Hang          94/12/8
detach/Attach the character/Figure logo on tray surface)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33423          Structure of hot plate for preheating leadframe (Making groove        B.T. Dho         94/12/9         U1 17452
on hot plate)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33831          Magazine holder structure of leadframe loader                         K.H. Lee         94/12/13        U1 12218
- ----------------------------------------------------------------------------------------------------------------------------------
94-33832          Pusher structure of leadframe loader(Making the sensor for            S.L. Park        94/12/13        U1 29225
loading leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33833          Pusher apparatus of leadframe loader (Making air-cylinder for         W.H. Kung        94/12/13        U1 29221
loading leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33834          Leadframe heater block stracture (Making embossed pattern and         K.H. Lee         94/12/13        U1 17717
fixed gripper heater block)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33835          Semiconductor package (Connecting a plural of signals for             I.K. Park        94/12/13        U1 17716
integrated circuit package)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33931          Gripper apparatus of leadframe loader for semiconductor package       W.H. Kung        94/12/13        P1 38057
- ----------------------------------------------------------------------------------------------------------------------------------
94-33932          Feeding loader apparatus of leadframe loader for semiconductor        S.L. Park        94/12/13        P1 38055
package
- ----------------------------------------------------------------------------------------------------------------------------------
94-33933          Leadframe loader system for semiconductor package                     K.H. Lee         94/12/13        P1 27628
- ----------------------------------------------------------------------------------------------------------------------------------

-16-

38

- ----------------------------------------------------------------------------------------------------------------------------------
94-33934          Megazine holder of leadframe loader for semiconductor package         W.H. Kung        94/12/13        P1 27618
- ----------------------------------------------------------------------------------------------------------------------------------
94-33935          Robot apparatus of leadframe loader for semiconductor package         M.H. Park        94/12/13        P1 27619
- ----------------------------------------------------------------------------------------------------------------------------------
94-33936          Heater block apparatus of leadframe loader for semiconductor package  K.H. Lee         94/12/13        P1 38054
- ----------------------------------------------------------------------------------------------------------------------------------
94-33993          Pad structure of semiconductor package (Making a plural of heat       B.H. Ahn         94/12/14
disppation shapes)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34165          Leadframe for manufacturing semiconductor package (Preventing         D.H. Park        94/12/14        P1 40458
wire shorting)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34170          Heater block of wire bonding for semiconductor package (Making        Y.S. Jung        94/12/14        P1 38056
a plural of embossed pattern on paddle for preventing crack &
distortion)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34332          Heatsink for semiconductor package (Making a circle groved pattern    W.S. Shin        94/12/16        U1 34092
on heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34333          Heatsink for semiconductor package (Making a variety of heatsink      K.S. Jung        94/12/16
for heat disspation)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34334          Structure of leadframe (Making slots on pad for preventing thermal    S.B. Kwak        94/12/16
distortion)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34664          Structure of leadframe for manufacturing semiconductor package        K.S. Jung        94/12/16
(Making a variety of pattern for combining molding resin)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34809          Heater block for wirebonding (Making different steps on heater        J.H. Jo          94/12/17        P1 79472
block)
- ----------------------------------------------------------------------------------------------------------------------------------
94-35635          Structure of leadframe for semiconductor package (Making specific     G. Lee           94/12/21        P1 70022
dambar pattern)
- ----------------------------------------------------------------------------------------------------------------------------------

-17-

39

- ----------------------------------------------------------------------------------------------------------------------------------
94-35636          Device and method of molding semiconductor (Dambarless)               G. Lee           94/12/21        P1 72188
- ----------------------------------------------------------------------------------------------------------------------------------
94-35637          Device and method of molding semiconductor (Making a plural of        I.T. Han         94/12/21        P1 43021
gates for same pressure on molding process)
- ----------------------------------------------------------------------------------------------------------------------------------
94-35246          Apparatus of eliminating particle of apparatus for manufacuring       K.H. Lee         94/12/23        U1 33388
semiconductor package (Making air blower on trim/form appratus)
- ----------------------------------------------------------------------------------------------------------------------------------
94-35247          Cam floater of equipment for fabricating semiconductor package        Y.H. Choi        94/12/23        U1 17627
- ----------------------------------------------------------------------------------------------------------------------------------
94-35248          Stroker of floating bar and index for fabricating semiconductor       K.H. Lee         94/12/23        U1 19164
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35249          Adjusting apparatus of finger pin position for fabricating            K.H. Lee         94/12/23
semiconductor equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35250          Detecting apparatus for setting position of leadframe                 K.H. Lee         94/12/23

- ----------------------------------------------------------------------------------------------------------------------------------
94-35251          Spanking apparatus for fabricating semiconductor equipment            K.H. Lee         94/12/23        U1 17800
- ----------------------------------------------------------------------------------------------------------------------------------
94-35252          Double forming apparatus for fabricating semiconductor equipment      K.H. Lee         94/12/23        U1 23314
- ----------------------------------------------------------------------------------------------------------------------------------
94-35253          Detecting apparatus of mis-alignmented package for fabricating        K.H. Lee         94/12/23        U1 17626
semiconductor equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35254          Semiconductor package guide in semiconductor equipment                K.H. Lee         94/12/23        U1 27109
- ----------------------------------------------------------------------------------------------------------------------------------
94-35255          Feeding apparatus of semiconductor package                            K.H. Lee         94/12/23        U1 26333
- ----------------------------------------------------------------------------------------------------------------------------------
94-35256          Degating apparatus                                                    Y.S. Kim         94/12/23        U1 20491
- ----------------------------------------------------------------------------------------------------------------------------------

-18-

40

- ----------------------------------------------------------------------------------------------------------------------------------
94-35257          Burr pressing apparatus                                               Y.S. Kim         94/12/23        U1 32461
- ----------------------------------------------------------------------------------------------------------------------------------
94-35258          Detecting apparatus of mis-loading tube for fabricating               Y.H. Choi        94/12/23        U1 20490
semiconductor equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35259          Inserting apparatus of package into tube                              K.H. Lee         94/12/23        U1 18231
- ----------------------------------------------------------------------------------------------------------------------------------
94-36206          Forming machine                                                       Y.M. Choi        94/12/23        P1 38840

- ----------------------------------------------------------------------------------------------------------------------------------
94-36207          Apparatus of operating slope cam                                      Y.S. Kim         94/12/23        P1 27785
- ----------------------------------------------------------------------------------------------------------------------------------
94-36208          Tubular feeding method                                                K.H. Lee         94/12/23        P1 37814

- ----------------------------------------------------------------------------------------------------------------------------------
94-36219          Method of coating in semiconductor chip                               K.H. Lee         94/12/23        P1 67143
- ----------------------------------------------------------------------------------------------------------------------------------
94-36220          Coating apparatus for semiconductor package                           K.H. Lee         94/12/23        P1 67142
- ----------------------------------------------------------------------------------------------------------------------------------
94-36221          Loader of feeding for coating equipment                               K.H. Lee         94/12/23        P1 43020
- ----------------------------------------------------------------------------------------------------------------------------------
94-36222          Coating machine for semiconductor package                             M.I. Kim         94/12/23        P1 67144
- ----------------------------------------------------------------------------------------------------------------------------------
94-36223          Machine of coating for semiconductor package                          M.I. Kim         94/12/23        P1 84714
- ----------------------------------------------------------------------------------------------------------------------------------
94-36224          Method of operating coating system                                    M.I. Kim         94/12/23        P1 39266
- ----------------------------------------------------------------------------------------------------------------------------------

-19-

41

- ----------------------------------------------------------------------------------------------------------------------------------
94-37167          Method of marking semiconductor package                               L.H. Kim         94/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
94-37168          Leadframe pad structure (Making x-type paddle for reducing paddle     I.K. Han         94/12/27        P0 201062
dimension)
- ----------------------------------------------------------------------------------------------------------------------------------
94-38872          Structure of molding for semiconductor package (Making champer        Y.Y. Moon        94/12/29        P1 67145
type on the edge of siderail)
- ----------------------------------------------------------------------------------------------------------------------------------
94-39354          Semiconductor package (Consists of metal cap and advanced adhesive)   Y.W. Heo         94/12/30        P1 67141
- ----------------------------------------------------------------------------------------------------------------------------------
95-00812          Jig of inspecting semiconductor package                               S.Y. Lee         95/1/20
- ----------------------------------------------------------------------------------------------------------------------------------
95-00940          Supporting trim die for leadframe                                     I.S. Kim         95/1/20         P1 43139
- ----------------------------------------------------------------------------------------------------------------------------------
95-01928          Apparatus of lead sparking for semiconductor package                  I.S. Kim         95/2/3          P1 43138
- ----------------------------------------------------------------------------------------------------------------------------------
95-06328          Structure of feeding belt for equipment of manufacturing              B.H. Park        95/3/31         U1 29220
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-06329          Apparatus of seperading bottom module                                 B.H. Park        95/3/31         U1 20549
- ----------------------------------------------------------------------------------------------------------------------------------
95-07361          Transfer molding apparatus                                            S.I. Kim         95/3/31         P1 72052
- ----------------------------------------------------------------------------------------------------------------------------------
95-07362          Method and device for forming the lead of PLCC semiconductor package  B.H. Park        95/3/31         P1 72051
- ----------------------------------------------------------------------------------------------------------------------------------
95-07363          Semiconductor leadframe                                               D.M. Moon        95/3/31
- ----------------------------------------------------------------------------------------------------------------------------------
95-09198          Semiconductor package (Connecting between chip and heatsink as PCB)   J.H. Ku          95/4/19
- ----------------------------------------------------------------------------------------------------------------------------------

-20-

42

- ----------------------------------------------------------------------------------------------------------------------------------
95-10418          Method for leveling solder ball array in BGA semiconductor package    Y.W. Heo         95/4/29         P1 79473
- ----------------------------------------------------------------------------------------------------------------------------------
95-15045          A device for heating periphery of semiconductor mold die              C.S. Yoo         95/6/8          P1 45996
- ----------------------------------------------------------------------------------------------------------------------------------
95-16397          Device for loading leadframe and heatspreader                         J.Y. Chung       95/6/20
- ----------------------------------------------------------------------------------------------------------------------------------
95-19581          Method and circuit board structure for leveling solder ball in BGA
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-19582          BGA simiconductor package with improved heat dissipation and          I.K. Shim        95/7/5          P1 59987
dehumidification
- ----------------------------------------------------------------------------------------------------------------------------------
95-19583          Structure of heatsink for semiconductor package (Including Ni &       W.S. Shin        95/7/5          P1 59985
Pd layer for wire bonding easily)
- ----------------------------------------------------------------------------------------------------------------------------------
95-19584          Method of manufacturing semiconductor package (Using solder           W.S. Shin        95/7/5          P0 192226
plating and solder reflow)
- ----------------------------------------------------------------------------------------------------------------------------------
95-21041          Pad structure of leadframe                                            I.K. Han         95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-21042          Leadframe structure (Making the paddle surface like net)              D.H. Park        95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-21043          Heatsink structure (Making groove on heatsink's surface)              S.M. Kim         95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-21044          Identifying mark for P.W.B. strip                                     Y.M. Kim         95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-25172          Thin BGA semiconductor package with exposed heatsink                  I.K. Shim        95/8/16         P1 86759
- ----------------------------------------------------------------------------------------------------------------------------------
95-23884          Structure of semiconductor package (Attaching lead heatsink           W.S. Shin        95/9/4
on lead surface)
- ----------------------------------------------------------------------------------------------------------------------------------
95-28770          Auxiliary oil pressure apparatus of mold press for manufacturing      M.S. Lee         95/9/4
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-21-

43

- ----------------------------------------------------------------------------------------------------------------------------------
95-28772          Bonding method for the semiconductor chips                            S.J. Jang        95/9/4          P1 86752
- ----------------------------------------------------------------------------------------------------------------------------------
95-24350          Device of intergrated circuit and method thereof                      Rorert           95/8/7
- ----------------------------------------------------------------------------------------------------------------------------------
95-29420          Identifying mark for P.W.B strip                                      C.K. Park        95/10/19        U1 43923
- ----------------------------------------------------------------------------------------------------------------------------------
95-29421          Heatsink structure for semiconductor package (Making groove on        C.H. Woo         95/10/19
the below of heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
95-29422          Heatsink structure for semiconductor package                          J.H. Koo         95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-29423          Heatsink structure for semiconductor package (Making groove at        D.B. Kang        95/10/19
dambar/tiebar)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36139          Semiconductor package strip (Forming the rectangular of holes in      D.J. Bae         95/10/19
trim/form process for identifying mark)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36140          Semiconductor L.O.C. package structure                                S.G. Lee         95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-36141          PCB manufacturing method and BGA semiconductor package structure      D.J. Bae         95/10/19
of the same
- ----------------------------------------------------------------------------------------------------------------------------------
95-36142          Tube vibrating device of semiconductor manufacturing equipment        B.S. Bae         95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-36143          Leadframe of semiconductor package (Making notch for preventing       G. Lee           95/10/19
distortion before trim/form process)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36144          Marking method of semiconductor package                               W.S. Shin        95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-36145          Mold die for manufacturing semiconductor package                      L.H. Kim         95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-30143          Heater block structure for wire bonding                               J.M. Kim         95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-30144          Heater block structure for wire bonding                               D.S. Sho         95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------

-22-

44

- ----------------------------------------------------------------------------------------------------------------------------------
95-30145          Dispensing system for die coating                                     B.H. Moon        95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-36947          Solder ball forming method of BGA semiconductor package               I.K. Shim        95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-36948          M.C.M. package                                                        C.K. Park        95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-36949          Magazine fixing device of trim/forming apparatus for manufacturing    B.H. Park        95/10/25        P1 66561
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-36950          Heatsink structure of semiconductor package (Making holes on          J.H. Yun         95/10/25        P0 201063
heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
95-37513          Printed circuit board having epoxy barrier around its throughout      Y.W. Heo         95/10/27        P1 70024
slot and ball grid array semiconductor package using such a printed
circuit board, thereby exhibiting a high moisture discharge
characteristic
- ----------------------------------------------------------------------------------------------------------------------------------
95-33139          Forming punch of manufacturing equipment for semiconductor package    M.S. Moon        95/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
95-33140          Trim die fixing holder of manufacturing equipment for semiconductor   M.S. Moon        95/11/11
package
- ----------------------------------------------------------------------------------------------------------------------------------
95-40842          Automatic speed checking apparatus of transfer ram in mold press      TY JUNG          95/11/11
of semiconductor manufacturing equipment
- ----------------------------------------------------------------------------------------------------------------------------------
95-40843          Semiconductor package forming method                                  M.S. Moon        95/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
95-33944          Supply device of semiconductor package inserted into the tube         K.H. Lee         95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-33945          Semiconductor package lead fixing device                              K.H. Lee         95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-33946          Detecting device for bad tube                                         K.H. Lee         95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-33947          Supply device of semiconductor package tube                           W.H. Choi        95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------

-23-

45

- ----------------------------------------------------------------------------------------------------------------------------------
95-33948          Marking structure in semiconductor package marking equipment          W.H. Choi        95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-41665          Semiconductor package test equipment                                  W.H. Choi        95/11/16        P1 71668
- ----------------------------------------------------------------------------------------------------------------------------------
95-41843          Semiconductor package leadframe manufacturing method and              W.S. Shin        95/11/17        P0 198313
semiconductor package manufacturing process/structure thereof
- ----------------------------------------------------------------------------------------------------------------------------------
95-41844          Semiconductor package structure (Making a variety of chemicals        W.S. Shin        95/11/17
layer for adhesive power)
- ----------------------------------------------------------------------------------------------------------------------------------
95-41845          Semiconductor chip bonding method and structure for using             J.K. Lee         95/11/17        P0 201379
solder ball
- ----------------------------------------------------------------------------------------------------------------------------------
95-41846          Using printed circuit board carrier frame for ball grid array
semiconductor package and method for fabricating ball grid array
semiconductor package using the same
- ----------------------------------------------------------------------------------------------------------------------------------
95-34640          Epoxy mixing apparatus (Using irregular vibration)                    D.Y. Sho         95/11/21
- ----------------------------------------------------------------------------------------------------------------------------------
95-34641          Absorpation block of semiconductor package manufacturing method       D.Y. Sho         95/11/21
of the same
- ----------------------------------------------------------------------------------------------------------------------------------
95-42560          Method and structure for manufacturing heatsink of semiconductor      W.S. Shin        95/11/21
package (Using the method of casting & sintering)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36372          Capillary of bonding device for manufacturing semiconductor package   J.H. Choi        95/11/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-36373          Heatspread safe mounter for semiconductor package                     D.S. Kim         95/11/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-44553          Method and structure for manufacturing semiconductor package (CSP)    W.S. Shin        95/11/29        P1 80280
- ----------------------------------------------------------------------------------------------------------------------------------
95-47009          Method and structure for manufacturing semiconductor package (CSP)    I.T. Han         95/12/6         P1 78626
- ----------------------------------------------------------------------------------------------------------------------------------

-24-

46

- ----------------------------------------------------------------------------------------------------------------------------------
95-38947          Solder ball forming method for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-38855          Leadframe fixing apparatus for semiconductor package                  I.S. Hwang       95/12/7
- ----------------------------------------------------------------------------------------------------------------------------------
95-47349          Solder ball safe mounting device in integrated circuit package        I.S. Hwang       95/12/7         P1 80281
- ----------------------------------------------------------------------------------------------------------------------------------
95-45942          Heater block of apparatus for manufacturing semiconductor package     S.J. Son         95/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
95-48972          Leadframe structure for semiconductor package (Reducing the           S.G. Lee         95/12/27        U0 143373
dimension between paddle and lead)
- ----------------------------------------------------------------------------------------------------------------------------------
95-48973          Pad structure of leadframe (Making spiral shape on leadframe)          D.H. Moon        95/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
95-48974          Pad structure of leadframe                                            I.K. Han         95/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
95-58806          Semiconductor package leadframe with stress absorbing means on        Y.S. Jung        95/12/27        P1 91078
fused leads
- ----------------------------------------------------------------------------------------------------------------------------------
95-58807          Semiconductor package using flip chip technique (CSP)                 D.S. Yoo         95/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
95-58808          Frame structure for cleaning mold die (Anodizing metalliclayer        D.S. Kim         95/12/27
or metallic tape)
- ----------------------------------------------------------------------------------------------------------------------------------
95-58809          Chip size semiconductor package (CSP using substrate attaching        S.G. Lee         95/12/27
anisotropic conductive film and copper foil)
- ----------------------------------------------------------------------------------------------------------------------------------
95-50614          Semiconductor package (Making dam for preventing delamination         W.S. Shin        95/12/28
from the top & bottom of paddle)
- ----------------------------------------------------------------------------------------------------------------------------------
95-50615          Structure of semiconductor package (Paddleless)                       D.H. Moon        95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
95-50616          Semiconductor package (Surrounded by metal-cap at the bottom)         S.M. Kim         95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
95-50617          Leadframe structure for semiconductor packaging having fused area     E.S. Son         95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------

-25-

47

- ----------------------------------------------------------------------------------------------------------------------------------
95-50618          Leadframe structure for semiconductor packaging (Making slots on      E.S. Son         95/12/28
lead tip for reducing thermal stress)
- ----------------------------------------------------------------------------------------------------------------------------------
95-50619          Structure of semiconductor package (Attaching the reliable heatsink)  J.H. Yoon        95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
95-50620          Plug of tube for shipping semiconductor package (Making a             I. Hwang         95/12/28
versatile plug)
- ----------------------------------------------------------------------------------------------------------------------------------
95-61438          Semiconductor package (Making dam for sweeping molding compound)      M.Y. Lee         95/12/28        P1 91076
- ----------------------------------------------------------------------------------------------------------------------------------
95-61439          Structure of heat slug for semiconductor package (Making wings on     J.H. Ku          95/12/28        P1 91077
the peripheral heat plug for gaining locking power)
- ----------------------------------------------------------------------------------------------------------------------------------
95-61440          Method of manufacturing leadframe (Adding thermal process in          W.S. Shin        95/12/28
forming process)
- ----------------------------------------------------------------------------------------------------------------------------------
95-52621          Leadframe structure for semiconductor package (Making tiebar for      K.J. Kim         95/12/29
preventing chip out from chip paddle
- ----------------------------------------------------------------------------------------------------------------------------------
95-52622          Leadframe structure for semiconductor package (Making a lot of        Y.C. Lyu         95/12/29
leads for integrated circuit)
- ----------------------------------------------------------------------------------------------------------------------------------
95-52623          Method for supplying electricity of rectifier during plating          A.K. Kang        95/12/29
process by iron plating
- ----------------------------------------------------------------------------------------------------------------------------------
95-52624          Device for detecting fixed state of leadframe during plating          C.K. Kim         95/12/29
process by iron plating (Attaching the touch sensor at the below of
Iron plating belt)
- ----------------------------------------------------------------------------------------------------------------------------------
95-52625          Structure for preventing grip belt from sagging during plating        A.K. Kang        95/12/29
process by iron plating
- ----------------------------------------------------------------------------------------------------------------------------------
95-52626          Filtering method of plating liquid in plating process                 A.K. Kang        95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------

-26-

48

- ----------------------------------------------------------------------------------------------------------------------------------
95-53421          Pellet kicker structure for manufacturing semiconductor package       Y.J. Kwun        95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53422          Molding apparatus for cutting flash of thin semiconductor package     Y.J. Kwun        95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53423          Ink marking area structure of heatsink for semiconductor package      L.H. Kim         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53424          Structure of semiconductor package for preventing leakage of          D.H. Park        95/12/29
electromagnetic wave
- ----------------------------------------------------------------------------------------------------------------------------------
95-53425          Method of manufacturing chip size semiconductor package               Y.S. Yoon        95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53426          Tray for semiconductor package (Making supporting pole at the         I. Hwang         95/12/29
side of tray)
- ----------------------------------------------------------------------------------------------------------------------------------
95-53427          Heatsink structure for semiconductor package (Making cap type)        S.G. Lee         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53428          Heatsink structure for semiconductor package (Making a lot of         D.B. Kang        95/12/29
stripe on heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
95-53429          Structure of installing pad of cam punch for forming                  H.Y. Lee         95/12/29
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-53430          Structure of controlling position of cam punch for forming            H.Y. Lee         95/12/29
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-53431          Apparatus of operating cam punch for forming semiconductor package    H.Y. Lee         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53432          Structure of cam punch for forming semiconductor package              H.Y. Lee         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53433          Structure of cleaning pad for marking semiconductor package           H.Y. Moon        95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53434          Structure of semiconductor package (tiebarless & downset less)        D.S. Yoo         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-65450          Semiconductor package (CSP: connecting between chip pad and           D.H. Park        95/12/29
bond pad as a gold ball)
- ----------------------------------------------------------------------------------------------------------------------------------

-27-

49

- ----------------------------------------------------------------------------------------------------------------------------------
95-65451          Structure of semiconductor package (CSP)                              S.M. Kim         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-65452          Structure of semiconductor package (Trim-less)                        S.M. Kim         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-65453          Method of coating surface of semiconductor package                    B.H. Ahn         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67199          Cam die for forming semiconductor package                             H.Y. Lee         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67200          Mold die for molding semiconductor package                            D.J. Kim         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67201          Cam punch for forming semiconductor package                           H.Y. Lee         95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67202          Method of adhesive semiconductor chip and structure of                Y.K. Lee         95/12/29
leadframe (QFP)
- ----------------------------------------------------------------------------------------------------------------------------------
95-67203          Structure of leadframe and method of attaching semiconductor          Y.J. Park        95/12/29
package using
- ----------------------------------------------------------------------------------------------------------------------------------
95-67204          Die of cutting lead                                                   J.Y. No          95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67205          Punch of cutting lead                                                 I.K. Ko          95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-55056          Storage box of die-bonded leadframe materials                         M.S. Park        95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-55057          Storage box for leadframe stacked magazine during manufacturing       H.L. Kim         95/12/30
package
- ----------------------------------------------------------------------------------------------------------------------------------
95-55058          Block letter pad attaching structure of marking equipment for         B.H. Park        95/12/30
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-55059          Semiconductor package (Making holes on PKG-body for controlling       D.J. Bae         95/12/30
loading position)
- ----------------------------------------------------------------------------------------------------------------------------------
95-55060          Bend reforming device in PCB frame materials                          Y.S. Hwang       95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69090          Flux spreading method of integrated circuit package                   Y.S. Hwang       95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------

-28-

50

- ----------------------------------------------------------------------------------------------------------------------------------
95-69091          Block letter plate fixing device of marking apparatus for             B.H. Park        95/12/30
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-69092          Marking apparatus for manufacturing semiconductor package             B.H. Park        95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69093          Semiconductor package for using solderballs and leads as I/O          Y.S. Son         95/12/30
terminal
- ----------------------------------------------------------------------------------------------------------------------------------
95-69094          Chip size package structure and manufacturing method thereof          S.H. Ha          95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69095          Chip size package and manufacturing method thereof                    S.H. Ha          95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69096          Chip size package structure and manufacturing method thereof          S.H. Ha          95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69097          Chip size package                                                     K.C. Lee         95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69098          BGA semiconductor package                                             N.H. Kwak        95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69099          Leadframe of semiconductor package (Making double ring for wire       S.D. Lee         95/12/30
bonding easily power bonding and ground bonding)
- ----------------------------------------------------------------------------------------------------------------------------------
95-69100          Package heating method during wire bonding process of                 B.H. Moon        95/12/30
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-69101          Semiconductor package (CSP)                                           Y.M. Kim         95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-05342          Die bonder                                                            C.J. Song        96/2/29         P0189378
- ----------------------------------------------------------------------------------------------------------------------------------
96-05343          Wafer map conversion method                                           C.J. Song        96/2/29         P0192216
- ----------------------------------------------------------------------------------------------------------------------------------
96-05345          Method of producing BGA semiconductor package metal carrier           I.K. Shim        96/2/29         P0192760
frame and BGA package produced by such method
- ----------------------------------------------------------------------------------------------------------------------------------

-29-

51

- ----------------------------------------------------------------------------------------------------------------------------------
96-06302          Method of manufacturing semiconductor package and structure           Y.W. Heo         96/3/11         P0192758
produced by such method (CSP: Making solder bump on chip pad)
- ----------------------------------------------------------------------------------------------------------------------------------
96-06303          Method of forming bump of CSP package (Forming bump on chip pad)      Y.W. Heo         96/3/11         P0192759
- ----------------------------------------------------------------------------------------------------------------------------------
96-09774          Method of manufactuting semiconductor package and structure           Y.W. Heo         96/4/1
produced by such method
- ----------------------------------------------------------------------------------------------------------------------------------
96-09775          Semiconductor package and method of manufacturing the same (BLP)      W.S. Shin        96/4/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-09777          BGA semiconductor package                                             M.E. Lee         96/4/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-09778          Solder ball land metal structure of BGA semiconductor package         M.E. Lee         96/4/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-06892          Structure for connecting mold chase of mold for manufacturing         H.J. Lee         96/4/1          U0146456
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
96-14883          Apparatus for changing fixture of UVO3 automatic cleaner              K.N. Kim         96/6/4          U0148893
- ----------------------------------------------------------------------------------------------------------------------------------
96-14884          Apparatus for controlling width of guide rail in leadframe loader     Y.C. Cho         96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-14885          Leadframe loader                                                      K.N. Kim         96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-14886          Handler apparatus of UVO3 automatic cleaner                           Y.C. Cho         96/6/4          U0148894
- ----------------------------------------------------------------------------------------------------------------------------------
96-19858          Fixture structure of UVO3 automatic cleaner                           K.N. Kim         96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-19859          Loading and unloading apparatus of UVO3 automatic cleaner             Y.C. Cho         96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-19860          UVO3 automatic cleaner apparatus                                      K.N. Kim         96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-16791          Structure of heater block for bonding wire for BGA semiconductor      I.S. Yoon        96/6/20
package
- ----------------------------------------------------------------------------------------------------------------------------------

-30-

52

- ----------------------------------------------------------------------------------------------------------------------------------
96-16792          Mold structure for molding BGA semiconductor package                  I.S. Yoon        96/6/20
- ----------------------------------------------------------------------------------------------------------------------------------
96-16793          Heatsink for semiconductor package                                    B.H. Ahn         96/6/20
- ----------------------------------------------------------------------------------------------------------------------------------
96-22659          Leadframe structure and method of manufacturing semiconductor         S.K. Lee         96/6/20
package using the same (Making supporting poles near by tiebar)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22660          Leadframe pad of semiconductor package for improving molding          K.O. Sohn        96/6/20
reliability (Making a plural of adhesive pattern at the
peripheral of paddle)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22661          Leadframe pad of semiconductor package for improving molding          K.O. Sohn        96/6/20
reliability
- ----------------------------------------------------------------------------------------------------------------------------------
96-22897          Array chip scale semiconductor package                                W.S. Shin        96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22898          Array chip on chip semiconductor package                              I.K. Han         96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22899          Lead array leadframe and semiconductor package using the same         B.J. Han         96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22900          Semiconductor package and method of manufacturing the same            L.H. Kim         96/6/21
(paddleless and tiebarless)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22901          Semiconductor package and method for fabrication the same (CSP)       Y.W. Heo         96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22902          Leadframe structure and semiconductor package using the same          B.H. Ahn         96/6/21         P0198312
(Downset-less)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22903          Method of molding BGA semiconductor attached heatsink                 Y.M. Kim         96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-27617          Structure of socket for BGA semiconductor package                     J.H. Yoon        96/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
96-27618          Leadframe structure and semiconductor package using the same (QFP)    J.H. Yoon        96/7/9
- ----------------------------------------------------------------------------------------------------------------------------------

-31-

53

- ----------------------------------------------------------------------------------------------------------------------------------
96-27619          Purity supply system for building wafer                               Y.W. Kim         96/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
96-29000          Tray for inspecting reliability of semiconductor package              H.S. Jang        96/7/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-29001          Apparatus of inspecting reliability of semiconductor package          H.S. Jang        96/7/18         P182191
- ----------------------------------------------------------------------------------------------------------------------------------
96-21510          Structure of megazine                                                 B.T. Hwang       96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-21511          Ion plating apparatus for semiconductor package                       A.K. Kang        96/7/22         U0149178
- ----------------------------------------------------------------------------------------------------------------------------------
96-21512          Apparatus of inserting semiconductor package                          B.H. Park        96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-21513          Loading apparatus of leadframe in ion plating process                 A.K. Kang        96/7/22         U0146267
- ----------------------------------------------------------------------------------------------------------------------------------
96-29555          Automatic solder ball placement apparatus                             D.S. Cho         96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-29556          Apparatus of loading PCB of automatic solder ball placement system    J.L. Jang        96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-29557          Apparatus of vibrating solder ball mounting members of automatic      D.S. Cho         96/7/22
solder ball placement system
- ----------------------------------------------------------------------------------------------------------------------------------
96-29558          Robot arm apparatus of automatic solder ball placement system         J.Y. Ha          96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-29559          Apparatus of transferring leadframe of making apparatus for           B.H. Park        96/7/22
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
96-30286          Air blow system for semiconductor package                             Y.I. Jang        96/7/25         P0201378
- ----------------------------------------------------------------------------------------------------------------------------------
96-30287          Apparatus for reloading of automatic solder ball placement system     B.P. Jung        96/7/25
- ----------------------------------------------------------------------------------------------------------------------------------
96-30486          Structure of establishing circuit position of mold for                Y.Y. Moon        96/9/21         U145718
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-32-

54

- ----------------------------------------------------------------------------------------------------------------------------------
96-41463          Heatspreader structure (PQIP)                                         S.K. Lee         96/9/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-41464          Stacking BGA semiconductor package                                    S.M. Kim         96/9/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-41465          Circuit board for BGA semiconductor package for testing electric      Y.M. Kim         96/9/21
reliability
- ----------------------------------------------------------------------------------------------------------------------------------
96-41466          Apparatus of testing electric reliability for semiconductor           Y.M. Kim         96/9/21
package (Making prove pin on PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
96-41467          Heatspreader for semiconductor package                                D.Y. Kim         96/9/21         P187801
- ----------------------------------------------------------------------------------------------------------------------------------
96-41468          Semiconductor package structure                                       D.H. Park        96/9/21         P196493
- ----------------------------------------------------------------------------------------------------------------------------------
96-41470          Mold for BGA semiconductor package                                    Y.Y. Moon        96/9/21         P194362
- ----------------------------------------------------------------------------------------------------------------------------------
96-41472          PCB clamping apparatus for molding BGA semiconductor package          Y.Y. Moon        96/9/21         P196494
- ----------------------------------------------------------------------------------------------------------------------------------
96-43841          CSP structure and method of manufacturing the same                    Y.Y. Moon        96/10/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-43842          CSP structure and method of manufacturing the same                    S.K. Lee         96/10/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-43844          BGA semiconductor package                                             S.K. Lee         96/10/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-44452          3th form die holder of trim and form system                           S.K. Lee         96/10/7         P0207341
- ----------------------------------------------------------------------------------------------------------------------------------
96-44453          Singulation die holder of trim and form system                        J.B. Kim         96/10/7         P0207342
- ----------------------------------------------------------------------------------------------------------------------------------

-33-

55

- ----------------------------------------------------------------------------------------------------------------------------------
96-44454          Form die holder of trim and form system                               M.H. Park        96/10/7         P189395
- ----------------------------------------------------------------------------------------------------------------------------------
96-44789          Heatsink-integrated semiconductor package with double                 W.S. Shin        96/10/9
encapsulating parts and method for fabricating the same
- ----------------------------------------------------------------------------------------------------------------------------------
96-46656          Semiconductor package                                                 S.K. Lee         96/10/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-46657          Semiconductor package                                                 S.K. Lee         96/10/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-34290          Wire spool structure of wire bonding apparatus                        S.H. Kim         96/10/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-46948          PCB strip structure and semiconductor package produced by such
method
- ----------------------------------------------------------------------------------------------------------------------------------
96-46949          CSP semiconductor package and method of manufacturing the same        S.K. Lee         96/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
96-47915          Solder bumping apparatus                                              K.H. Lee         96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47916          Apparatus of transferring BGA semiconductor package of solder         K.H. Lee         96/10/24
bumping apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
96-47917          Solder ball mounting apparatus of solder bumping apparatus            K.H. Lee         96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47918          Solder tray apparatus of solder bumping apparatus                     K.H. Lee         96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47919          Apparatus of inspecting adhesion status of solder bumping apparatus   K.H. Lee         96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47920          Solder ball unloading apparatus of solder bumping apparatus           K.H. Lee         96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47921          Apparatus of inspecting solder ball mounting of solder bumping        K.H. Lee         96/10/24
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
96-47922          Loading apparatus of solder bumping apparatus                         K.H. Lee         96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------

-34-

56

- ----------------------------------------------------------------------------------------------------------------------------------
96-49378          Mold for semiconductor package                                        H.Y. Yoo         96/10/29
- ----------------------------------------------------------------------------------------------------------------------------------
96-49379          Semiconductor package (Making at least one of the via-hole at         H.Y. Yoo         96/10/29
the bottom in molding process)
- ----------------------------------------------------------------------------------------------------------------------------------
96-51528          Leadframe for semiconductor package                                   Y.S. Jung        96/11/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-58753          Method of manufacturing leadframe having exposed and arrayed          W.S. Shin        96/11/28
I/O terminal at below surface of semiconductor package(CSP)
- ----------------------------------------------------------------------------------------------------------------------------------
96-58754          Method of manufacturing leadframe having fused solder ball at         W.S. Shin        96/11/28
below surface of semiconductor package(CSP)
- ----------------------------------------------------------------------------------------------------------------------------------
96-58755          Semiconductor package structure(TQFP)                                 W.S. Shin        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58756          CSP structure having bottom lead type                                 W.S. Shin        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58757          Leadframe structure for CSP                                           S.S. Jang        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58758          Method of forming flip chip bump                                      J.H Song         96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58759          Lead on chip area array bumped semiconductor package                  W.S. Shin        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58760          Area array bumped semiconductor package having ground and             W.S. Shin        96/11/28
power lines
- ----------------------------------------------------------------------------------------------------------------------------------
96-58761          Area array bumped semiconductor package having a plurality of         W.S. Shin        96/11/28
chips
- ----------------------------------------------------------------------------------------------------------------------------------
96-58762          Area array bumped semiconductor package having ground and             W.S. Shin        96/11/28
power lines
- ----------------------------------------------------------------------------------------------------------------------------------
96-58800          Wafer transfer apparatus of wafer mounting system                     W.H. Kong        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58801          Alignment of wafer mounting system                                    C.B. Lee         96/11/28        P199821
- ----------------------------------------------------------------------------------------------------------------------------------

-35-

57

- ----------------------------------------------------------------------------------------------------------------------------------
96-58802          Chuck apparatus of wafer mounting system                              W.H. Kong        96/11/28        P199822
- ----------------------------------------------------------------------------------------------------------------------------------
96-58803          Wafer check of wafer mounting system                                  W.H. Kong        96/11/28        P199823
- ----------------------------------------------------------------------------------------------------------------------------------
96-58804          Frame check of wafer mounting system                                  W.H. Kong        96/11/28        P199824
- ----------------------------------------------------------------------------------------------------------------------------------
96-58805          Apparatus of cutting tape of wafer mounting system                    W.H. Kong        96/11/28        P199825
- ----------------------------------------------------------------------------------------------------------------------------------
96-58806          Roller apparatus of wafer mounting system                             C.B. Lee         96/11/28        P199826
- ----------------------------------------------------------------------------------------------------------------------------------
96-58807          Tape transfer apparatus of wafer mounting system                      W.H. Kong        96/11/28        P199827
- ----------------------------------------------------------------------------------------------------------------------------------
96-58808          Tape tension main tenance detaining of wafer mounting system          W.H. Kong        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58809          Station of wafer mounting system                                      W.H. Kong        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58810          Liner of mold for semiconductor package                               Y.Y. Moon        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58811          Loading bar of mold for semiconductor package                         Y.Y. Moon        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58812          PCB of BGA semiconductor package                                      Y.Y. Moon        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58813          PCB of BGA semiconductor package                                      Y.Y. Moon        96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58814          PCB transferring apparatus of forming system for BGA                  Y.Y. Moon        96/11/28
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
96-58815          Cavity plating installation structure of molding device for BGA       Y.Y. Moon        96/11/28        P198031
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-36-

58

- ----------------------------------------------------------------------------------------------------------------------------------
96-58816          Top moiding structure of molding device for BGA semiconductor         Y.Y. Moon        96/11/28        P198032
package
- ----------------------------------------------------------------------------------------------------------------------------------
96-58817          Wafer mounting method and apparatus for semiconductor package         C.B. Lee         96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-61958          Trimming method and apparatus for semiconductor package               HJ Son           96/12/5
- ----------------------------------------------------------------------------------------------------------------------------------
96-61959          Apparatus for inspecting trag inner material                          C.H. Lee         96/12/5
- ----------------------------------------------------------------------------------------------------------------------------------
96-62298          Structure and manufacturing method of CSP                             I.T. Han         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62299          Structure and manufacturing method of CSP                             I.T. Han         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62300          BGA semiconductor package                                             W.Y. Pyo         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62301          Semiconductor package                                                 K.C. Lee         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62302          BGA semiconductor package                                             W.Y. Pyo         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62303          Structure preventing bending effect from semiconductor package        T.B. Jung        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62304          Structure and manufacturing method of CSP                             I.T. Han         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62305          Method for marking poor quality printed
circuit board units of printed circuit
board strip for semiconductor package and
the printed board strip
- ----------------------------------------------------------------------------------------------------------------------------------
96-62307          The Structure of semiconductor package(The dual type of BGA package)  W.S. Shin        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62308          The Structure of semiconductor package(Stacking chip on leadframe)    W.S. Shin        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62309          The molding method of semiconductor package                           W.S. Shin        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62310          Structure of semiconductor package with good heat dissipation         W.S. Shin        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------

-37-

59

- ----------------------------------------------------------------------------------------------------------------------------------
96-62311          Cleaning method of die                                                B.H. Moon        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62312          Manufacturing method of leadframe and CSP using the same              W.S. Shin        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62313          The structure and manufacturing method of CSP                         W.S. Shin        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62314          The structure of  leadframe and semiconductor package using the same  I.S. Yoon        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62315          The structure of leadframe for semiconductor package                  S.M. Seo         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62316          Bond-pad structure of semiconductor chip                              J.H. Song        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62317          Lead-finger structure of flip-chip board                              S.M. Seo         96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62318          The structure of flip-chip board                                      J.H. Song        96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-65236          Structure and method of BGA semiconductor package with heatsink       I.K. Shim        96/12/13
- ----------------------------------------------------------------------------------------------------------------------------------
96-65237          Semiconductor package                                                 S.K. Lee         96/12/13
- ----------------------------------------------------------------------------------------------------------------------------------
96-68819          Nonfunctional metal in clamping area                                  Y.M. Kim         96/12/20
- ----------------------------------------------------------------------------------------------------------------------------------
96-68820          Structure and manufacturing method of semiconductor package           J.H. Yoon        96/12/20
(Installing luminous diode in chip for malfunctional test)
- ----------------------------------------------------------------------------------------------------------------------------------
96-74111          The structure of leadframe and semiconductor package using the same   J.H. Yoon        96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74112          Structure and manufacturing method of CSP with pin grid array         J.H. Yoon        96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74113          Structure and manufacturing method of semiconductor package           J.H. Yoon        96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74114          Structure and manufacturing method of semiconductor package           J.H. Yoon        96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------

-38-

60

- ----------------------------------------------------------------------------------------------------------------------------------
96-74115          Structure and manufacturing method of semiconductor package           J.H. Yoon        96/12/27
(Attaching internally double chip on leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
96-74116          The solderball land of PCB for semiconductor package                  M.E. Lee         96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74117          The structure of PCB for BGA semiconductor package                    Y.W. Heo         96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74118          Attaching apparatus of solderball for integrated circuit package      Y.W. Heo         96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74119          The structure of semiconductor package                                D.B. Kang        96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-64037          Heatspreader for semiconductor package                                L.H. Kim         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77898          BGA semiconductor package built-in carrier frame                      I.K. Shim        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77899          BGA semiconductor package with carrier frame                          I.K. Shim        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77900          Flexible circuit board of die flag for BGA semiconductor package      I.K. Shim        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77901          Flexible circuit board of die flag for BGA semiconductor package      Y.W. Heo         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77902          Flexible circuit board of die flag for BGA semiconductor package      Y.W. Heo         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77903          Molding apparatus for area array bumped semiconductor package         W.S. Shin        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77904          The structure of leadframe paddle                                     D.H. Moon        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77905          Apparatus dispensing epoxy for semiconductor package                  D.H. Moon        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77906          Apparatus dispensing epoxy for semiconductor package                  W.S. Shin        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77907          The structure of leadframe                                            J.J. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77908          Plasma cleaner for semiconductor apparatus                            S.H. Ha          96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------

-39-

61

- ----------------------------------------------------------------------------------------------------------------------------------
96-77909          Plasma cleaner for semiconductor apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
96-77915          Attaching method and structure for semiconductor package              M.H. Park        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77916          Printed circuit board for BGA semiconductor package                   J.H. Ku          96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77917          The structure of non conductive surface for semiconductor package     J.Y. Chung       96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77918          Semiconductor package                                                 J.Y. Chung       96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77919          Leadframe for semiconductor package                                   J.H. Cho         96/12/30        P199829
- ----------------------------------------------------------------------------------------------------------------------------------
96-77920          Printed circuit board for BGA semiconductor package                   L.H. Kim         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77921          The apparatus of die-bonding                                          B.S. Kim         96/12/30        P0206515
- ----------------------------------------------------------------------------------------------------------------------------------
96-77922          Printed circuit board for BGA semiconductor package                   Y.M. Kim         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77923          Back-end auto-inspection system for BGA semiconductor package         K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77924          The apparatus providing PCB in back-end auto inspection system        K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77925          PCB guide in back-end auto inspection system                          K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77926          Inspection apparatus in back-end auto-inspection system               K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77927          The apparatus transferring PCB in back-end auto-inspection system     S.H. Jang        96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77928          The apparatus outleting PCB in back-end auto-inspection system        K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77929          Turn-guide of PCB in back-end auto-inspection system                  K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------

-40-

62

- ----------------------------------------------------------------------------------------------------------------------------------
96-77930          Grip apparatus of PCB in back-end auto-inspection system              K.H. Lee         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77931          The structure of PCB for BGA semiconductor package                    S.M. Kim         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77932          The enlarged scale semiconductor package                              J.Y. Chung       96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77933          Structure and method of heatspreader coating surface                  L.H. Kim         96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-01592          Structure and method of CSP                                           I.K. Shim        97/1/21
- ----------------------------------------------------------------------------------------------------------------------------------
97-02504          The sigulration method of BGA semiconductor package                   Y.W. Heo         97/1/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-02259          Magazine (Making safely stacked guide ring)                           B.S. Park        97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04432          Semiconductor package (PGA)                                           Y.S. Sohn        97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04433          Semiconductor package (Using the pin-type of metal sheet)             Y.S. Sohn        97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04434          The marking method of semiconductor package                           Y.S. Sohn        97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04435          The method of forming solder-ball land and BGA semiconductor          S.J. Kim         97/2/14
package including the same
- ----------------------------------------------------------------------------------------------------------------------------------
97-04436          The mounting method of semiconductor package                          K.C. Lee         97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-02323          The structure of printed circuit board                                Y.M. Kim         97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04652          Structure and manufacturing method for flip-chip semiconductor        S.J. Kim         97/2/17
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-04653          BGA semiconductor package                                             W.Y. Pyo         97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04654          Metallic semiconductor package (CSP)                                  Y.M. Kim         97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04655          Structure and manufacturing method of CSP                             Y.M. Kim         97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------

-41-

63

- ----------------------------------------------------------------------------------------------------------------------------------
97-04657          Ball grid array semiconductor package                                 S.S. Cha         97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04870          CSP semiconductor package  using flexible circuit board               I.K. Shim        97/2/18
- ----------------------------------------------------------------------------------------------------------------------------------
97-04871          CSP semiconductor package  using rigid-flex printed circuit board     I.K. Shim        97/2/18
- ----------------------------------------------------------------------------------------------------------------------------------
97-06062          The structure of semiconductor package                                Y.W. Heo         97/2/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-06063          Structure and manufacturing method of semiconductor package (CSP)     Y.W. Heo         97/2/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-16918          Input/ouput pad alignment                                             D.H. Park        97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-16919          CSP semiconductor package  using lead on chip                         I.T. Han         97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-16920          The structure of leadframe                                            I.T. Han         97/5/1

- ----------------------------------------------------------------------------------------------------------------------------------
97-09726          The structure of inner-lead clamp                                     S.H. Kim         97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-09727          Wire-bonding apparatus and spool holder                               J.H. Choi        97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-18551          Semiconductor package (Attaching heatsink on the top of chip)         W.Y. Pyo         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18552          Semiconductor package and the method using the same (Eliminating      W.M. Yang        97/5/13
die attaching process)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18553          Semiconductor package (Positioning closely bending innerlead          C.H. Lee         97/5/13
for heat dissipation)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18554          The card structure for packaging directly chip                        S.G. Lee         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18555          Semiconductor package (Attaching adhesive tape on heatsink for        K.J. Kim         97/5/13
preventing shorting)
- ----------------------------------------------------------------------------------------------------------------------------------
97-10616          A tray for storing semiconductor chip                                 S.M. Seo         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------

-42-

64

- ----------------------------------------------------------------------------------------------------------------------------------
97-10617          A tray for storing semiconductor chip                                 S.M. Seo         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-10618          A tray for storing semiconductor chip                                 J.H. Song        97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18506          CSP semiconductor package                                             S.G. Lee         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18507          Semiconductor package (Attaching the leadframe of array type at       S.G. Lee         97/5/13
the bottom of package)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18508          Method and structure recognizing leadframe for wire bonding           J.W. Park        97/5/13
(Making identification mark at one of the outline leads)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18622          Magazine for semiconductor package                                    Y.Y. Moon        97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18623          Semiconductor package (Making test terminals in circuit test)         W.S. Shin        97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18624          Semiconductor package (BGA)                                           W.S. Shin        97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18625          The heater block apparatus of loading leadframe for                   S.W. Han         97/5/13
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-18626          Semiconductor package (Attaching heatsink patterned by                S.K. Lee         97/5/13
protrusion shape)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18627          Semiconductor package and molding device                              W.S. Shin        97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18628          Printed circuit board for semiconductor package                       Y.M. Kim         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18629          Semiconductor package (Attaching coupling agent for preventing        W.S. Shin        97/5/13
crack & popcorn from PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
97-10650          Leadframe for semiconductor package                                   D.Y. Kim         97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-14577          The cleaning apparatus of marking pad                                 Y.K. Kwak        97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-14578          Inspection apparatus and turning structure for manufacturing          Y.K. Kwak        97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-43-

65

- ----------------------------------------------------------------------------------------------------------------------------------
97-14579          Pushing road apparatus for manufacturing semiconductor package        C.H. Ko          97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-14580          Marking apparatus for manufacturing semiconductor package             K.N. Kim         97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-14581          The bottom structure of die for manufacturing semiconductor           K.N. Kim         97/6/17
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25115          Marking apparatus for manufacturing semiconductor package             H.K. Yang        97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-25116          Rotary table apparatus of marking machine for manufacturing           K.N. Kim         97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25117          Input/ouput magazine apparatus for manufacturing semiconductor        H.K. Yang        97/6/17
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25118          Transferring apparatus of marking device for manufacturing            K.H. Kim         97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25119          Turning apparatus of marking device for manufacturing                 Y.C. Cho         97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-17040          Thermalsetting oven apparatus for semiconductor package               B.H. Moon        97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-17041          Trim/form apparatus for manufacturing semiconductor package           J.Y. Ha          97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-17042          Tube apparatus for manufacturing semiconductor package                J.Y. Ha          97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-29850          Bond-pad structure for semiconductor chip                             J.Y. Chung       97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-29851          The controlling device of marking apparatus                           H.W. Kim         97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-31735          A microscope for inspecting wafer                                     J.H. Choi        97/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
97-31960          A cleaning device of semiconductor package                            B.S. Bea         97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------

-44-

66

- ----------------------------------------------------------------------------------------------------------------------------------
97-32795          Pattern recognition system and recognition method of ground           W.M. Yang        97/7/15
bonding location thereof
- ----------------------------------------------------------------------------------------------------------------------------------
97-32796          Inner lead clamp construction of wire bonding system for              S.J. Kim         97/7/15
manufacturing semiconductor package and wire bonding method thereof
- ----------------------------------------------------------------------------------------------------------------------------------
97-26952          Solder ball box of ball bumping system                                B.S. Bae         97/6/24

- ----------------------------------------------------------------------------------------------------------------------------------
97-30513          The electrode tip mount of the wire-bonding system for                J.H. Choi        97/7/1
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-31199          The marking head in ink-marking system for semiconductor packages     K.C. Park        97/7/5
- ----------------------------------------------------------------------------------------------------------------------------------
97-18255          The heater block of wire-bonder for semiconductor package             S.H. Kim         97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-18256          The setting-gauge for capillary in wire bonder                        S.H. Kim         97/7/10

- ----------------------------------------------------------------------------------------------------------------------------------
97-18257          The wire spool holder of the wire-bonder                              S.H. Kim         97/7/10

- ----------------------------------------------------------------------------------------------------------------------------------
97-18258          The wire-supply device of the wire-bonder                             S.H. Kim         97/7/10

- ----------------------------------------------------------------------------------------------------------------------------------
97-32093          Removing method and apparatus for the heat from heater block          S.H. Kim         97/7/10
in the wire bonder
- ----------------------------------------------------------------------------------------------------------------------------------
97-34517          The solder ball bumping system for BGA semiconductor packages         K.H. Lee         97/7/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-34518          The input apparatus of the solder ball bumping system for BGA         K.H. Lee         97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34519          The pusher of the solder ball bumping system for BGA                  K.H. Lee         97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34520          The flow apparatus of the solder ball bumping system for BGA          K.H. Lee         97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------

-45-

67

- ----------------------------------------------------------------------------------------------------------------------------------
97-34521          The table of ther solder ball bumping system for BGA                  K.H. Lee         97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34522          The material setting apparatus of the solder ball bumping             K.H. Lee         97/7/23
system for BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34523          The printer of the solder ball bumping system for BGA                 K.H. Lee         97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34524          The solder ball supply apparatus of the solder ball bumping           K.H. Lee         97/7/23
system for BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34525          The sensing apparatus of double ball in the solder ball bumping       K.H. Lee         97/7/23
system for BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34526          The solder ball tool of the solder ball bumping system for            K.H. Lee         97/7/23
BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34527          The PCB-exhauster for solder ball bumping system of BGA               K.H. Lee         97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-19772          Magazine of semiconductor packages                                    J.Y. Chung       97/7/25
- ----------------------------------------------------------------------------------------------------------------------------------
97-18629          Dotted epoxy inspection system of die bonder for manufacturing        J.J. Chun        97/7/15
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-18630          Wire spool construction system for manufacturing semiconductor        S.H. Kim         97/7/15
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-36487          Pattern recognition system for leadframe and its control method       H.K. Joh         97/7/31
- ----------------------------------------------------------------------------------------------------------------------------------
97-39483          The inspection system for BGA semiconductor packages                  C.B. Lee         97/8/20
- ----------------------------------------------------------------------------------------------------------------------------------
97-39484          The supply device of inspection system for BGA semiconductor          S.H. Jang        97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------

-46-

68

- ----------------------------------------------------------------------------------------------------------------------------------
97-39485          The griper of inspection system for BGA semiconductor packages        H.D. Lee         97/8/20
- ----------------------------------------------------------------------------------------------------------------------------------
97-39486          The material feed device of inspection system for BGA                 S.K. Kim         97/8/20
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39487          The flow device of inspection system for BGA semiconductor            H.H. Park        97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39488          The flow device of inspection system for BGA semiconductor            H.H. Park        97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39489          The select device of inspection system for BGA semiconductor          H. Cho           97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39490          The material feed tray for BGA semiconductor packages                 M.E. Lee         97/8/20
- ----------------------------------------------------------------------------------------------------------------------------------
97-22674          Operation system of microscope to wafer inspection                    J.H. Choi        97/8/21
- ----------------------------------------------------------------------------------------------------------------------------------
97-10103          Method of decreasing bending for integrated circuit package (BGA)     Y.W. Heo         97/3/24         P122847
- ----------------------------------------------------------------------------------------------------------------------------------
97-21289          The guide-device of leadframe in trim-form-system for                 K.C. Park        97/8/1
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-25666          The property remove tray of BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25668          The property remove tray of BGA semiconductor package                 W.J. Kang        97/8/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-46504          The mold for semiconductor package                                    J.C. Hong        97/9/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-46505          The heater block of wire-bonding device for semiconductor packages    J.Y. Ha          97/9/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-26383          The epoxy application tool of wafer mounting system off               S.H. Kim         97/9/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------

-47-

69

- ----------------------------------------------------------------------------------------------------------------------------------
97-26384          The epoxy application tool of wafer mounting system off               Y.H. Park        97/9/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-26385          The wafer table establishment structure of wafer mounting             K.B. Choi        97/9/23
system off semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-49085          Cutting device for tie-bar of leadframe                               S.J. Oh          97/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-26791          Structure of a heat slug for semiconductor package                    L.H. Kim         97/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-49241          Structure of a capillary                                              J.Y. Chung       97/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-28504          The package cleaning device of ink marking system for BGA             O.K. Choi        97/10/14
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-52603          Chip ejection method and device for semiconductor packages            D.S. Kim         97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52604          The Top cavity insert structure of mold for semiconductor packages    Y.Y. Moon        97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52605          The mold of semiconductor packages                                    G.J. Kim         97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52606          Marking method and device of marking system for semiconductor         Y.K. Kim         97/10/23
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-52607          Uniformly inking device of marking head in marking system for         Y.K. Kim         97/10/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-52608          The top cavity insert of mold for semiconductor packages              I.S. Kim         97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52609          A Container of wiping fluid for semiconductor packages                Y.J. Han         97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52714          Semiconductor packages                                                J.Y. Chung       97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54505          Tray for storing ball grid array semiconductor package                S. M. Kim        97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------

-48-

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- ----------------------------------------------------------------------------------------------------------------------------------
97-54506          Tube for storing ball grid array semiconductor package                S. M. Kim        97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54508          Ball grid array semiconductor package using a silicon substrate       W.J. Kang        97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54510          Semiconductor package for a flip chip and its manufacturing method    S.J. Kim         97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54511          Printed circuit board of matrix type                                  S.J. Kim         97/10/23
- -----------------------------------------------------------------------------------------------------------------------------------
97-54512          Flattening method of glob top material surface encapsulated for       S.W. Shin        97/10/23
apparatus
- -----------------------------------------------------------------------------------------------------------------------------------
97-54513          Metal mold for manufacturing semiconductor package                    H.J. Lee         97/10/23
- -----------------------------------------------------------------------------------------------------------------------------------
97-54514          Lead frame of semiconductor package                                   S.G. Lee         97/10/23
- -----------------------------------------------------------------------------------------------------------------------------------
97-54515          Marking method of a semiconductor package using a laser beam          S.J. Kim         97/10/23
and its apparatus
- -----------------------------------------------------------------------------------------------------------------------------------
97-29924          Construction of bond roller for wafer mounter                         W.H. Kong        97/10/28
- -----------------------------------------------------------------------------------------------------------------------------------
97-29925          Anti-reverse rotation structure of tape roller for wafer mounter      C.B. Lee         97/10/28
- -----------------------------------------------------------------------------------------------------------------------------------
97-55636          Wafer mounter having function for attaching barcode label of          W.H. Kim         97/10/28
wafer identification number
- -----------------------------------------------------------------------------------------------------------------------------------
97-55637          Wafer mounter for semiconductor equipment                             W.H. Kong        97/10/28
- -----------------------------------------------------------------------------------------------------------------------------------
97-56567          Solder ball array device for ball grid array package                  I.S. Kim         97/10/30
- -----------------------------------------------------------------------------------------------------------------------------------
97-58067          The epoxy tool of die attach device for semiconductor packages        Y.H. Kim         97/11/4
- -----------------------------------------------------------------------------------------------------------------------------------
97-58068          The PCB of BGA semiconductor packages                                 D.Y. So          97/11/4
- -----------------------------------------------------------------------------------------------------------------------------------
97-58069          The Marking test device of semiconductor packages                     N.J. Myoung      97/11/4
- -----------------------------------------------------------------------------------------------------------------------------------

-49-

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- ----------------------------------------------------------------------------------------------------------------------------------
97-58070          The Marking test device of PCB for BGA semiconductor packages         J.H. Choi        97/11/4
- ----------------------------------------------------------------------------------------------------------------------------------
97-63195          Magazine clamp for semiconductor packages                             Y.Y. Moon        97/11/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-63196          Wire bonding sensing method and sensing means of wire bonding         J.H. Choi        97/11/26
device for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-64123          Printed circuit board of wafer taped chip scale package and           S.J. Kim         97/11/28
method of routing it
- ----------------------------------------------------------------------------------------------------------------------------------
97-64124          Dispensing method of glob top for semiconductor package               W.J. Kang        97/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-64125          Ball grid array semiconductor package                                 S.J. Kim         97/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-64126          The mold of chip array ball grid array package and mold               S.J. Kim         97/11/28
structure using the same
- ----------------------------------------------------------------------------------------------------------------------------------
97-64127          Printed circuit board of matrix type and molding method of the same   S.J. Kim         97/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-64128          Mold structure of through gate the for manufacturing                  S.M. Kim         97/11/28
semiconductor package and semiconductor package manufacturing
method using the same
- ----------------------------------------------------------------------------------------------------------------------------------
97-65410          Frame for cleaning mold for manufacturing semiconductor package       H.J. Kim         97/12/2
- ----------------------------------------------------------------------------------------------------------------------------------
97-72033          Solder ball bumping system for manufacturing semiconductor package    Y.C.Cho          97/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
97-72034          Flux dotting device for manufacturing semiconductor package           Y.K. Kwak        97/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
97-72035          Solder ball bumping method of semiconductor package and its           Y.C.Cho          97/12/22
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------

-50-

72

- ----------------------------------------------------------------------------------------------------------------------------------
97-72036          Solder ball mounting method of semiconductor package its apparatus    K.N. Kim         97/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
97-43953          Lead frame structure for semiconductor package                        S.H. Na          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43954          Tape automated bonding tool for a semiconductor chip                  S.G. Ko          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43955          Transducer holder for wire bonding of a semiconductor chip            S.G. Ko          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43956          Magazine structure for safe keeping lead frame                        S.M. Hong        97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43957          Blade construction of deflash apparatus for manufacturing             K.C. Park        97/12/24
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-43958          Structure of trim/form device for manufacturing semiconductor         K.C. Park        97/12/30
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-43959          Mold for manufacturing semiconductor package using a flexible         S.H. Ha          97/12/30
circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
97-43960          Tube changing device for inserting semiconductor package              H.W. Kim         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43961          Structure of singulation die for manufacturing semiconductor          H.W. Kim         97/12/30
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-43962          Capillary for bonding wire of a semiconductor chip                    S.G. Ko          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43963          Mark of tray for semiconductor package                                H.W. Cho         97/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
97-43964          Manufacturing device for semiconductor package                        H.Y. Lee         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43965          Manufacturing device for semiconductor package                        H.Y. Lee         97/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
97-43966          Lead frame of semiconductor package                                   J.H. Cho         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43967          Paddle structure of lead frame for semiconductor package              S.S. Jang        97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------

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73

- ----------------------------------------------------------------------------------------------------------------------------------
97-43968          Paddle structure of lead frame for semiconductor package              S.S. Jang        97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43969          Press system for cutting paddle of lead frame                         D.J. Kim         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79219          Semiconductor package manufacturing method                            K.C. Park        97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79220          Deflash method for manufacturing semiconductor package and its        K.C. Park        97/12/30
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
97-79221          Inspecting equipment for wire bonding of a semiconductor chip         M.S. Shin        97/12/30
and method thereof
- ----------------------------------------------------------------------------------------------------------------------------------
97-79222          Structure of chip array ball grid array semiconductor package         J.Y. Yang        97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79223          Automatic ball size filtering device of solder ball bumping           H.Y. Lee         97/12/30
system for manufacturing semiconductor package and its method
- ----------------------------------------------------------------------------------------------------------------------------------
97-79224          Manufacturing method of semiconductor package                         T.B. Jung        97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79225          Ball grid array semiconductor package using a flexible circuit        S.H. Ha          97/12/30
board
- ----------------------------------------------------------------------------------------------------------------------------------
97-79226          Adhesive layer structure for manufacturing semiconductor package      S.H. Ha          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79227          Attaching method of flexible circuit board on carrier frame for       S.H. Ha          97/12/30
ball grid array semiconductor units
- ----------------------------------------------------------------------------------------------------------------------------------
97-79228          Ball grid array semiconductor package using a flexible circuit        S.H. Ha          97/12/30
board
- ----------------------------------------------------------------------------------------------------------------------------------
97-79229          Solder ball land of ball grid array semiconductor package using       S.H. Ha          97/12/30
a flexible circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
97-79230          Singulation method of ball grid array semiconductor package           S.H. Ha          97/12/30
using a flexible circuit board strip and its apparatus
- ----------------------------------------------------------------------------------------------------------------------------------

-52-

74

- ----------------------------------------------------------------------------------------------------------------------------------
97-79231          Wire bonding apparatus for manufacturing semiconductor packages       C.H. Woo         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79232          Ball grid array semiconductor package using a flexible circuit        S.H. Ha          97/12/30
board and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
97-79233          Picker block of ball bumping system for manufacturing                 H.Y. Lee         97/12/30
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-79234          Structure of chip size semiconductor package and its                  sif, Chowdhury   97/12/30
manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
97-79235          Attaching structure for tube and plug for semiconductor units         J.Y. Ha          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79236          Marking apparatus for manufacturing a semiconductor package           H.Y. Lee         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79237          Flux dotting device of ball bumping system for manufacturing          H.Y. Lee         97/12/30
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-79567          Tube -holder for semiconductor packages                               J.Y. Ha          97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79572          Manufacturing device of semiconductor packages                        G.H. Lee         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79573          Manufacturing device of semiconductor packages                        G.H. Lee         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79574          Manufacturing device of semiconductor packages                        G.H. Lee         97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-50557          Plating method for out leads of a semiconductor package               J.W. Lee         97/9/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-03920          Lead frame of semiconductor package                                   M. Yoo           98/3/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-03926          Electro flame off tip of wire bonding system for manufacturing        J.Y. Chung       98/3/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-09104          Printed circuit board for ball grid array semiconductor package
and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------

-53-

75

- ----------------------------------------------------------------------------------------------------------------------------------
98-09105          Blade structure for sawing semiconductor wafer and sawing method      W.S. Lim         98/3/17
using the same
- ----------------------------------------------------------------------------------------------------------------------------------
98-12364          Semiconductor package                                                 S.G. Lee         98/4/8
- ----------------------------------------------------------------------------------------------------------------------------------
98-06790          Tray loading device of semiconductor package manufacturing            J.I. Oh          98/4/28
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-06791          Ejection device of pick and place system for semiconductor            N.H. Kwak        98/4/28
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
98-06792          Cassette loading device of mounter system for semiconductor           W.H. Kong        98/4/28
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
98-06793          Feeding device of material for semiconductor package manufacturing    N.H. Kwak        98/4/28
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-06794          Magazine fixing device of semiconductor package manufacturing         W.H. Kong        98/4/28
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-06795          Gripper device for semiconductor package manufacturing apparatus      C.B. Lee         98/4/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-06796          Pusher device of semiconductor package manufacturing device           W.H. Kong        98/4/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-06797          Dispenser structure of encapsulation apparatus for manufacturing      S.B. Na          98/4/28
semiconductor
- ----------------------------------------------------------------------------------------------------------------------------------
98-15158          Control method of encapsulation apparatus for manufacturing           G.H. Lee         98/4/28
semiconductor
- ----------------------------------------------------------------------------------------------------------------------------------
98-15159          Mounter device for semiconductor equipment                            C.B. Lee         98/4/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-19303          Molding method of printed circuit board for semiconductor package     S. J. Kim        98/5/27
- ----------------------------------------------------------------------------------------------------------------------------------

-54-

76

- ----------------------------------------------------------------------------------------------------------------------------------
98-19304          Printed Circuit Board                                                 S. J. Kim        98/5/27
- ----------------------------------------------------------------------------------------------------------------------------------
98-09915          Structure of semiconductor package                                    S.G. Lee         98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-09916          Structure of BGA-semiconductor package                                S.J. Kim         98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21719          Winding method for end-wire of wire-spool                             S.H. Kim         98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21720          Semiconductor package                                                 S.J. Son         98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21721          Structure of semiconductor package                                    J.Y. Chung       98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-23666          BGA-semiconductor packages and its manufacturing method               S.S. Cha         98/6/23
- ----------------------------------------------------------------------------------------------------------------------------------
98-12069          Singulation device for manufacturing semiconductor                    J.Y. Chung       98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-12070          A guide rail structure for semiconductor                              Y.Y. Cho         98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-12071          Magazine carrier                                                      J.Y. Ha          98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-12072          Lead frame of semiconductor package                                   J.H. Jeong       98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-27292          Epoxy resin composition for die attachment                            J.S. Kwak        98/7/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-35551          Lead frame structure for semiconductor packages                       Y.Y. Mun         98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35552          Mold structure for semiconductor packages                             Y.Y. Mun         98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35553          Air vent structure of mold for semiconductor packages                 Y.Y. Mun         98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35554          Mold structure for semiconductor packages                             Y.Y. Mun         98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35555          Manufacturing method and mold structure for F-BGA semiconductor       Y.Y. Mun         98/8/31
packages
- ----------------------------------------------------------------------------------------------------------------------------------

-55-

77

- ----------------------------------------------------------------------------------------------------------------------------------
98-35604          Wire bonding method for manufacturing semiconductor package           J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35605          Circuit tape for semiconductor package                                J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35606          Circuit tape for semiconductor package                                J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35607          Circuit tape for semiconductor package                                J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35608          Lamination device of wafer and circuit tape for manufacturing         W.H. Kong        98/8/31
semiconductor package and its method
- ----------------------------------------------------------------------------------------------------------------------------------
98-35609          Attaching device of circuit film and elastomer tape for               W.H. Kong        98/8/31
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35610          Heating and pressure capacity of wafer and circuit tape for           N.H. Kwak        98/8/31
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35611          Cutting device of circuit tape attached to wafer for                  C.B. Lee         98/8/31
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35612          Solder ball land structure of film for semiconductor package          J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35613          Circuit tape applied to manufacture of a semiconductor package        J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35614          Manufacturing method of semiconductor package using a circuit tape    J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35615          Circuit tape for semiconductor package                                J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35616          Circuit tape for semiconductor package                                J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35617          Bonding method of wafer and circuit tape for manufacturing            W.H. Kong        98/8/31
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35618          Circuit tape and wafer bonding apparatus for manufacturing            W.H. Kong        98/8/31
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------

-56-

78

- ----------------------------------------------------------------------------------------------------------------------------------
98-35619          Encapsulation cure method of semiconductor package                    J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35620          Marking method for manufacturing semiconductor package                J.H. Yoon        98/8/31

- ----------------------------------------------------------------------------------------------------------------------------------
98-35621          Solder ball bumping method for manufacturing semiconductor package    J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35622          Bonding method of wafer and circuit tape for manufacturing            J.H. Yoon        98/8/31
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35623          Marking method of semiconductor package                               J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35624          Manufacturing method of semiconductor package                         J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35625          Manufacturing method of semiconductor package                         J.H. Yoon        98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-36897          Printed circuit board for semiconductor package for preventing        S.J. Kim         98/9/8
static electricity
- ----------------------------------------------------------------------------------------------------------------------------------
98-36898          Printed circuit board for semiconductor package for preventing        S.J. Kim         98/9/8
static electricity
- ----------------------------------------------------------------------------------------------------------------------------------
98-37201          Semiconductor device                                                  S.G. Lee         98/9/9
- ----------------------------------------------------------------------------------------------------------------------------------
98-37202          Semiconductor device                                                  S.G. Lee         98/9/9
- ----------------------------------------------------------------------------------------------------------------------------------
98-37203          Molding device of ball grid array semiconductor using a carrier
frame
- ----------------------------------------------------------------------------------------------------------------------------------
98-17327          Method for controlling height of bonding block of did bonder          S.J. Kim         98/9/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-17328          Structure dispenser of resin injection apparatus                      G.H. Lee         98/9/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-17505          Marking device for the lead frame of semiconductor packages           B.S. Chung       98/9/15
- ----------------------------------------------------------------------------------------------------------------------------------
98-17506          Inspection jig for the strip of semiconductor packages                S.J. Kim         98/9/15
- ----------------------------------------------------------------------------------------------------------------------------------

-57-

79

- ----------------------------------------------------------------------------------------------------------------------------------
98-19770          Carrier frame structure for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-19771          Carrier frame structure for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-37969          Lead frame structure of semiconductor packages                        Y.H. Choi        98/9/15
- ----------------------------------------------------------------------------------------------------------------------------------
98-38052          A method for ascer taining wire bonding state of semiconductor        C.S. Seo         98/9/15
package
- ----------------------------------------------------------------------------------------------------------------------------------
98-38258          A method for preventing short of bonding wire between bonding         C.H. Woo         98/9/16
pad and lead finger
- ----------------------------------------------------------------------------------------------------------------------------------
98-38475          Singulation method of ball grid array semiconductor package           K.W. Lee         98/9/17
using flexible circuit board strip
- ----------------------------------------------------------------------------------------------------------------------------------
98-18090          Semiconductor package                                                 S.H Ruy          98/9/22
- ----------------------------------------------------------------------------------------------------------------------------------
98-39241          Mold structure and method for marking COO mark of semiconductor       E.H. Pyo         98/9/22
package using the mold structure
- ----------------------------------------------------------------------------------------------------------------------------------
98-40125          Micro ball grid array semiconductor package                           J.H. Lee         98/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
98-46563          Manufacturing method of circuit board sheet for semiconductor         Y.G. Park        98/10/31
package
- ----------------------------------------------------------------------------------------------------------------------------------
98-46564          Semiconductor device                                                  I.K. Shim        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46565          Semiconductor device                                                  I.K. Shim        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46566          Molding method of semiconductor device                                I.K. Shim        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46567          Manufacturing method of semiconductor package                         B.J. Han         98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46568          Semiconductor Package                                                 Y.G. Park        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46569          Manufacturing method of semiconductor package                         B.J. Han         98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------

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80

- ----------------------------------------------------------------------------------------------------------------------------------
98-46570          Manufacturing method of semiconductor package                         B.J. Han         98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46571          Manufacturing method of semiconductor package                         B.J. Han         98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46572          Semiconductor device                                                  I.K. Shim        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46573          Semiconductor device and its manufacturing method                     I.K. Shim        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46574          Semiconductor package and its manufacturing method                    C.K. Park        98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46847          Manufacturing method and device for semiconductor packages            S.H. Kim         98/11/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-21474          Equipment for fabricating semiconductor package                       S.G. Kim         98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-21475          Equipment for fabricating semiconductor package                       K.N. Kim         98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-21866          Substrate structure for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-47393          Equipment for fabricating semiconductor package                       J.H. Yoon        98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-47394          Equipment for fabricating semiconductor package                       S.B. Na          98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-47395          Method for fabricating semiconductor package                          K.N. Kim         98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-47396          Equipment for fabricating semiconductor package                       Y.K. Kwak        98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-21568          Substrate for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-21569          Structure of flexibility substrate for semiconductor packages         S.H. Ha          98/11/6
- ----------------------------------------------------------------------------------------------------------------------------------
98-47553          Equipment for fabricating semiconductor package                       Y.Y. Cho         98/11/6
- ----------------------------------------------------------------------------------------------------------------------------------
98-21866          Substrate structure for semiconductor packages                        I.G. Han         98/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21867          Sawing wheel for wafer cutting                                        J.Y. Chung       98/11/11
- ----------------------------------------------------------------------------------------------------------------------------------

-59-

81

- ----------------------------------------------------------------------------------------------------------------------------------
98-48927          Structure of flexibility substrate for semiconductor packages         D.S. You         98/11/14
- ----------------------------------------------------------------------------------------------------------------------------------
98-48928          Semiconductor packages and manufacturing method of it                 Chowdhury, Asif  98/11/14
- ----------------------------------------------------------------------------------------------------------------------------------
98-48929          Flexible substrate structure and semiconductor packages and           S.H. Lee         98/11/14
manufacturing method with the structure
- ----------------------------------------------------------------------------------------------------------------------------------
98-49057          Substrate structure and manufacturing for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-49058          Substrate structure and manufacturing method for semiconductor        D.H. Park        98/11/16
packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-49059          Substrate structure and manufacturing method for semiconductor        D.H. Park        98/11/16
packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-49060          Strip with display parts and semiconductor packages with the strip    S.S. Cha         98/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
98-22488          Structure of flexibility substrate for semiconductor packages         S.H. Ha          98/11/18
- ----------------------------------------------------------------------------------------------------------------------------------
98-49887          Semiconductor packages and manufacturing method of it                 C.S. Han         98/11/20
- ----------------------------------------------------------------------------------------------------------------------------------
98-21618          Semiconductor package manufacturing apparatus                         G.H. Lee         98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21619          Semiconductor package manufacturing apparatus                         G.H. Lee         98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21620          Semiconductor package manufacturing apparatus                         H.D. Lee         98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21621          Semiconductor package manufacturing apparatus                         C.H. Ko          98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21622          Semiconductor package manufacturing apparatus                         M.H. Park        98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21623          Semiconductor package manufacturing apparatus                         S.W. Lee         98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21624          Semiconductor package manufacturing apparatus                         C.H. Ko          98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------

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82

- ----------------------------------------------------------------------------------------------------------------------------------
98-47878          Method for fabricating semiconductor package                          E.H. Pyo         98/11/9
- ----------------------------------------------------------------------------------------------------------------------------------
98-47798          A flexible film for semiconductor packges
- ----------------------------------------------------------------------------------------------------------------------------------
98-48046          Semiconductor package and its manufacturing method                    D.H. Park        98/11/10
- ----------------------------------------------------------------------------------------------------------------------------------
98-48047          Semiconductor package                                                 B.Y. Min         98/11/10
- ----------------------------------------------------------------------------------------------------------------------------------
98-48048          Printed circuit board and manufacturing method of printed circuit     B.Y. Min         98/11/10
board and semiconductor package using the printed circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
98-49323          Circuit tape for ball grid array semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-52923          Manufacturing method of semiconductor package                         Y.Y. Cho         98/12/3
- ----------------------------------------------------------------------------------------------------------------------------------
98-52924          Manufacturing method of semiconductor package                         J.H. Lee         98/12/3
- ----------------------------------------------------------------------------------------------------------------------------------
98-54095          Method for fabricating semiconductor package                          S.H. Lee         98/12/10
- ----------------------------------------------------------------------------------------------------------------------------------
98-54999          Wire bonding method of semiconductor device                           S.H. Kim         98/12/15
- ----------------------------------------------------------------------------------------------------------------------------------
98-25418          Flexible circuit board and semiconductor packages using it            I.G. Han         98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-25419          Flexible circuit board structure for semiconductor package            J.E. Hong        98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-55910          Semiconductor package                                                 C.H. Woo         98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-55911          Semiconductor package and its manufacturing method                    S.H. Kim(2)      98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
96-01240          Method of manufacturing chip size semiconductor package               Y.S. Yoon        96/1/22
- ----------------------------------------------------------------------------------------------------------------------------------
98-63124          Semiconductor package                                                 E.S. Sohn        98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-63125          Semiconductor package                                                 S.H. Lee         98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------

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83

- ----------------------------------------------------------------------------------------------------------------------------------
98-63126          Semiconductor package                                                 J.H. Lee         98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-63127          Semiconductor package                                                 D.S. You         98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-63822          Semiconductor package and its manufacturing method                    J.Y. Chung       98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-27353          Circuit tape for semiconductor device                                 J.H. Yoon        98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-60454          Manufacturing apparatus of semiconductor device and punching          J.H. Yoon        98/12/29
method
- ----------------------------------------------------------------------------------------------------------------------------------
98-60456          Wire for semiconductor device                                         J.S. Kwak        98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-62596          Lamination method of semiconductor device and manufacturing           I.K. Shim        98/12/30
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-62597          Test apparatus of semiconductor package and its test method           Y.C. Cho         98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-28225          Wire bonding inspection system for manufacturing semiconductor        S.H. Jang        98/12/31
package
- ----------------------------------------------------------------------------------------------------------------------------------
98-28226          Inspection apparatus of semiconductor device                          G.H. Lee         98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-58837          Device for fabricating semiconductor package                          S.J. Kim         98/12/26
- ----------------------------------------------------------------------------------------------------------------------------------
98-58838          Method for fabricating semiconductor package                          S.H. Kim         98/12/26
- ----------------------------------------------------------------------------------------------------------------------------------
98-59607          PCB board                                                             S.J. Kim         98/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-60431          Structure for mold die in fabrication of semiconductor package        D.J. Kim         98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-60432          Lead frame and semiconductor package with such lead frame             Y.S. Lee         98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-60433          Semiconductor package and method for fabricating the same             I.G. Han         98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-27790          Carrier frame for semiconductor packages                              D.S. You         98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------

-62-

84

- ----------------------------------------------------------------------------------------------------------------------------------
98-27791          Wire bonder capillary                                                 J.Y. Chung       98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-27792          Lead frame for semiconductor packages                                 J.Y. Ha          98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-27793          Magazine for semiconductor packages                                   C.Y. Jang        98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61607          Structure of semiconductor package                                    D.S. You         98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61608          Structure of semiconductor package                                    Y.S. Lee         98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61609          A substrate structure and earthing method for semiconductor           S.J. Kim         98/12/30
packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-61610          Semiconductor packages and manufacturing method of it                 T.B. Jung        98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61611          Cull gripper with output transfer arms of auto molding system         J.U. An          98/12/30
for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-61612          A substrate structure and earthing method for semiconductor packages  S.H. Ha          98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------

Exhibit E, Continued

II. Japanese Patents and Applications

- ------------------------------------------------------------------------------------------------------------------------------------
APPL NO       TITLE                        INVENTOR(S)            FILE DATE    PRIORITY    PRIORITY DATE    PATENT NO    ISSUE DATE
- ------------------------------------------------------------------------------------------------------------------------------------

6-159039      Mold runner removal          Young Wook Heo/        94-7-11      93-15985     3-08-18
from a substrate-based       Il Kwon Shim/
packaged electronic          Bruce J. Freyman/
device                       John Briar
- ------------------------------------------------------------------------------------------------------------------------------------

-63-

85

- ------------------------------------------------------------------------------------------------------------------------------------
6-297411      Method and device for        Goo Lee                96-10-11     93-25829/   93-11-30/        2742514      98-1-30
molding of intergrated                                           94-22439/   94-09-07/
circuit package (Method)                                         94-22625    94-09-07
- ------------------------------------------------------------------------------------------------------------------------------------
6-198341      BGA semiconductor package    Young Wook Heo/        96-8-25      94-2982      /19/93
Il Kwon Shim
- ------------------------------------------------------------------------------------------------------------------------------------
7-153209      Method of reducing           Jae Dong Kim           95-6-20      94-5635/    94-03-21/        2622104      97-4-4
delamination between a                                           94-15873    94-07-02
lead frame and molding
compound
- ------------------------------------------------------------------------------------------------------------------------------------
7-148910      Copper-oxide filled          Choul Woll Kwak        95-6-15      94-13647     4-06-16         2706227      97-10-9
polymer die attach
adhesive composition
for semiconductor
package
- ------------------------------------------------------------------------------------------------------------------------------------
7-153689      Heat spreader suitable for   Myung Jun Lee          95-6-20      94-14028    94-06-21         2592587      96-12-10
commonly used semiconductor
packages having different
pad sizes
- ------------------------------------------------------------------------------------------------------------------------------------
7-220236      Semiconductor leadframe      Won Sun Shin           95-8-29      94-21610/   94-08-30/        2820645
having connection bar                                            94-26326/   94-10-10/
and guide rings                                                  94-25861    94-10-10
- ------------------------------------------------------------------------------------------------------------------------------------

-64-

86

- ------------------------------------------------------------------------------------------------------------------------------------
7-241960      Method for checking wire     Young Wook Heo/        95-9-20      94-24280    94-08-27         2703204      97-10-3
bonding result of BGA        Dong Sin Youm
package
- ------------------------------------------------------------------------------------------------------------------------------------
7-345711      Chip mounting plate          Youn Cheol Yoo/        95-12-12     94-33994/    4-12-14/        2767404      4/10/98
construction of lead         Hee Yeoul Yoo/                      94-37168    94-12-27
frame for semiconductor      Jeong Lee/
package                      Doo Hyun Park/
In Gyu Han
- ------------------------------------------------------------------------------------------------------------------------------------
7-346366      Semiconductor package        Won Sun Shin/          95-12-12     94-34663     4-12-16         2660504      97-6-13
with intergral heat          Byung Tae Do
dissipator
- ------------------------------------------------------------------------------------------------------------------------------------
7-352582      Ball grid array              Il Kwon Shim/          95-12-28     95-19582    95-07-05         2887144
semiconductor packages       Young Wook Heo
with improved heat
dissipation and
dehumidification effect
- ------------------------------------------------------------------------------------------------------------------------------------
7-352583      BGA semiconductor package    Il Kwon Shim           95-12-28     95-25172      /16/95         2727435      97-12-12
having exposed heat sink
- ------------------------------------------------------------------------------------------------------------------------------------

-65-

87

- ------------------------------------------------------------------------------------------------------------------------------------
8-241010      Heat sink-interated          Won Sun Shin           95-8-26      95-28771     5-09-04         Notice of Allowance
semiconductor package
with double encapsulating
parts and method for
fabricating the same
- ------------------------------------------------------------------------------------------------------------------------------------
8-302542      Printed circuit board        Sun Ho Ha/             96-10-28     95-37513     5-10-27         Notice of
having epoxy barrier         Young Wook Heo                                                   Allowance
around a throughout slot
and ball grid array
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
8-182798      Ball grid array              Il Kwon Shim/          96-6-24      95-41438     5-11-15         2881575
semiconductor package        Young Wook Heo
with ring-type heat sink
- ------------------------------------------------------------------------------------------------------------------------------------
8-320732      Semiconductor package        Won Sun Shin/          96-11-15     95-41844/    5-11-17/
provided with heatsink       Won Kyun Lee                        95-44554    95-11-29
and surface treating
method for such a
heat sink
- ------------------------------------------------------------------------------------------------------------------------------------
8-182799      Unit printed circuit board   Il Kwon Shim/          96-6-24      95-41846     5-11-17         Notice of
carrier frame for ball       Young Wook Heo                                                   Allowance
grid array semiconductor
package and method for
fabricating ball grid
array semiconductor
packages using the same
- ------------------------------------------------------------------------------------------------------------------------------------

-66-

88

- ------------------------------------------------------------------------------------------------------------------------------------
8-243997      Process for bonding          Seong Min Seo/         96-8-28      95-42561     5-11-21         2727443      97-12-12
semiconductor chip           Jae Hwan Song
- ------------------------------------------------------------------------------------------------------------------------------------
8-354355      Semiconductor chip scale     Young Wook Heo         96-12-19     95-54765     5-12-12
package and method of
producing such
- ------------------------------------------------------------------------------------------------------------------------------------
8-358683      Semiconductor package        Kil Bum Kim/           96-12-27     95-58806     5-12-27         2779789      98-5-15
lead frame with stress       Young Seok Jung
absorbing means on
fused leads
- ------------------------------------------------------------------------------------------------------------------------------------
8-255585      Wafer map conversion         Chee Jung Song         96-9-5       96-05343     2/29/96
method
- ------------------------------------------------------------------------------------------------------------------------------------
9-19725       Method of producing BGA      Il Kwon Shim/          97-1-17      96-05345     2/29/96         Notice of
semiconductor package        Young Wook Heo                                                   Allowance
metal carrier frame and
BGA package produced by
such method
- ------------------------------------------------------------------------------------------------------------------------------------

-67-

89

- ------------------------------------------------------------------------------------------------------------------------------------
9-23144       Method of forming chip       Young Wook Heo         97-1-22      96-06302/    6-03-11
bumps of bumps chip                                              96-06303
scale semiconductor
package such package
and chip bump
- ------------------------------------------------------------------------------------------------------------------------------------
9-98041       Solder Ball land metal       Moo Eun Lee            97-3-31      96-09778     6-04-01         2860648
structure of ball grid
array semiconductor
package
- ------------------------------------------------------------------------------------------------------------------------------------
9-24274       Grid array type lead         Won Sun Shin/          97-1-23      96-22897/   96-06-21
frame and lead end grid      Byung Joon Han/                     96-22898/
array semiconductor          Ju Hoon Yoon/                       96-22899
package employing the        Sung Bum Kwak/
same                         In Gyu Han
- ------------------------------------------------------------------------------------------------------------------------------------
8-353644      Semiconductor package        Byung Joon Han/        96-12-17     96-22901    96-06-21         2860646
and method for fabricating   Young Wook Heo
the same
- ------------------------------------------------------------------------------------------------------------------------------------
9-275281      Mold for ball grid array     Young Yeop Moon        97-9-22      96-41469/    6-09-21/
semiconductor package                                            70/71/72/    96-11-28
96-58810/
11/15/16
- ------------------------------------------------------------------------------------------------------------------------------------

-68-

90

- ------------------------------------------------------------------------------------------------------------------------------------
9-289089      Semiconductor package        Seon Goo Lee           97-10-6      96-43843/   96-10-04/96-10-18
having light, thin                                               96-46656
simple and compact
structure
- ------------------------------------------------------------------------------------------------------------------------------------
9-304957      Method for reproducing       Sun Ho Ha/             97-10-20     96-46948     6-10-19         2860651
printed circuit boards for   Young Wook Heo/
semiconductor packages       Byung Joon Han
including poor quality
printed circuit board
units and method for
fabricating semiconductor
packages using the
reproduced printed
circuit boards
- ------------------------------------------------------------------------------------------------------------------------------------
9-228831      Method for marking poor      Young Wook Heo/        97-8-11      96-62305     6-12-06
quality printed              Il Kwon Shim
circuit board units of
printed circuit board
strip for semiconductor
packages and the printed
circuit board strip
- ------------------------------------------------------------------------------------------------------------------------------------

-69-

91

- ------------------------------------------------------------------------------------------------------------------------------------
9-368681      Alumina-silicon carbide      Seok Ho Na              97-12-26    96-77897     6-12-30
nanocomposite for ball
bonding capillaries
of wire bonding device
and method of
manufacturing such
- ------------------------------------------------------------------------------------------------------------------------------------
9-233372      Ball grid array              Il Kwon Shim/          97-8-14      96-77898/    6-12-30/97-02-14
semiconductor package        Young Wook Heo/                     96-77899/
with solder balls fused      Robert Frarcis                      97-04430
on printed circuit board     Darveaux
and method for fabricating
the same
- ------------------------------------------------------------------------------------------------------------------------------------
9-159227      Flexible circuit for ball    Il Kwon Shim/          97-6-2       96-77900/    6-12-30
grid array semiconductor     Young Wook Heo/                     96-77901/
package                      Robert Frarcis                      96-77902
Darveaux
- ------------------------------------------------------------------------------------------------------------------------------------
9-368625      Circuit board with           Joong Ho Cho/          97-12-29     96-77919     2/30/96
eye-shaped internal          Young Seok Chung/
circuit tip alignment        Kyung Sook Choi
structure for mounting
electronic components
- ------------------------------------------------------------------------------------------------------------------------------------
10-30663      Method of manufacturing      Il Kwon Shim/          98-1-28      97-02504      /28/97         Notice of
ball grid array              Sun Ho Ha                                                        Allowance
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------

-70-

92

- ------------------------------------------------------------------------------------------------------------------------------------
10-51459      Circuit board                Sang Suk Cha           98-2-17      97-04656      /17/97

- ------------------------------------------------------------------------------------------------------------------------------------
10-58942      Mothod of fobricating        Young Wook Heo         98-2-24      97-06063      /26/97
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
10-334667     Method of molding BGA        SungJin Kim            98-11-25     98-19303,   98-05-27/98-09-08
Semiconductor PKG                                                19304,
36897,36898
- ------------------------------------------------------------------------------------------------------------------------------------
10-346145     PCB for grounding            SungJin Kim            98-11-27     97-64125     1/28/97
BGA Semiconductor PKG
- ------------------------------------------------------------------------------------------------------------------------------------
11-68670      Semiconductor Package        SeonGoo Lee            99-3-15      98-12364      /8/98
- ------------------------------------------------------------------------------------------------------------------------------------

-71-

93

Exhibit E, Continued

III. United States Patents and Applications

- -------------------------------------------------------------------------------------------------------------------------
APPL NO       TITLE                        INVENTOR(S)            FILE DATE    PRIORITY    PRIORITY DATE    ASSIGNEE
- -------------------------------------------------------------------------------------------------------------------------
08/349237     Method and device for        Goo Lee                94-10-5      93-25829/   93-11-30/        Anam & Amkor
molding of intergrated                                           94-22439/   94-09-07/
circuit package(Device)                                          94-22625    94-09-07
- -------------------------------------------------------------------------------------------------------------------------
08/485936     Copper-oxide filled          Choul Woll Kwak        95-6-7       94-13647    94-06-16         Anam & Amkor
polymer die attach
adhesive composition
for semiconductorpackage
- -------------------------------------------------------------------------------------------------------------------------
08/530558     Method for checking wire     Young Wook Heo/        95-9-19      94-24280    94-08-27         Anam & Amkor
bonding result of BGA        Dong Sin Youm
package
- -------------------------------------------------------------------------------------------------------------------------
08/588172     Ball grid array              Il Kwon Shim/          96-1-18      95-19582    95-07-05         Anam & Amkor
semiconductor packages       Young Wook Heo
with improved heat
dissipation and
dehumidification effect
- -------------------------------------------------------------------------------------------------------------------------
08/570849     Bonding method for           Seong Min Seo/         95-12-12     95-28772    95-0904          Anam & Amkor
semiconductor                Sunk Ju Jang
- -------------------------------------------------------------------------------------------------------------------------
08/736107     Printed circuit board        Sun Ho Ha/             96-10-24     95-37513    95-10-27         Anam & Amkor
having epoxy barrier         Young Wook Heo
around a throughout slot
and ball grid array
semiconductor package
- -------------------------------------------------------------------------------------------------------------------------
08/749578     Process for bonding          Seong Min Seo/         96-11-14     95-42561    95-11-21         Anam & Amkor
semiconductor chip           Jae Hwan Song
- -------------------------------------------------------------------------------------------------------------------------
08/704477     Wafer map conversion method  Chee Jung Song         96-8-28      96-05343    96-12-29         Anam & Amkor
- -------------------------------------------------------------------------------------------------------------------------

-72-

94

- -------------------------------------------------------------------------------------------------------------------------
08/775839     Grid array type lead         Won Sun Shin/          96-12-31     96-22897/   96-06-21         Anam & Amkor
frame and lead end grid      Byung Joon Han/                     96-22898/
array semiconductor          Ju Hoon Yoon/                       96-22899
package employing the        Sung Bum Kwak/
same                         In Gyu Han
- -------------------------------------------------------------------------------------------------------------------------
08/763605     Semiconductor package        Byung Joon Han/        96-12-11     96-22901    96-06-21         Anam & Amkor
and method for fabricating   Young Wook Heo
the same
- -------------------------------------------------------------------------------------------------------------------------
09/008552     Semiconductor package        Byung Joon Han/        98-1-16      96-22901    96-06-21         Anam & Amkor
and method for fabrication   Young Wook Heo
the same
- -------------------------------------------------------------------------------------------------------------------------
08/915077     Ball grid array              Il Kwon Shim/          97-8-20      96-77898/   96-12-30/        Anam & Amkor
semiconductor package with   Young Wook Heo/                     96-77899/   97-02-14
solder balls fused on        Robert Frarcis                      97-04430
printed circuit board        Darveaux
and method for fabricating
the same
- -------------------------------------------------------------------------------------------------------------------------
08/883541     Flexible circuit for         Il Kwon Shim/          97-6-25      96-77900/   96-12-30         Anam & Amkor
ball grid array              Young Wook Heo/                     96-77901/
semiconductor package        Robert Frarcis                      96-77902
Darveaux
- -------------------------------------------------------------------------------------------------------------------------
09/013330     Method of manufacturing      Il Kwon Shim/          98-1-26      97-02504     1/28/97         Anam & Amkor
ball grid array              Sun Ho Ha/
semiconductor package        Robert Frarcis
Darveaux
- -------------------------------------------------------------------------------------------------------------------------
09/024940     Method of fabricating        Young Wook Heo         98-2-17      97-06063     2/26/97         Anam & Amkor
semiconductor package
- -------------------------------------------------------------------------------------------------------------------------

-73-

1
EXHIBIT 10.2

EXECUTION COPY

TRANSITION SERVICE AGREEMENT

This Transition Service Agreement ("Agreement") is made and entered into
this 6th day of May, 1999 by and between and Amkor Technology Korea, Inc., a
corporation organized under the laws of the Republic of Korea ("ATK"), and Anam
Semiconductor, Inc., a corporation organized under the laws of the Republic of
Korea ("Anam").

W I T N E S S E T H:

WHEREAS, Anam and Amkor Technology, Inc. ("ATI") have entered into a
certain Asset Purchase Agreement dated as of December 30, 1998 (the "Asset
Purchase Agreement") and an amendment to the Asset Purchase Agreement dated May
3, 1999 (the "Amendment"), pursuant to which ATK and ATI will purchase and
acquire from Anam the assets in K4; and

WHEREAS, in order to support the continued and uninterrupted operation
of K4 from the time of Closing, the parties to the Asset Purchase Agreement and
the Amendment agreed to enter into an arrangement whereby Anam will continue to
provide to ATK certain of its services that have been provided by Anam to K4
prior to the Closing Date, in accordance with the terms and conditions of this
Agreement and Section 4.7 of the Asset Purchase Agreement.

NOW, THEREFORE, in consideration of the mutual covenants, agreements and
obligations set forth herein, the parties hereto agree as follows:

ARTICLE I
DEFINITIONS

Section 1.1. Definitions. Unless otherwise defined in this Agreement,
all of the capitalized terms used in this Agreement shall have the same meanings
as they are defined in the Asset Purchase Agreement.

ARTICLE II
TERM

2

-2-

Section 2.1. Term. The term of this Agreement shall commence on the
Closing Date of the Asset Purchase Agreement (the "Effective Date") and shall
continue until the parties to this Agreement separately agree, unless terminated
on an earlier date pursuant to Article 7 of this Agreement.

ARTICLE III
THE SERVICES

Section 3.1. Services to be provided by Anam. During the term of this
Agreement, Anam shall provide to ATK all of the services and parts and
components currently provided to the Business by Anam including, among other
things, the research and development, accounting, data processing, materials
procurement, electronic data processing, administrative services and all other
such support services as are reasonably required in connection with the
operation of the Business as described in detail in the Schedules attached to
this Agreement (collectively, "Services" and, individually, "Service"), upon the
detailed terms and at the rates specified in such Schedules.

Section 3.2 Services to be Provided.

(a) Anam shall ensure that the Business is continued to be
provided with all of the Services, on the terms and conditions not less
favorable than the terms and conditions pursuant to which such services and
parts and components are now being provided to the Business.

(b) In addition to the Services, Anam shall ensure that all
services currently made available to the employees of the Business including,
without limitation, cafeteria, clinic and human welfare services continue to be
provided to the Transferred Employees on the same terms and conditions as such
services which have been provided to them.

3
-3-

Section 3.3. Specifics and Costs of Services.

(a) The attached Schedules of Services and costs are subject to
change with the parties' mutual written consent. The parties hereto shall use
good faith efforts to discuss any change of charge for a Service; provided,
however, that any occurrence of events and change of circumstances shall not
justify stopping a provision of Services by Anam under this Agreement.

(b) ATK is contracting for use of Anam's system on an "as-is"
basis. After the Closing Date, if there will be any modifications to Anam_s
systems at ATK's request, Anam will make its best efforts to implement such
modifications at an actual cost basis.

(c) If there will be a separation of system at ATK's discretion
for the implementation of ATK's own independent systems, Anam agrees to
cooperate as reasonably requested by ATK in order to effectuate such separation.

Section 3.4. Additional Services. In addition to the Services, the
parties hereto acknowledge that there may be additional services and facilities
which have not been identified herein but which have been used by K4 prior to
the Closing Date and which shall continue to be required or desired by ATK until
the termination of this Agreement, or such later date as the parties may agree
upon. If any such additional services or facilities are identified and requested
by ATK, and Anam agrees to provide such services, ATK will be charged at a rate
to be agreed by Anam and ATK.

ARTICLE IV
PAYMENT AND INVOICE

Section 4.1. Service Fees.

(a) The fees payable by ATK to Anam for the Services shall be as
set forth in Schedules (the "Service Fees").

4
-4-

Notwithstanding anything to the contrary contained herein, ATK shall not be
charged under this Agreement for any Service that is specifically required to be
performed under any other agreement between Anam and ATK and any such other
Service shall be performed and charged for in accordance with the terms of such
other agreement.

(b) In the event that a Service commences, expires or terminates
on any day other than the first day of a calendar month, the applicable Service
Fee shall be calculated on a pro rata basis based on the actual number of days
during which the Service was provided and a month of 30 days.

Section 4.2. Payment.

(a) Anam shall invoice ATK monthly in arrears within fifteen (15)
calendar days of the end of the month in question in relation to an amount
payable for the Services provided to ATK during such month. ATK shall pay an
amount invoiced by Anam and any sales, value-added or similar taxes on any
amounts to be paid to Anam hereunder in full within thirty (30) calendar days of
the date of receipt of Anam's invoice.

(b) Other than the Service Fees, no cost or expense, including
any out-of-pocket expense paid to a third party by Anam as result of Services
provided hereunder by Anam to ATK, shall be charged separately to ATK.

ARTICLE V
WARRANTIES

Section 5.1. Express Warranties. Anam warrants that the Services under
this Agreement shall be of substantially the same type and quality as have been
provided for the benefit of K4 prior to the Effective Date, and shall be of such
type and quality as are reasonably required to appropriately operate K4 in a
commercially reasonable manner.

5
-5-

ARTICLE VI
INDEMNITY; LIMITATION OF LIABILITY

Section 6.1. Indemnity. Anam shall indemnify and hold harmless ATK from
and against any loss, demand, liability, claim, cost or expense of whatever kind
(collectively, "Damages") arising from and incurred by ATK due to the negligence
or willful misconduct of Anam or its personnel assigned for the Services under
this Agreement.

Section 6.2 Survival. The provisions of this Article VI shall survive
the termination of this Agreement.

ARTICLE VII
TERMINATION

Section 7.1. Termination.

(a) This Agreement may be terminated with respect to all or a
portion of the Services at any time as follows:

(i) by mutual written agreement of the parties;

(ii) at the written election of one party, in the event of
a material default by the other party of its obligations
hereunder, which default shall not have been cured within
sixty (60) calendar days after written notice given by the
non-defaulting party to the defaulting party; or

(iii) at the written election of one party, in accordance
with Section 8.1(d).

(b) ATK may terminate any Service(s) provided pursuant to this
Agreement on ninety (90) days prior written notice to Anam, unless otherwise
specified in Schedules. If ATK elects to terminate a Service, it will bear the
costs of interfacing any new

6
-6-

system to the remaining Anam systems which it continues to use. ATK shall no
longer be obligated to pay Anam the Service Fees attributable to such canceled
Service(s) following the effective termination date of such Service(s) provided
that ATK fully pays any and all Service Fees, charges or other similar payment
due and accrued in connection with Service(s) provided up to and including the
effective termination date.

(c) No termination of this Agreement (including any early
termination of a Service pursuant to paragraph (b) above) shall discharge,
affect or otherwise modify in any manner the rights and obligations of the
parties hereto which have accrued or have been incurred prior to such
termination, including, without limitation, the obligation of ATK to pay Anam
any and all amounts payable hereunder for, or related to, the Services
theretofore provided.

ARTICLE VIII
FORCE MAJEURE

Section 8.1. Force Majeure.

(a) A party is not liable for a failure to perform any of its
obligations under this Agreement insofar as it proves that the failure was due
to an impediment beyond its reasonable control.

(b) An impediment within paragraph (A) above may result from
events including, but not limited to, (i) war, whether declared or not, riots,
acts of sabotage, explosions, fires, destruction of equipment/machines, or
inability to obtain raw materials, (ii) natural disasters, such as violent
storms, earthquakes, floods and destruction by lightning, (iii) the intervention
of any Governmental Authority, and (iv) boycotts, strikes and lock-outs of all
kinds and work-stoppages.

(c) A party seeking relief hereunder shall as soon as practicable
after the impediment and its effects upon its ability

7
-7-

to perform became known to it give notice to the other party of such impediment.

(d) If the grounds for relief subsist for [ninety (90)] days or
more, either party shall be entitled to terminate this Agreement with written
notice to the other party pursuant to Article 5.

ARTICLE IX
MISCELLANEOUS

Section 9.1. Notices. All notices, reports and other written
communications permitted or required to be delivered by the provisions of this
Agreement shall be delivered to the party due to receive such notice, report, or
other written communication personally, by facsimile or by air courier service
at the relevant address set out below or such other address as the party may
specify by notice to the other:

to Anam:  Anam Semiconductor, Inc.
280-2, 2-ga, Sungsu-dong
Sungdong-gu, Seoul 133-706 Korea
Attn: K.H. Kim

to ATK:   Amkor Technology Korea, Inc.
Advanced Science & Industrial Complex, 2 block
Daechon-dong, Buk-gu, Kwangju 500-470 Korea
Attn: Michael D. O'Brien

Section 9.2. Governing Law and Jurisdiction. This Agreement and the
terms and conditions hereof shall be governed by and construed and interpreted
in accordance with the laws of the Republic of Korea. Any and all disputes which
may not be amicably settled by the parties shall be subject to the non-exclusive
jurisdiction of the Seoul District Court, and Anam and ATK each hereby agree and
consent to be subject to the jurisdiction of such court.

8
-8-

Section 9.3. Effectiveness. The parties' obligations under this
Agreement are conditioned upon the Closing, the occurrence of which is subject
to various conditions set forth in the Asset Purchase Agreement. This Agreement
shall become operative if and when the Closing occurs and shall be null and void
if this Closing does not occur for any reason.

Section 9.4. Headings. The headings in this Agreement are inserted for
convenience only and are in no way intended to describe, interpret, define or
limit the scope, extent or intent of this Agreement or any provisions hereof.

Section 9.5. Amendment; Waiver. Any provision of this Agreement may be
amended or waived if, and only if, such amendment or waiver is in writing and
signed, in the case of an amendment, by Anam and ATK, or in the case of a
waiver, by the party against whom the waiver is to be effective. No failure or
delay by any party in exercising any right, power or privilege hereunder shall
operate as a waiver thereof nor shall any single or partial exercise thereof
preclude any other or further exercise thereof or the exercise of any other
right, power or privilege.

Section 9.6. Severability. If any provision of this Agreement or the
application thereof to any person or circumstance shall be deemed invalid,
illegal or unenforceable to any extent or for any reason, such provision shall
be severed from this Agreement and the remainder of this Agreement and the
application thereof shall not be affected and shall be enforceable to the
fullest extent permitted by law. A provision which is valid, legal and
enforceable shall be substituted for the severed provision.

Section 9.7. Parties in Interest. This Agreement shall inure to the
benefit of and be binding upon the parties and their respective successors and
permitted assigns. Nothing in this Agreement, express or implied, is intended to
confer upon any Person other than Anam or ATK, or their successors or permitted
assigns, any rights or remedies under or by reason of this Agreement.

Section 9.8. Counterparts. This Agreement may be executed in one or more
counterparts, each of which shall be deemed an original, and all of which shall
constitute one and the same agreement.

Section 9.9. Entire Agreement. This Agreement, the Asset

9
-9-

Purchase Agreement and the other agreements referred to in the Asset Purchase
Agreement contain the entire agreement between the parties hereto with respect
to the subject matter hereof and supersede all prior agreements and
understandings, oral or written, with respect to such matter.

Section 9.10. Relationship of the Parties. Anam shall perform all
Services hereunder as an independent contractor. This Agreement does not create
a fiduciary or agency relationship between Anam and ATK, each of which shall be
and at all times remain independent companies for all purposes hereunder.
Nothing in this Agreement is intended to make either party a general or special
agent, joint venturer, partner or employee of the other for any purpose.

Section 9.11. Assignment. Neither party to this Agreement may assign any
of its rights or obligations under this Agreement, without the prior written
consent of the other party hereto.

Section 9.12. Fulfillment of Obligations. Any obligation of any party to
any other party under this Agreement, which obligation is performed, satisfied
or fulfilled by an Affiliate of such party, shall be deemed to have been
performed, satisfied or fulfilled by such party.

Section 9.13. Public Announcement. Prior to the Closing, neither Anam
nor ATK shall, without the approval of the other party hereto, make any press
release or other public announcement concerning the terms of the transactions
contemplated by this Agreement, except as may be required to comply with
requirements of any applicable Laws, and the rules and regulations of any stock
exchange upon which the securities of one of the parties is listed, in which
case the party shall use its Best Efforts to advise the other party thereof and
the parties shall use their Best Efforts to cause a mutually agreeable release
or announcement to be issued; provided that the foregoing shall not preclude
communications or disclosures necessary to implement the provisions of this
Agreement.

10

IN WITNESS WHEREOF, the parties have caused this Agreement to be duly
executed in counterparts the day and year first written above.

ANAM SEMICONDUCTOR, INC.

By: /s/
---------------------------

Name:
-------------------------

Title:
------------------------

AMKOR TECHNOLOGY KOREA, INC.

By: /s/
---------------------------

Name:
-------------------------

Title:
------------------------

11

Schedule A

PLANNING SERVICES

A.      Contents of Services

This Service includes budget and investment control, performance
evaluation, projection of annual business plan, collection of data &
information, government & public relations. Details of the services that
will be provided to ATK are as follows:

_      Provide a guide line for investment and budget, including review
of the feasibility of proposed investments;

_      Provide annual business plan, which involves the following year_s
P&L projection, investments plan, resources, and related matters;

_      Collect and provide an internal and external data and
information, including the data and information regarding yield
rate, cost, turnover rate, investment status, semiconductor
market overview, new package trend, customer related information,
etc;

_      Provide services relating government relation; and

_      Provide company related news and advertisement to the public
whenever it is necessary.

B.      Service Fee

Fee to be paid by ATK per month shall be US$40,250 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 7
employees of Anam out of 24 employees working for planning service are
exclusively assigned for the service to ATK.

12

Schedule B

SPECIAL CUSTOMER SERVICES

A.      Contents of Service

This Service is for the biggest customer of ATK, Intel. The services
includes quality improvement of Intel products, cost reduction
follow-up, critical part inventory, maintain direct communication with
Intel, and all related matters.

B.      Service Fee

Fee to be paid by ATK per month shall be US$6,417 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 3 employees
of Anam out of 7 employees working for special customer service are
exclusively assigned for the service to ATK.

13

Schedule C

GENERAL AFFAIRS (GA) SERVICES

A.      Contents of Service

This Service includes company security, employees benefits, document
control, overseas business trip control, information desk, fixed asset
control, sub-contractor control, company transportation control,
printing house, broadcasting, and related matters. Details of the
services that will be provided for ATK are as follows:

_      Manage fixed assets including allocation of equipment,
liquidation of equipment, establishment and maintenance of asset
management control system, etc;

_      Coordinate contracts for outsourcing;

_      Establish strategy for operating vehicles, cafeteria, etc;

_      Support and manage employees' overseas trip such as reservation
of air ticket and hotel, travel expenses, etc; and

_      Provide printing service using printing house in K1.

B.     Service Fee

Fee to be paid by ATK per month shall be US$29,000 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 8
employees of Anam out of 153 employees working for general affairs
service are exclusively assigned for the service to ATK.

14

Schedule D

HUMAN RESOURCE DEVELOPMENT SERVICES

A.      Contents of Service

This Service includes hiring and retirement, allocation of employees,
performance rating, promotion of employee, training and education of
employee, company regulation, and rewarding and punishment of employees.
Details of the services are as follows:

_      [Hire operators independently;]

_      [Evaluate performance of employees in connection with promotion
and reward & punishment of employees;] and

_      Establish company regulations.

Training for the employees hired for the operation of K4 shall be dome
independently by ATK at its own costs.

B.     Service Fee

Fee to be paid by ATK per month shall be US$80,083 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 18
employees of Anam out of 90 employees working for human resource
development service are exclusively assigned for the service to ATK.

15

Schedule E

EMPLOYEE-RELATED SERVICES

A.      Contents of Service

This Service includes labor strategy, employee benefits, company outdoor
program, employee health program, payroll & social security payment and
other labor-related matters. Details of the services which will be
provided to ATK are as follows:

_      Provide advice to the management of employees;

_      Manage funds for the employee benefit, decide the types and value
of the gifts and bonuses to be given to the employees; and

_      Manage employee payrolls, severance pay and the social security
payments.

B.     Service Fee

Fee to be paid by ATK per month shall be US$8,333 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 4 employees
of Anam out of 25 employees working for employee related service are
exclusively assigned for the service to ATK.

16

Schedule F

FINANCE & ACCOUNTING SERVICES

A.     Contents of Service

This Service will include following:

_      Manage funds;

_      Provide foreign exchange service relating to export and import;

_      Prepare accounting books and records for monthly closing;

_      Manage tax payment; and

_      Manage receipts and disbursements.

B.     Service Fee

Fee to be paid by ATK per month shall be US$133,083 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 9
employees of Anam out of 30 employees working for financing and
accounting services are exclusively assigned for the services to ATK.

17

Schedule G

EXPORT & IMPORT IN LOGISTICS

A.     Contents of Service

This Service will include following:

_      Support custom related services when imported materials are
transferred to ATK;

_      Select and contract with forwarders for exporting and importing;

_      Provide custom clearance and other government related services;

_      Prepare record of exporting and importing performances; and

_      Manage Anam Trade Information Service Tracking System at K4.

B.     Service Fee

Fee to be paid by ATK per month shall be US$9,833 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 3 employees
of Anam out of 14 employees working for financing and accounting
services are exclusively assigned for the services to ATK.

18

Schedule H

MATERIAL CONTROL

A.     Contents of Service

This Service will include following:

_      Die input and labeling;

_      Die receiving and inspection;

_      Manage die flow;

_      Manage material inventory and bill-back services; and

_      Manage carrying in/out of other materials and spare parts.

B.     Service Fee

Fee to be paid by ATK per month shall be US$9,670 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 4 employees
of Anam out of 74 employees working for material control service are
exclusively assigned for the service to ATK.

19

Schedule I

PURCHASING SERVICES

A.     Contents of Service

This Service will include following:

_      Establish purchasing strategy:

_      Market trend analysis (PCB, L/F, Equipment, etc);

_      Price negotiation (PCB, L/F, Equipment, etc);

_      Select supplier;

_      Follow-up monitoring (Delivery, Quality, Inventory, etc); and

_      Manage purchasing system

B.     Service Fee

Fee to be paid by ATK per month shall be US$16,830 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 8
employees of Anam out of 27 employees working for purchasing service are
exclusively assigned for the service to ATK.

20

Schedule J

R&D SERVICES

A.     Contents of Service

This Service will include following:

_      Manages Technology Information Management System;

_      Produce technology engineering report, and hold technology
related seminars;

_      Develop new package design and run simulations

_      Develop direct/indirect material and support suppliers of ATK;

_      Support K4 plant for its new package line-up; and

_      License relevant patent to ATK;

B.     Service Fee

Fee to be paid by ATK per month shall be US$63,083 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 24
employees of Anam out of 102 employees working for R&D service are
exclusively assigned for the service to ATK.

21

Schedule K

QA SUPPORTING SERVICES

A.     Contents of Service

This Service includes will include following:

_      Material and Die incoming quality assurance;

_      Conduct an audit for suppliers;

_      Conduct reliability test for the finished goods; and

_      Quality related specification and document control.

B.     Service Fee

Fee to be paid by ATK per month shall be US$32,920 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 16
employees of Anam out of 80 employees working for QA supporting service
are exclusively assigned for the service to ATK.

22

Schedule L

CUSTOMER SERVICES

A.     Contents of Service

This Service includes direct communication with customer and providing
data that customer has requested. Details of the services are as
follows:

_      Customer resident support;

_      Sales support (billing service, new customer service
representative training, etc);

_      Manufacturing monitoring (On-time delivery monitoring, emergency
lot control, hand-carry service, etc); and

_      Follow-up "Voice of Customer"

B.     Service Fee

Fee to be paid by ATK per month shall be US$23,250 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 15
employees of Anam out of 63 employees working for customer service are
exclusively assigned for the service to ATK.

23

Schedule M

SALES & MARKETING SERVICES

A.     Contents of Service

This Service is for sales and marketing in both domestic and Japan
customers. Details of the services are as follows:

_      Contract with domestic and Japan customer;

_      Produce forecast for the customer;

_      Manage delivery time and cost of products;

_      Analyze market trend and package trend; and

_      Maintain good relationships with customers.

B.     Service Fee

Fee to be paid by ATK per month shall be US$17,583 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 7
employees of Anam out of 23 employees working for sales and marketing
service are exclusively assigned for the service to ATK.

24

Schedule N

PRODUCTION PLANNING SERVICES

A.     Contents of Service

This Service includes the following:

_      Produce overall production volume forecasts and conduct
performance control;

_      Produce summary sheets of manpower and equipment efficiency;

_      Control capacity and material usage;

_      Control plant lay-out;

_      Support expatriates support (housing, vehicles, tax, etc);

_      Conduct cost control:

- ABC (Activity Based Costing)
- Produce cost modeling
- Generate line cost and P&L by PKG, plant, company
- Calculate and analyze average sales price; and

_      Select equipment and demonstration of new equipment

_      Manage overall "Suggestion Program";

_      Manage and support ATK's "Small Group Activity" and "Improvement
Team Activities";

_      Improve working environment and minimize loss or rejection in
production line;

_      Manage the Product Data Base; and

_      Enter orders (pin count updates, registration of a new package)

B.     Service Fee

25

Fee to be paid by ATK per month shall be US$37,830 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 11
employees of Anam out of 33 employees working for production planning
service are exclusively assigned for the service to ATK.

26

Schedule O

ICS SERVICES

A.     Contents of Service

This Service includes the following:

_      Develop all the information and technology programs for the
plant;

_      Develop and establish inter-company networking system- Notes
System (e-mail, information sharing system);

_      Select hardware (PC, Server, Video conference equipment, etc) and
maintain the hardware;

_      Select software for the office users; and

_      Maintain telecommunications system.

B.     Service Fee

Fee to be paid by ATK per month shall be US$182,417 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 15
employees of Anam out of 51 employees working for ICS service are
exclusively assigned for the service to ATK.

27

Schedule P

MANAGEMENT ASSISTANCE SERVICES

A.     Contents of Service

This Service includes the following:

_      Provide financial management, including overall management of
financial matters, including contacts with the creditor banks and
development of the financial policies.

_      Coordinate public relations with public media, such as
newspapers, magazines and broadcasting companies, publication of
monthly corporate magazine for Anam's and ATK's employees and
coordination of CI ("Corporate Identity") project.

_      Provide support for the senior management of Anam and ATK.

_      Provide construction, environment and safety management services
in connection with the management of environment and construction
of K4.

B.     Service Fee

Fee to be paid by ATK per month shall be US$60,916 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 15
employees of Anam out of 46 employees working for management support
service are exclusively assigned for the service to ATK.

28

Schedule Q

SECRETARIAL SUPPORT

A.     Contents of Service

This Service includes the following:

_      Provide secretarial support for the senior management of Anam and
ATK, including the Chairman of Anam.

_      Provide assistance and coordination services among Anam, Anam USA
and ATI.

B.     Service Fee

Fee to be paid by ATK per month shall be US$27,666 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 4
employees of Anam out of 12 employees working for secretarial support
are exclusively assigned for the service to ATK.

1
Exhibit 23.1

CONSENT OF INDEPENDENT PUBLIC ACCOUNTANTS

We hereby consent to the inclusion of this Current Report on Form 8-K of Amkor
Technology, Inc. (the "Company") of our report dated February 10, 1999 except
for Note 4 as to which the date is March 18, 1999 (the "Report"), which contains
explanatory paragraphs on the Kwangju Packaging Business' dependence on support
from Amkor Technology Inc., the Kwangju Packaging Business' operations affected
by unstable economy in Asia Pacific region and "Workout Program" of Anam
Semiconductor Inc. on our audits of the carved out financial statements of the
Kwangju Packaging Business of Anam Semiconductor Inc. We also hereby consent to
the incorporation of our Report included in this Form 8-K into the Company's
previously filed Registration Statement on Form S-8 (No. 333-62891).

SAMIL ACCOUNTING CORPORATION

May 28, 1999
Seoul, Korea

1
Exhibit 99.2

AMKOR TECHNOLOGY                                                    NEWS RELEASE

Contact: Jeffrey Luth
VP Investor Relations
Amkor Technology, Inc.
ext. 5613

AMKOR TECHNOLOGY COMPLETES ACQUISITION OF K4 PACKAGING PLANT
AMKOR NOW OWNS PREMIER SEMICONDUCTOR PACKAGING COMPLEX

West Chester, PA - May 17, 1999 - Amkor Technology, Inc. (Nasdaq:AMKR) said
today that it has completed the acquisition of the K4 semiconductor packaging
plant from Anam Semiconductor, Inc. for approximately $582 million, including
the assumption of $7 million in employee benefit liabilities. The transaction
was funded with the proceeds of Amkor's recently completed offering of $625
million in long term debt.

With more than 1,000,000 square feet of total facility space, and nearly 800,000
square feet of manufacturing / administrative space, K4 is one of the world's
largest semiconductor packaging plants. Located on a 100-acre site in Kwangju,
South Korea, K4 has the infrastructure already in place to accommodate an
additional 1.6 million square feet of manufacturing space when fully expanded.

"Amkor's ownership of this world class facility has important strategic
benefits," said Amkor's President, John Boruch. "Often referred to as a
city-in-a-city, K4 is a state-of-the-art, fully expandable complex that
assembles some of the most technologically advanced semiconductor devices in the
world, including many of our advanced leadframe and laminate package products.
According to industry analysts, the market for laminate package products is
projected to experience significant growth over the next several years due to
the ongoing miniaturization of semiconductor design and increasing integration
of functions within a package. We expect Amkor to be a significant participant
in that market growth as it develops," added Mr. Boruch

"K4's existing physical plant, together with its fully-expandable configuration,
provides Amkor with the capability to accommodate the rapidly growing needs of
the marketplace for advanced semiconductor packaging products," continued Mr.
Boruch. "We are delighted to welcome the more than 1700 highly trained employees
of K4 into the Amkor family."

-more-

2

"With the acquisition of K4, Amkor now owns and operates four packaging and test
factories, including three in the Philippines," noted Mr. Boruch. "While we will
continue to subcontract a sizable portion of our packaging and test business
under a long-term supply agreement with Anam Semiconductor, the acquisition of
K4 puts more of our revenue within our wholly owned factories. As production
volume at K4 continues to ramp, we expect to increase our manufacturing margins,
since the gross margin on K4-derived revenue will no longer be subject to the
contractual limitations of the supply agreement."

"While we are incurring considerable interest expense with this acquisition, K4
is expected to be a substantial contributor to Amkor's EBITDA during 1999,"
continued Mr. Boruch.

Amkor's Executive Vice President, Michael D. O'Brien, will have overall
responsibility for Amkor Technology Korea. Dan Sparks joins Amkor Technology
Korea as Director of Finance. Mr. Sparks will be based in Kwangju and will be
responsible for managing the development of financial accounting and reporting
systems at K4.

The K4 facility opened in 1996 and commenced volume production in 1997. K4 has
been building manufacturing volume throughout 1997 and 1998, during which time
several of the world's leading semiconductor companies have qualified K4 for
package production. Amkor expects to accelerate the ramp up of production at K4
during the next 12 to 24 months to meet projected market requirements.

Amkor Technology, Inc. is the world's largest provider of contract semiconductor
packaging and test services. The company offers a complete set of semiconductor
services including deep submicron wafer fabrication, wafer probe testing, IC
packaging assembly and design, final testing, burn-in, characterization and
reliability testing. More information on Amkor Technology, Inc. is available
from the company's SEC filings and on Amkor's web site, http://www.amkor.com.
Amkor is traded on the Nasdaq Stock Market under the symbol AMKR.

The statements in this news release may contain forward-looking statements -
such as (1) the belief that the market for laminate products is expected to
experience significant growth over the next several years; (2) the expectation
that Amkor will be a significant participant in the market growth for laminate
products; (3) the expectation that Amkor will increase manufacturing margins at
K4; (4) the expectation that K4 will be a significant contributor to Amkor's
EBITDA during 1999; and (5) we will accelerate the ramp up of production at K4
during the next 12 to 24 months - that involve risks and uncertainties that
could cause actual results to differ from anticipated results. Further
information on risk factors that could affect the company's results is detailed
in the company's filings with the Securities and Exchange Commission, including
the Report on Form 10-K for the fiscal year ended December 31, 1998.

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